BRPI1005918A2 - composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo - Google Patents
composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivoInfo
- Publication number
- BRPI1005918A2 BRPI1005918A2 BRPI1005918A BRPI1005918A BRPI1005918A2 BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2 BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2
- Authority
- BR
- Brazil
- Prior art keywords
- composite
- resin composition
- epoxy resin
- curable epoxy
- adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/502—Polyalkylene polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15484609P | 2009-02-24 | 2009-02-24 | |
PCT/US2010/023432 WO2010098966A1 (en) | 2009-02-24 | 2010-02-08 | Curable epoxy resin compositions and cured products therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI1005918A2 true BRPI1005918A2 (pt) | 2019-09-24 |
Family
ID=42077305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI1005918A BRPI1005918A2 (pt) | 2009-02-24 | 2010-02-08 | composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120010329A1 (pt) |
EP (1) | EP2401314A1 (pt) |
JP (1) | JP2012518707A (pt) |
KR (1) | KR20110131222A (pt) |
CN (1) | CN102325821A (pt) |
BR (1) | BRPI1005918A2 (pt) |
CA (1) | CA2750703A1 (pt) |
WO (1) | WO2010098966A1 (pt) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2945292B1 (fr) * | 2009-05-06 | 2011-05-27 | Electricite De France | Reseau interpenetre de polymeres echangeur d'anions, son procede de fabrication et son utilisation |
WO2012082224A1 (en) * | 2010-12-17 | 2012-06-21 | Dow Global Technologies Llc | Curable compositions |
CN102558769B (zh) * | 2010-12-31 | 2015-11-25 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件 |
US20120328811A1 (en) * | 2011-06-24 | 2012-12-27 | Air Products And Chemicals, Inc. | Epoxy Resin Compositions |
US8431444B2 (en) * | 2011-08-16 | 2013-04-30 | General Electric Company | Epoxy encapsulating and lamination adhesive and method of making same |
GB201122296D0 (en) | 2011-12-23 | 2012-02-01 | Cytec Tech Corp | Composite materials |
GB201203341D0 (en) | 2012-02-27 | 2012-04-11 | Cytec Technology Group | Curable resin composition and short-cure method |
CN104812878A (zh) * | 2012-10-12 | 2015-07-29 | 巴斯夫欧洲公司 | 包含环硼氧烷以改进含氟聚合物密封件相容性的润滑剂组合物 |
DE102013113465A1 (de) * | 2012-12-11 | 2014-06-12 | Fischerwerke Gmbh & Co. Kg | Epoxybasierte Masse für Befestigungszwecke, deren Verwendung und die Verwendung bestimmter Komponenten |
US9629254B2 (en) | 2013-03-15 | 2017-04-18 | Plasma Systems Holdings, Inc. | Multi-function epoxy casting resin system |
CA2865110C (en) * | 2013-12-16 | 2021-11-09 | The Boeing Company | Composite structures using interpenetrating polymer network adhesives |
ES2842278T3 (es) * | 2014-11-03 | 2021-07-13 | Cytec Ind Inc | Unión de materiales compuestos |
US9752051B2 (en) | 2015-04-06 | 2017-09-05 | Rohm And Haas Electronic Materials Llc | Polyarylene polymers |
CN107743503B (zh) * | 2015-06-25 | 2020-03-31 | 陶氏环球技术有限责任公司 | 用于制造碳纤维复合材料的新型环氧树脂体系 |
CN106810820B (zh) * | 2015-12-02 | 2020-07-28 | 广东生益科技股份有限公司 | 一种热固性烷基多元醇缩水甘油醚树脂组合物及其应用 |
RU2726406C2 (ru) * | 2016-01-26 | 2020-07-14 | Торэй Индастриз, Инк. | Композиция эпоксидной смолы, препрег и композитный материал, армированный волокном |
JP6829462B2 (ja) * | 2017-02-21 | 2021-02-10 | ナミックス株式会社 | 液状エポキシ樹脂封止材 |
US11149108B1 (en) | 2018-06-26 | 2021-10-19 | National Technology & Engineering Solutions Of Sandia, Llc | Self-assembly assisted additive manufacturing of thermosets |
JP2021003714A (ja) * | 2019-06-26 | 2021-01-14 | 国立大学法人 東京大学 | 線形摩擦接合方法 |
CN110256991B (zh) * | 2019-07-12 | 2021-07-13 | 中铁第一勘察设计院集团有限公司 | 一种混凝土装配式桥梁专用胶及其制备方法 |
CN116162441B (zh) * | 2023-03-29 | 2023-09-19 | 广州宝捷电子材料科技有限公司 | 一种复合改性环氧树脂胶粘剂及其制备方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3018262A (en) | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
CA1221192A (en) * | 1982-08-12 | 1987-04-28 | Andrew Garton | Epoxy resin fortification |
US5260355A (en) * | 1987-07-02 | 1993-11-09 | The Dow Chemical Company | Aqueous dispersion of cationic advanced diglycidyl ether blend |
US4925901A (en) | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
GB8904862D0 (en) * | 1989-03-03 | 1989-04-12 | Ciba Geigy Ag | Compositions |
US5135993A (en) | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
US5262507A (en) | 1990-09-11 | 1993-11-16 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
CA2086770A1 (en) * | 1992-01-10 | 1993-07-11 | Jyi-Faa Hwang | Epoxy interpenetrating polymer networks having internetwork bonds |
GB9411367D0 (en) | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
JPH08165333A (ja) * | 1994-12-14 | 1996-06-25 | Sumitomo Bakelite Co Ltd | プリプレグの製造方法 |
EP0723982B1 (de) * | 1995-01-26 | 1999-06-16 | Ciba SC Holding AG | Härtbares Epoxidharzgemisch |
US5688905A (en) * | 1995-09-20 | 1997-11-18 | Air Products And Chemicals, Inc. | Primary-tertiary diamines mixed with polyamines as epoxy resin hardeners |
US6153719A (en) | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
US6248204B1 (en) * | 1999-05-14 | 2001-06-19 | Loctite Corporation | Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness |
US6632893B2 (en) | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
JP2001151862A (ja) * | 1999-11-22 | 2001-06-05 | Tosoh Corp | エポキシ樹脂組成物 |
US6572971B2 (en) | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
US6632860B1 (en) | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
GB0212062D0 (en) | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
US7163973B2 (en) | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
JP3778507B2 (ja) * | 2002-11-28 | 2006-05-24 | 横浜ゴム株式会社 | 硬化剤組成物およびそれを含有した硬化性樹脂組成物 |
US7087304B1 (en) | 2003-02-19 | 2006-08-08 | Henkel Corporation | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof |
US6887574B2 (en) | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
US8003744B2 (en) * | 2003-08-25 | 2011-08-23 | Kaneka Corporation | Curing composition with improved heat resistance |
FR2862655B1 (fr) * | 2003-11-25 | 2007-01-05 | Arkema | Fibre organique a base de resine epoxy et d'agent regulateur de rheologie et tissus correspondants |
RU2006138618A (ru) | 2004-04-02 | 2008-05-10 | Дау Глобал Текнолоджиз Инк. (Us) | Модифицированные амфифильным блок-сополимером термоотверждающиеся смолы с повышенной ударной вязкостью |
JP4679117B2 (ja) * | 2004-11-08 | 2011-04-27 | 株式会社東芝 | 防水用樹脂組成物及びそれを用いた防水金属製品 |
BRPI0516699A (pt) | 2004-11-10 | 2008-09-16 | Dow Global Technologies Inc | composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratos |
RU2388772C2 (ru) | 2004-11-10 | 2010-05-10 | Дау Глобал Текнолоджиз Инк. | Эпоксидные смолы с ударной вязкостью, повышенной с помощью амфифильного блок-сополимера, и изготовленные из них отверждаемые при обычных условиях покрытия с высоким содержанием твердого вещества |
CA2582349A1 (en) | 2004-11-10 | 2006-05-18 | Frank S. Bates | Amphiphilic block copolymer-toughened epoxy resins |
ES2338680T3 (es) | 2004-11-10 | 2010-05-11 | Dow Global Technologies Inc. | Resinas epoxidicas endurecidas con copolimeros anfifilicos de bloques y recubrimientos en polvo obtenidos a partir de ellas. |
CA2582360A1 (en) | 2004-11-10 | 2006-05-18 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
US8048819B2 (en) | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
US8536273B2 (en) * | 2005-07-15 | 2013-09-17 | Huntsman International Llc | Toughened composition |
US7737199B2 (en) * | 2007-02-15 | 2010-06-15 | Ashland Licensing & Intellectual Property Llc | Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack |
JP2009234852A (ja) * | 2008-03-27 | 2009-10-15 | Toray Ind Inc | セラミックス成形体の製造方法及びセラミックス焼結体の製造方法 |
-
2010
- 2010-02-08 CA CA2750703A patent/CA2750703A1/en not_active Abandoned
- 2010-02-08 KR KR1020117022185A patent/KR20110131222A/ko not_active Application Discontinuation
- 2010-02-08 WO PCT/US2010/023432 patent/WO2010098966A1/en active Application Filing
- 2010-02-08 EP EP10703774A patent/EP2401314A1/en not_active Withdrawn
- 2010-02-08 US US13/145,378 patent/US20120010329A1/en not_active Abandoned
- 2010-02-08 JP JP2011551113A patent/JP2012518707A/ja active Pending
- 2010-02-08 CN CN2010800088883A patent/CN102325821A/zh active Pending
- 2010-02-08 BR BRPI1005918A patent/BRPI1005918A2/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2012518707A (ja) | 2012-08-16 |
US20120010329A1 (en) | 2012-01-12 |
WO2010098966A1 (en) | 2010-09-02 |
KR20110131222A (ko) | 2011-12-06 |
EP2401314A1 (en) | 2012-01-04 |
CA2750703A1 (en) | 2010-09-02 |
CN102325821A (zh) | 2012-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |