BRPI1005918A2 - composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo - Google Patents

composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo

Info

Publication number
BRPI1005918A2
BRPI1005918A2 BRPI1005918A BRPI1005918A BRPI1005918A2 BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2 BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2
Authority
BR
Brazil
Prior art keywords
composite
resin composition
epoxy resin
curable epoxy
adhesive
Prior art date
Application number
BRPI1005918A
Other languages
English (en)
Inventor
Hunter Gary
Jacob George
Pham Ha
Turakhia Rajesh
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BRPI1005918A2 publication Critical patent/BRPI1005918A2/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5006Amines aliphatic
    • C08G59/502Polyalkylene polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI1005918A 2009-02-24 2010-02-08 composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo BRPI1005918A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15484609P 2009-02-24 2009-02-24
PCT/US2010/023432 WO2010098966A1 (en) 2009-02-24 2010-02-08 Curable epoxy resin compositions and cured products therefrom

Publications (1)

Publication Number Publication Date
BRPI1005918A2 true BRPI1005918A2 (pt) 2019-09-24

Family

ID=42077305

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1005918A BRPI1005918A2 (pt) 2009-02-24 2010-02-08 composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo

Country Status (8)

Country Link
US (1) US20120010329A1 (pt)
EP (1) EP2401314A1 (pt)
JP (1) JP2012518707A (pt)
KR (1) KR20110131222A (pt)
CN (1) CN102325821A (pt)
BR (1) BRPI1005918A2 (pt)
CA (1) CA2750703A1 (pt)
WO (1) WO2010098966A1 (pt)

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US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
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CN104812878A (zh) * 2012-10-12 2015-07-29 巴斯夫欧洲公司 包含环硼氧烷以改进含氟聚合物密封件相容性的润滑剂组合物
DE102013113465A1 (de) * 2012-12-11 2014-06-12 Fischerwerke Gmbh & Co. Kg Epoxybasierte Masse für Befestigungszwecke, deren Verwendung und die Verwendung bestimmter Komponenten
US9629254B2 (en) 2013-03-15 2017-04-18 Plasma Systems Holdings, Inc. Multi-function epoxy casting resin system
CA2865110C (en) * 2013-12-16 2021-11-09 The Boeing Company Composite structures using interpenetrating polymer network adhesives
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US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
CN107743503B (zh) * 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
CN106810820B (zh) * 2015-12-02 2020-07-28 广东生益科技股份有限公司 一种热固性烷基多元醇缩水甘油醚树脂组合物及其应用
RU2726406C2 (ru) * 2016-01-26 2020-07-14 Торэй Индастриз, Инк. Композиция эпоксидной смолы, препрег и композитный материал, армированный волокном
JP6829462B2 (ja) * 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
US11149108B1 (en) 2018-06-26 2021-10-19 National Technology & Engineering Solutions Of Sandia, Llc Self-assembly assisted additive manufacturing of thermosets
JP2021003714A (ja) * 2019-06-26 2021-01-14 国立大学法人 東京大学 線形摩擦接合方法
CN110256991B (zh) * 2019-07-12 2021-07-13 中铁第一勘察设计院集团有限公司 一种混凝土装配式桥梁专用胶及其制备方法
CN116162441B (zh) * 2023-03-29 2023-09-19 广州宝捷电子材料科技有限公司 一种复合改性环氧树脂胶粘剂及其制备方法

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Also Published As

Publication number Publication date
JP2012518707A (ja) 2012-08-16
US20120010329A1 (en) 2012-01-12
WO2010098966A1 (en) 2010-09-02
KR20110131222A (ko) 2011-12-06
EP2401314A1 (en) 2012-01-04
CA2750703A1 (en) 2010-09-02
CN102325821A (zh) 2012-01-18

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.