BRPI1105638A2 - dispositivo que possui um circuito integrado e seu mÉtodo de fabricaÇço - Google Patents
dispositivo que possui um circuito integrado e seu mÉtodo de fabricaÇço Download PDFInfo
- Publication number
- BRPI1105638A2 BRPI1105638A2 BRPI1105638-0A BRPI1105638A BRPI1105638A2 BR PI1105638 A2 BRPI1105638 A2 BR PI1105638A2 BR PI1105638 A BRPI1105638 A BR PI1105638A BR PI1105638 A2 BRPI1105638 A2 BR PI1105638A2
- Authority
- BR
- Brazil
- Prior art keywords
- module
- cavity
- strip
- integrated circuit
- adhesive
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 230000006835 compression Effects 0.000 claims abstract description 11
- 238000007906 compression Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 8
- 239000000123 paper Substances 0.000 description 7
- 239000011111 cardboard Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 230000035882 stress Effects 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011087 paperboard Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1060110A FR2968431B1 (fr) | 2010-12-06 | 2010-12-06 | Procédé de fabrication d'un dispositif a microcircuit |
Publications (3)
Publication Number | Publication Date |
---|---|
BRPI1105638A2 true BRPI1105638A2 (pt) | 2013-03-26 |
BRPI1105638B1 BRPI1105638B1 (pt) | 2020-04-22 |
BRPI1105638B8 BRPI1105638B8 (pt) | 2020-04-22 |
Family
ID=44201854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI1105638A BRPI1105638B8 (pt) | 2010-12-06 | 2011-12-06 | Mãtodo de fabricaãão de um dispositivo que possui um circuito integrado |
Country Status (8)
Country | Link |
---|---|
US (1) | US8864040B2 (pt) |
EP (1) | EP2461277B1 (pt) |
CN (1) | CN102663474B (pt) |
BR (1) | BRPI1105638B8 (pt) |
CA (1) | CA2761204C (pt) |
ES (1) | ES2751368T3 (pt) |
FR (1) | FR2968431B1 (pt) |
MX (1) | MX2011012991A (pt) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
FR2999753B1 (fr) * | 2012-12-13 | 2015-02-13 | Oberthur Technologies | Procede de fabrication par lamination en continu de cartes a microcircuit du type a contact |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
TWI635444B (zh) * | 2016-11-03 | 2018-09-11 | 動信科技股份有限公司 | Touch smart card |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
US6034427A (en) * | 1998-01-28 | 2000-03-07 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
FR2779851B1 (fr) * | 1998-06-12 | 2002-11-29 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre et carte obtenue |
FR2794266B1 (fr) * | 1999-05-25 | 2002-01-25 | Gemplus Card Int | Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout |
US6475327B2 (en) * | 2001-04-05 | 2002-11-05 | Phoenix Precision Technology Corporation | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier |
-
2010
- 2010-12-06 FR FR1060110A patent/FR2968431B1/fr active Active
-
2011
- 2011-11-30 EP EP11191349.7A patent/EP2461277B1/fr active Active
- 2011-11-30 ES ES11191349T patent/ES2751368T3/es active Active
- 2011-12-02 CA CA2761204A patent/CA2761204C/fr active Active
- 2011-12-05 MX MX2011012991A patent/MX2011012991A/es active IP Right Grant
- 2011-12-05 US US13/310,958 patent/US8864040B2/en active Active
- 2011-12-06 BR BRPI1105638A patent/BRPI1105638B8/pt active IP Right Grant
- 2011-12-06 CN CN201110408179.0A patent/CN102663474B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CA2761204A1 (fr) | 2012-06-06 |
EP2461277A1 (fr) | 2012-06-06 |
EP2461277B1 (fr) | 2019-07-24 |
CA2761204C (fr) | 2020-03-10 |
ES2751368T3 (es) | 2020-03-31 |
BRPI1105638B1 (pt) | 2020-04-22 |
US8864040B2 (en) | 2014-10-21 |
FR2968431B1 (fr) | 2012-12-28 |
BRPI1105638B8 (pt) | 2020-04-22 |
CN102663474A (zh) | 2012-09-12 |
MX2011012991A (es) | 2012-06-08 |
CN102663474B (zh) | 2017-08-22 |
FR2968431A1 (fr) | 2012-06-08 |
US20120138690A1 (en) | 2012-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 06/12/2011, OBSERVADAS AS CONDICOES LEGAIS. |
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B25F | Entry of change of name and/or headquarter and transfer of application, patent and certif. of addition of invention: change of name on requirement |
Owner name: OBERTHUR TECHNOLOGIES (FR) Free format text: A FIM DE ATENDER A ALTERACAO DE NOME REQUERIDA ATRAVES DA PETICAO NO 870230021205, DE 13/09/2023, E NECESSARIO APRESENTAR PROCURACAO COM O NOME ATUAL DA EMPRESA. ALEM DISSO, E PRECISO APRESENTAR A GUIA DE CUMPRIMENTO DE EXIGENCIA. |
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B25E | Requested change of name of applicant rejected |
Owner name: OBERTHUR TECHNOLOGIES (FR) Free format text: INDEFERIDO O PEDIDO DE ALTERACAO DE NOME CONTIDO NA PETICAO 870230021205 DE13/03/2023, POR AUSENCIA DE CUMPRIMENTO DA EXIGENCIA PUBLICADA NA RPI NO 2740, DE 11/07/2023. |
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B25D | Requested change of name of applicant approved |
Owner name: IDEMIA FRANCE (FR) |
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B25G | Requested change of headquarter approved |
Owner name: IDEMIA FRANCE (FR) |
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B25G | Requested change of headquarter approved |
Owner name: IDEMIA FRANCE (FR) |
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B15G | Petition not considered as such [chapter 15.7 patent gazette] |
Free format text: A PETICAO DE NO 870230086223, APRESENTADA EM 28/09/2023, EM VIRTUDE DO DISPOSTO NOSARTS. 218 OU 219 DA LPI (LEI 9279 / 96) DE 14/05/1996, E CONSIDERADA COMO PETICAO NAOCONHECIDA POR TER SIDO PROTOCOLADA FORA DO PRAZO LEGAL DE ATE 60 DIAS APOS A PUBLICACAO DAEXIGENCIA. |