CA1216822A - Electrotreating cell - Google Patents
Electrotreating cellInfo
- Publication number
- CA1216822A CA1216822A CA000444547A CA444547A CA1216822A CA 1216822 A CA1216822 A CA 1216822A CA 000444547 A CA000444547 A CA 000444547A CA 444547 A CA444547 A CA 444547A CA 1216822 A CA1216822 A CA 1216822A
- Authority
- CA
- Canada
- Prior art keywords
- corridor
- strip
- electrolyte
- electrotreating
- corridors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Abstract
ABSTRACT OF THE DISCLOSURE
The invention is directed to an electrotreating apparatus, wherein the strip passes through a corridor of an electrotreating cell.
Electrolyte is caused to flow through the corridor and overflow into a collector tank for recycle. Electrode replacement is facilitated by inserting the electrodes from the outside through holes in the walls of the corridor. Proper sealing of such electrodes is achieved by utilizing an electrode with a T-shape cross-section, in which the top of the T is a flange for exerting a liquid-tight sealing force against the outer surface of the corridor wall, while the vertical portion of the T comprises that part of the electrode which is inserted into the hole in the corridor wall.
The invention is directed to an electrotreating apparatus, wherein the strip passes through a corridor of an electrotreating cell.
Electrolyte is caused to flow through the corridor and overflow into a collector tank for recycle. Electrode replacement is facilitated by inserting the electrodes from the outside through holes in the walls of the corridor. Proper sealing of such electrodes is achieved by utilizing an electrode with a T-shape cross-section, in which the top of the T is a flange for exerting a liquid-tight sealing force against the outer surface of the corridor wall, while the vertical portion of the T comprises that part of the electrode which is inserted into the hole in the corridor wall.
Description
:~2168ZZ
ELECTROTREATIN~ CEL~
The present invention relates to electro-treating cells.
In the electrotreating (e.g. plating, cleaning, pickling) of metal strip, the most widely used system employs what may be termed a conventional vertical pass method in which the metal strip enters a tank by passing over a roll, is fed downward through the bottom of the tank where another roll is located, is then wrapped around this bottom roll or sink roll, and fed vertically upward until it exits from the tank over a roll in the same manner as it entered The geometry employed in such conventional vertical systems is such that a relatively great distance between the strip and the electrodes is required, thus necessitating high voltages for relatively small current densities. This, in turn, requires either extremely expensive direct current power supplies or a reduction in the amount of current utilized, conse~uently limiting the speed and productivity of the , i :~LZ~6822 electrotreating process. In addition to the spacing employed, the maximum currents which can be applied are also limited by the small amount of turbulence in the electrolyte, resulting in the inhibition ~concentration polarization) of the rate at which the electrotreating process can be effected. To overcome these limitations of the conventional vertical cell, the art has resorted to what may be termed horizontal plating cells, see for example U.S. Patents 3,471,375, 3,616,426 and 3,718,547, wherein the strip is passed horizontally between a pair of closely spaced electrodes housed in the tube-like conduit through which electrolyte is pumped at a high turbulence to overcome concentration polarization limitations. Such horizontal systems have overcome the above-mentioned difficulties inherent in the conventional vertical systems. Nevertheless, since such horizontal systems require a rather radical departure from the conventional vertical tanks, and require significant capital expenditures in removing the vertical tanks and installing completely new apparatus, most facilities still employ such conventional vertical pass systems. The efficiency and high production rates of the horizontal pass systems can also be achieved in a vertical pass system, somewhat analogous to that sho~n in U.S. Patents
ELECTROTREATIN~ CEL~
The present invention relates to electro-treating cells.
In the electrotreating (e.g. plating, cleaning, pickling) of metal strip, the most widely used system employs what may be termed a conventional vertical pass method in which the metal strip enters a tank by passing over a roll, is fed downward through the bottom of the tank where another roll is located, is then wrapped around this bottom roll or sink roll, and fed vertically upward until it exits from the tank over a roll in the same manner as it entered The geometry employed in such conventional vertical systems is such that a relatively great distance between the strip and the electrodes is required, thus necessitating high voltages for relatively small current densities. This, in turn, requires either extremely expensive direct current power supplies or a reduction in the amount of current utilized, conse~uently limiting the speed and productivity of the , i :~LZ~6822 electrotreating process. In addition to the spacing employed, the maximum currents which can be applied are also limited by the small amount of turbulence in the electrolyte, resulting in the inhibition ~concentration polarization) of the rate at which the electrotreating process can be effected. To overcome these limitations of the conventional vertical cell, the art has resorted to what may be termed horizontal plating cells, see for example U.S. Patents 3,471,375, 3,616,426 and 3,718,547, wherein the strip is passed horizontally between a pair of closely spaced electrodes housed in the tube-like conduit through which electrolyte is pumped at a high turbulence to overcome concentration polarization limitations. Such horizontal systems have overcome the above-mentioned difficulties inherent in the conventional vertical systems. Nevertheless, since such horizontal systems require a rather radical departure from the conventional vertical tanks, and require significant capital expenditures in removing the vertical tanks and installing completely new apparatus, most facilities still employ such conventional vertical pass systems. The efficiency and high production rates of the horizontal pass systems can also be achieved in a vertical pass system, somewhat analogous to that sho~n in U.S. Patents
2,317,242 and 2,673,836, by a modification of the apparatus shown therein to enable the use of insoluble ~LZ~6822 electrodes which may be accurately and closely spaced from the strip surface (e.g. about 1/4 to 1 1/2 inches (6 to 38 mm)) to increase the efficiency of the electrotreating process and may readily be removed, reconditioned and reinserted, so as to maintain such requisite close spacing. These attributes of the new electrodes also make them applicable to horizontal-type plating cells.
According to the present invention, there is provided an aparatus for the electrotreating of an extended length of metal strip, comprising a tube-like electrolyte corridor, means for directing the strip into the inlet of said corridor, means for directing the strip from the outlet of said corridor, means for supplying an electrotreating current to said strip, and means for flowing electrolyte through said corridor, said means for supplying an electrotreating current including electrodes inserted into holes in the corridor walls from the outer surface of said walls, each of said electrodes having an outer flange portion in liquid-tight sealing engagement with the outer surface of the corridor wall and an inner portion inserted into the wall hole with the inner electrode face substantially flush with the inner surface of the corridor wall and with the ele~trode surface adjacent to said inner electrode face in liquid-tight engagement with the hole.
The invention is further described, by way of example, with reference to the accompanying drawings, in which:
Figure 1 is a cross-section of a vertical electrotreating cell embodying the present invention, Figure 2 is an enlarged perspective drawing of a T-shaped electrode similar to those shown in Figure 1, Figure 3 is a cross-section through an electrode similar to those shown in Figures 1 and 2, showing one means by which such electrodes may be mounted~ and Figure 4 is a diagrammatic view of a horizontal-type electrotreating cell embodying the present invention.
Referring to Figure 1, the apparatus has a piping system 2 which circulates electrolyte into a tank 3, up through two tube-like electrotreating corridors 4 and 4', through overflows 5 and 5', and into a collector tank 6 for return to a reservoir.
Strip 7 enters the apparatus by initially being wrapped around conductor roll 8 and thereafter passing into the flow channel of corridor 4, the walls of which can be made of metal, plastics-type materials, or any other material compatible with the electrolyte being employed. On each side of the corridor is an opening wherein a T-shaped electrode 9 is placed, preferably in staggered relationship to that on the opposite wall.
:ILZ~l6822 Such staggering is particularly desirable for electrodeposition processes so as to prevent one anode from becoming more negative relative to that directly opposite, thus causing electrodeposition to occur on the lower potential anode. The strip then passes around a sink roll 10 and enters the corridor 4'.
After its upward passage through corridor ~', any contaminants on the strip are removed by sprays 11. To prevent arcing from damaging the strip, hold-down roll 12 may be placed slightly below the tangent point at where the strip contacts a second conductor roll 8'.
It is well known that various alternatives are available for conducting electricity into and away from the strip. For example, if the apparatus were to be utilized solely for electrolytic cleaning or pickling, electrodes in the down-pass (or the up-pass) could be made either positive or negative with respect to the strip, depending on the polarity of the conductor rolls which impart the same polarity to the strip. Strip polarity can also be varied in either flow channel by varying th~ connections from the power supply. In an electroplating mode, the conductor roll and strip would be made cathodic (negative polarity) with respect to the electrodes. While the use of conductor rolls for making direct electrical contact with the strip is preferable for high current density electrotreating processes, i.e. current densities in excess of 500 3LZ~6~2Z
amps/ft.2 (5382 amps/m2), it should be recognized that the use of conductor rolls are not essential and that current transfer to the strip can be effected by what has been termed bi-polar electrolyzing (see for example U.S. Patent 2,165,326) in which transfer may be effected from an electrode of one polarity, through the electrolyte to the strip and again through the electrolyte to an electrode of opposite polarity.
Referring to Figures 2 and 3, the electrode 9 comprises an inner portion 14 for insertion in liquid-tight engagement with surfaces 15 of a hole in the wall of the corridor 4, and an outer, flange portion 16 for sealing against the outer wall surface 4O of the corridor wall. A bus bar 17, made, for example, from copper, may be integrally cast in the electrode body. Such integral casting provides both better mechanical and electrical contact than would be achieved by the conventional manner of bolting the bus bar to the electrode. To prevent perturbation in the flow of the electrolyte through the corridor 4, the inner electrode face 14i desirably will be designed so as to fit flush with inner wall face 4i. To achieve desired liquid-tight sealing, a bracket 18 may be employed in conjunction with anchoring screws 19 which urge the flange portion 16 either directly against outer wall 40 or against a packing 20 to seal and insulate the flange portion from cell wall. In :~LZ1~8Z2 addition to improved sealing and the ease of electrical connection permitted by use of the flange portion 16, the larger, external surface also permits enhanced electrode cooling by natural convection, with or without the use of cooling fins, or by conductive cooling with a fluid heat transfer medium.
The T-shaped electrodes may also be utilized in a substantially horizontal-type electrotreating cell, such as in a system specifically designed for the plating of TFS-type coatings, described in ASTM
657-74. Although it will generally not be necessary for such a cell to deviate to a significant extent from the horizontal, it should be understood that the invention is applicable to tilted cells. Thus, such ~substantially horizontal~ cells can deviate from the horizontal by as much as plus or minus ~0. The plating and rinsing sections of such a system are shown in Figure 4. Strip 21 passes between conductor roll 22 and hold-down roll 23. Proper pass-line orientation of the strip into and out of the flow channel of corridor 24 is achieved by pass-line deflector rolls 25 and 26.
Electrolyte is directed at high velocity through corridor 24, by means of headers 27. After passing lips 28, the exiting electrolyte strikes deflector 29 and is thereby directed to the bottom of tank 30 which serves as a reservoir for the electrolyte fed to the headers by piping tnot shown). Electrodes 31 are : - 7 ::a2:L~; 512~2 placed on each side of the corridor in substantially the same manner shown in Figure 1. When the apparatus is specifically designed for plating, the electrodes (anodes) are staggered to prevent plating onto the anode with the lower potential. Direction of strip travel is changed by sink roll 32, after which the strip exits tank 30 and passes between conductor roll 33 and hold-down roll 34. Thereafter, rinsing of the plated strip is accomplished, either by sprays 35 or simply by immersion in rinse solution maintained in rinse tank 36, or by a combination of both. If immersion is the only rinse utilized, a series of such rinse tanks will normally be employed to achieve adequate rinsing of both faces of the strip.
Although the benefits of the invention are applicable to horizontal-type electrotreating cells utilizing various electrolyte flow patterns, e.g. in which electrolyte is flowed counter-current to or perpendicular to strip travel, the co-current electrolyte flow shown in Figure 4 is preferred to permit adequate flushing of gases formed during plating, thereby reducing solution resistivity and consequently the power required for such plating. A
further preferred feature of the apparatus shown in Figure 4 is the use of the lips 28 near the exit end of the corridor, which lips project from the inner surface of the corridor walls into the flow channel. Although ~Z11 6~Z2 placed on each side of the corridor in substantially the same manner shown in Figure 1. When the apparatus is specifically designed for plating, the electrodes (anodes) are staggered to prevent plating onto the anode with the lower potential. Direction o~ strip travel is changed by sink roll 32, after which the strip exits tank 30 and passes between conductor roll 33 and hold-down roll 34. Thereafter, rinsing of the plated strip is accomplished, either by sprays 35 or simply by immersion in rinse solution maintained in rinse tank 36, or by a combination of both. If immersion is the only rinse utilized, a series of such rinse tanks will normally be employed to achieve adequate rinsing of both faces of the stripO
Although the benefits of the invention are applicable to horizontal-type electrotreating cells utilizing various electrolyte flow patterns, e.g. in which electrolyte is flowed counter-current to or perpendicular to strip travel, the co-current electrolyte flow shown in Figure 4 is preferred to permit adequate flushing of gases formed during plating, thereby reducing solution resistivity and consequently the power required for such plating. A
further preferred eature of the apparatus shown in Figure 4 is the use of the lips 28 near the exit end of the corridor, which lips project from the inner surface of the corridor walls into the flow channel. Although _ g _ ~216~Z;2 such lips are constructed so as not to contact the strip (spacing between the lip extremities will generally vary from 3/8 to 3/4 inch (10 to 19 mm), preferably 3/8 to 1/2 inch (10 to 13 mm) for corridors having a 7/8 to 1.5 inch (22 to 38 mm) flow channel), it was found that they nevertheless promote, possibly as a result of hydrodynamic pressure, noticeable stabilization of the strip pass line. Such stabilization is even further improved when the lips are inclined in the direction of strip movement as shown.
According to the present invention, there is provided an aparatus for the electrotreating of an extended length of metal strip, comprising a tube-like electrolyte corridor, means for directing the strip into the inlet of said corridor, means for directing the strip from the outlet of said corridor, means for supplying an electrotreating current to said strip, and means for flowing electrolyte through said corridor, said means for supplying an electrotreating current including electrodes inserted into holes in the corridor walls from the outer surface of said walls, each of said electrodes having an outer flange portion in liquid-tight sealing engagement with the outer surface of the corridor wall and an inner portion inserted into the wall hole with the inner electrode face substantially flush with the inner surface of the corridor wall and with the ele~trode surface adjacent to said inner electrode face in liquid-tight engagement with the hole.
The invention is further described, by way of example, with reference to the accompanying drawings, in which:
Figure 1 is a cross-section of a vertical electrotreating cell embodying the present invention, Figure 2 is an enlarged perspective drawing of a T-shaped electrode similar to those shown in Figure 1, Figure 3 is a cross-section through an electrode similar to those shown in Figures 1 and 2, showing one means by which such electrodes may be mounted~ and Figure 4 is a diagrammatic view of a horizontal-type electrotreating cell embodying the present invention.
Referring to Figure 1, the apparatus has a piping system 2 which circulates electrolyte into a tank 3, up through two tube-like electrotreating corridors 4 and 4', through overflows 5 and 5', and into a collector tank 6 for return to a reservoir.
Strip 7 enters the apparatus by initially being wrapped around conductor roll 8 and thereafter passing into the flow channel of corridor 4, the walls of which can be made of metal, plastics-type materials, or any other material compatible with the electrolyte being employed. On each side of the corridor is an opening wherein a T-shaped electrode 9 is placed, preferably in staggered relationship to that on the opposite wall.
:ILZ~l6822 Such staggering is particularly desirable for electrodeposition processes so as to prevent one anode from becoming more negative relative to that directly opposite, thus causing electrodeposition to occur on the lower potential anode. The strip then passes around a sink roll 10 and enters the corridor 4'.
After its upward passage through corridor ~', any contaminants on the strip are removed by sprays 11. To prevent arcing from damaging the strip, hold-down roll 12 may be placed slightly below the tangent point at where the strip contacts a second conductor roll 8'.
It is well known that various alternatives are available for conducting electricity into and away from the strip. For example, if the apparatus were to be utilized solely for electrolytic cleaning or pickling, electrodes in the down-pass (or the up-pass) could be made either positive or negative with respect to the strip, depending on the polarity of the conductor rolls which impart the same polarity to the strip. Strip polarity can also be varied in either flow channel by varying th~ connections from the power supply. In an electroplating mode, the conductor roll and strip would be made cathodic (negative polarity) with respect to the electrodes. While the use of conductor rolls for making direct electrical contact with the strip is preferable for high current density electrotreating processes, i.e. current densities in excess of 500 3LZ~6~2Z
amps/ft.2 (5382 amps/m2), it should be recognized that the use of conductor rolls are not essential and that current transfer to the strip can be effected by what has been termed bi-polar electrolyzing (see for example U.S. Patent 2,165,326) in which transfer may be effected from an electrode of one polarity, through the electrolyte to the strip and again through the electrolyte to an electrode of opposite polarity.
Referring to Figures 2 and 3, the electrode 9 comprises an inner portion 14 for insertion in liquid-tight engagement with surfaces 15 of a hole in the wall of the corridor 4, and an outer, flange portion 16 for sealing against the outer wall surface 4O of the corridor wall. A bus bar 17, made, for example, from copper, may be integrally cast in the electrode body. Such integral casting provides both better mechanical and electrical contact than would be achieved by the conventional manner of bolting the bus bar to the electrode. To prevent perturbation in the flow of the electrolyte through the corridor 4, the inner electrode face 14i desirably will be designed so as to fit flush with inner wall face 4i. To achieve desired liquid-tight sealing, a bracket 18 may be employed in conjunction with anchoring screws 19 which urge the flange portion 16 either directly against outer wall 40 or against a packing 20 to seal and insulate the flange portion from cell wall. In :~LZ1~8Z2 addition to improved sealing and the ease of electrical connection permitted by use of the flange portion 16, the larger, external surface also permits enhanced electrode cooling by natural convection, with or without the use of cooling fins, or by conductive cooling with a fluid heat transfer medium.
The T-shaped electrodes may also be utilized in a substantially horizontal-type electrotreating cell, such as in a system specifically designed for the plating of TFS-type coatings, described in ASTM
657-74. Although it will generally not be necessary for such a cell to deviate to a significant extent from the horizontal, it should be understood that the invention is applicable to tilted cells. Thus, such ~substantially horizontal~ cells can deviate from the horizontal by as much as plus or minus ~0. The plating and rinsing sections of such a system are shown in Figure 4. Strip 21 passes between conductor roll 22 and hold-down roll 23. Proper pass-line orientation of the strip into and out of the flow channel of corridor 24 is achieved by pass-line deflector rolls 25 and 26.
Electrolyte is directed at high velocity through corridor 24, by means of headers 27. After passing lips 28, the exiting electrolyte strikes deflector 29 and is thereby directed to the bottom of tank 30 which serves as a reservoir for the electrolyte fed to the headers by piping tnot shown). Electrodes 31 are : - 7 ::a2:L~; 512~2 placed on each side of the corridor in substantially the same manner shown in Figure 1. When the apparatus is specifically designed for plating, the electrodes (anodes) are staggered to prevent plating onto the anode with the lower potential. Direction of strip travel is changed by sink roll 32, after which the strip exits tank 30 and passes between conductor roll 33 and hold-down roll 34. Thereafter, rinsing of the plated strip is accomplished, either by sprays 35 or simply by immersion in rinse solution maintained in rinse tank 36, or by a combination of both. If immersion is the only rinse utilized, a series of such rinse tanks will normally be employed to achieve adequate rinsing of both faces of the strip.
Although the benefits of the invention are applicable to horizontal-type electrotreating cells utilizing various electrolyte flow patterns, e.g. in which electrolyte is flowed counter-current to or perpendicular to strip travel, the co-current electrolyte flow shown in Figure 4 is preferred to permit adequate flushing of gases formed during plating, thereby reducing solution resistivity and consequently the power required for such plating. A
further preferred feature of the apparatus shown in Figure 4 is the use of the lips 28 near the exit end of the corridor, which lips project from the inner surface of the corridor walls into the flow channel. Although ~Z11 6~Z2 placed on each side of the corridor in substantially the same manner shown in Figure 1. When the apparatus is specifically designed for plating, the electrodes (anodes) are staggered to prevent plating onto the anode with the lower potential. Direction o~ strip travel is changed by sink roll 32, after which the strip exits tank 30 and passes between conductor roll 33 and hold-down roll 34. Thereafter, rinsing of the plated strip is accomplished, either by sprays 35 or simply by immersion in rinse solution maintained in rinse tank 36, or by a combination of both. If immersion is the only rinse utilized, a series of such rinse tanks will normally be employed to achieve adequate rinsing of both faces of the stripO
Although the benefits of the invention are applicable to horizontal-type electrotreating cells utilizing various electrolyte flow patterns, e.g. in which electrolyte is flowed counter-current to or perpendicular to strip travel, the co-current electrolyte flow shown in Figure 4 is preferred to permit adequate flushing of gases formed during plating, thereby reducing solution resistivity and consequently the power required for such plating. A
further preferred eature of the apparatus shown in Figure 4 is the use of the lips 28 near the exit end of the corridor, which lips project from the inner surface of the corridor walls into the flow channel. Although _ g _ ~216~Z;2 such lips are constructed so as not to contact the strip (spacing between the lip extremities will generally vary from 3/8 to 3/4 inch (10 to 19 mm), preferably 3/8 to 1/2 inch (10 to 13 mm) for corridors having a 7/8 to 1.5 inch (22 to 38 mm) flow channel), it was found that they nevertheless promote, possibly as a result of hydrodynamic pressure, noticeable stabilization of the strip pass line. Such stabilization is even further improved when the lips are inclined in the direction of strip movement as shown.
Claims (9)
1. An apparatus for the electrotreating of an extended length of metal strip, comprising a tube-like electrolyte corridor, means for directing the strip into the inlet of said corridor, means for directing the strip from the outlet of said corridor, means for supplying an electrotreating current to said strip, and means for flowing electrolyte through said corridor, said means for supplying an electrotreating current including electrodes inserted into holes in the corridor walls from the outer surface of said walls, each of said electrodes having an outer flange portion in liquid-tight sealing engagement with the outer surface of the corridor wall and an inner portion inserted into the wall hole with the inner electrode face substantially flush with the inner surface of the corridor wall and with the electrode surface adjacent to said inner electrode face in liquid-tight engagement with the hole.
2. An apparatus as claimed in claim 1, in which the corridor is 1/2 to 3 inches (13 to 76 mm) wide.
3. An apparatus as claimed in claim 1, in which said electrode flange portion and inner portion are cast, an integral unit, around a bus-bar for contact to a power source.
4. An apparatus as claimed in claim 1, in which said corridor is substantially horizontal and the electrolyte inlet and outlet are proximate to said strip inlet and outlet, so that the electrolyte flows co-current with the strip.
5. An apparatus as claimed in claim 4, in which said corridor, proximate the electrolyte outlet end thereof, has upper and lower lips projecting from the respective corridor wall inner surfaces towards the opposing faces of the strip.
6. An apparatus as claimed in claim 5, in which the lips are inclined in the direction of strip movement and the spacing between the adjacent lip extremities is 3/8 to 3/4 inch (10 to 19mm).
7. An apparatus as claimed in claim 1, in which the apparatus has two tube-like electrolyte corridors which are supported with their axes substantially vertical above an electrolyte tank, the means for directing the strip into and out of the corridors comprises an ingress roll over which the strip passes prior to its downward passage through one of said corridors, a sink-roll around which the strip passes prior to its entrance into the lower portion of the second of said corridors, and an egress roll over which the strip passes after its passage through the second corridor, and the means for flowing electrolyte includes an overflow system for carrying electrolyte from the upper portions of said corridors back to said electrolyte tank.
8. An apparatus as claimed in claim 7, in which said overflow system includes piping from carrying electrolyte back to said tank while preventing contact of the electrolyte with the corridor wall outer surfaces.
9. An apparatus as claimed in claim 7, in which said ingress and egress rolls are connected to a power source so as to serve as conductor rolls.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE0/212249A BE898723A (en) | 1984-01-20 | 1984-01-20 | Electrolytic treatment appts. - for long lengths of metal strip using tubular feed guides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1216822A true CA1216822A (en) | 1987-01-20 |
Family
ID=3843714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000444547A Expired CA1216822A (en) | 1984-01-20 | 1984-01-03 | Electrotreating cell |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS60177200A (en) |
| BE (1) | BE898723A (en) |
| CA (1) | CA1216822A (en) |
| FR (1) | FR2561267B1 (en) |
| GB (1) | GB2152532B (en) |
| NL (1) | NL192210C (en) |
| SE (1) | SE441013B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL131875C (en) * | 1964-02-04 | 1900-01-01 | Aluminium Lab Ltd | |
| DE1958598A1 (en) * | 1969-11-21 | 1971-05-27 | Siemens Ag | Electrolytic deposition of thin layer on - thin wires |
| NL177516C (en) * | 1978-09-12 | 1985-10-01 | Pidou Bv | SEALING CUFF. |
-
1984
- 1984-01-03 CA CA000444547A patent/CA1216822A/en not_active Expired
- 1984-01-11 GB GB8400600A patent/GB2152532B/en not_active Expired
- 1984-01-19 FR FR8400818A patent/FR2561267B1/en not_active Expired
- 1984-01-20 BE BE0/212249A patent/BE898723A/en unknown
- 1984-01-20 SE SE8400299A patent/SE441013B/en not_active IP Right Cessation
- 1984-02-20 JP JP2884184A patent/JPS60177200A/en active Pending
- 1984-02-29 NL NL8400653A patent/NL192210C/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| SE8400299D0 (en) | 1984-01-20 |
| GB8400600D0 (en) | 1984-02-15 |
| JPS60177200A (en) | 1985-09-11 |
| NL192210C (en) | 1997-03-04 |
| GB2152532A (en) | 1985-08-07 |
| FR2561267A1 (en) | 1985-09-20 |
| NL192210B (en) | 1996-11-01 |
| GB2152532B (en) | 1987-08-05 |
| SE8400299L (en) | 1985-07-21 |
| FR2561267B1 (en) | 1987-11-27 |
| BE898723A (en) | 1984-07-20 |
| NL8400653A (en) | 1985-09-16 |
| SE441013B (en) | 1985-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |