BRPI0503900A - método e sistema para prover embalagem de dispositivo mems com vedação secundária - Google Patents
método e sistema para prover embalagem de dispositivo mems com vedação secundáriaInfo
- Publication number
- BRPI0503900A BRPI0503900A BRPI0503900-2A BRPI0503900A BRPI0503900A BR PI0503900 A BRPI0503900 A BR PI0503900A BR PI0503900 A BRPI0503900 A BR PI0503900A BR PI0503900 A BRPI0503900 A BR PI0503900A
- Authority
- BR
- Brazil
- Prior art keywords
- mems device
- device packaging
- providing secondary
- secondary sealed
- sealed mems
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Vacuum Packaging (AREA)
Abstract
"MéTODO E SISTEMA PARA PROVER EMBALAGEM DE DISPOSITIVO MEMS COM VEDAçãO SECUNDáRIA". A embalagem 70 de um dispositivo MEMS compreende um substrato 72 com um dispositivo MEMS 76 formado sobre ele, um chassi 74 e uma vedação primária 78, em que a vedação primária é posicionada entre o chassi e o substrato de modo a se encerrar e vedar a embalagem do dispositivo MEMS das condições ambientais. A embalagem do dispositivo MEMS compreende também uma vedação secundária 82 em contato pelo menos com o chassi e o substrato.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61352704P | 2004-09-27 | 2004-09-27 | |
US11/134,838 US20060076631A1 (en) | 2004-09-27 | 2005-05-20 | Method and system for providing MEMS device package with secondary seal |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0503900A true BRPI0503900A (pt) | 2006-05-09 |
Family
ID=35207576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0503900-2A BRPI0503900A (pt) | 2004-09-27 | 2005-09-27 | método e sistema para prover embalagem de dispositivo mems com vedação secundária |
Country Status (11)
Country | Link |
---|---|
US (1) | US20060076631A1 (pt) |
EP (1) | EP1640326A3 (pt) |
JP (1) | JP2006123160A (pt) |
KR (1) | KR20060092916A (pt) |
AU (1) | AU2005204263A1 (pt) |
BR (1) | BRPI0503900A (pt) |
CA (1) | CA2519484A1 (pt) |
MX (1) | MXPA05010088A (pt) |
RU (1) | RU2005129980A (pt) |
SG (1) | SG121148A1 (pt) |
TW (1) | TW200627603A (pt) |
Families Citing this family (24)
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TWI289708B (en) | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
US7342705B2 (en) | 2004-02-03 | 2008-03-11 | Idc, Llc | Spatial light modulator with integrated optical compensation structure |
US7405924B2 (en) * | 2004-09-27 | 2008-07-29 | Idc, Llc | System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
US7968426B1 (en) * | 2005-10-24 | 2011-06-28 | Microwave Bonding Instruments, Inc. | Systems and methods for bonding semiconductor substrates to metal substrates using microwave energy |
US7561334B2 (en) * | 2005-12-20 | 2009-07-14 | Qualcomm Mems Technologies, Inc. | Method and apparatus for reducing back-glass deflection in an interferometric modulator display device |
EP1979268A2 (en) | 2006-04-13 | 2008-10-15 | Qualcomm Mems Technologies, Inc. | Packaging a mems device using a frame |
FR2901639B1 (fr) * | 2006-05-24 | 2008-08-22 | Commissariat Energie Atomique | Micro-composant integre associant les fonctions de recuperation et de stockage de l'energie |
EP2029473A2 (en) * | 2006-06-21 | 2009-03-04 | Qualcomm Incorporated | Method for packaging an optical mems device |
US20080043315A1 (en) * | 2006-08-15 | 2008-02-21 | Cummings William J | High profile contacts for microelectromechanical systems |
EP1890180A1 (en) | 2006-08-15 | 2008-02-20 | STMicroelectronics (Research & Development) Limited | Lens unit |
KR101535805B1 (ko) | 2006-10-06 | 2015-07-09 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 디스플레이 장치 및 디스플레이 형성방법 |
WO2008045207A2 (en) | 2006-10-06 | 2008-04-17 | Qualcomm Mems Technologies, Inc. | Light guide |
WO2009041950A1 (en) * | 2007-09-28 | 2009-04-02 | Qualcomm Mems Technologies, Inc. | Method of manufacturing a mems package using partially reactivated desiccant |
FR2922203B1 (fr) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
US8068710B2 (en) * | 2007-12-07 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | Decoupled holographic film and diffuser |
US20090323170A1 (en) * | 2008-06-30 | 2009-12-31 | Qualcomm Mems Technologies, Inc. | Groove on cover plate or substrate |
US20100020382A1 (en) * | 2008-07-22 | 2010-01-28 | Qualcomm Mems Technologies, Inc. | Spacer for mems device |
US8379392B2 (en) * | 2009-10-23 | 2013-02-19 | Qualcomm Mems Technologies, Inc. | Light-based sealing and device packaging |
US9090456B2 (en) * | 2009-11-16 | 2015-07-28 | Qualcomm Mems Technologies, Inc. | System and method of manufacturing an electromechanical device by printing raised conductive contours |
US20130050155A1 (en) * | 2011-08-30 | 2013-02-28 | Qualcomm Mems Technologies, Inc. | Glass as a substrate material and a final package for mems and ic devices |
JP6244616B2 (ja) * | 2012-08-30 | 2017-12-13 | セイコーエプソン株式会社 | 波長可変干渉フィルター、光学モジュール、電子機器、および波長可変干渉フィルターの製造方法 |
JP6260080B2 (ja) | 2013-01-07 | 2018-01-17 | セイコーエプソン株式会社 | 波長可変干渉フィルター、波長可変干渉フィルターの製造方法、光学モジュール、及び電子機器 |
US10145739B2 (en) | 2014-04-03 | 2018-12-04 | Oto Photonics Inc. | Waveguide sheet, fabrication method thereof and spectrometer using the same |
CN109830850B (zh) * | 2019-03-29 | 2024-04-19 | 四川华丰科技股份有限公司 | 用于高速连接器的模块结构及高速连接器 |
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-
2005
- 2005-05-20 US US11/134,838 patent/US20060076631A1/en not_active Abandoned
- 2005-08-26 AU AU2005204263A patent/AU2005204263A1/en not_active Abandoned
- 2005-08-29 TW TW094129533A patent/TW200627603A/zh unknown
- 2005-09-14 CA CA002519484A patent/CA2519484A1/en not_active Abandoned
- 2005-09-14 EP EP05255660A patent/EP1640326A3/en not_active Withdrawn
- 2005-09-16 SG SG200505988A patent/SG121148A1/en unknown
- 2005-09-21 MX MXPA05010088A patent/MXPA05010088A/es not_active Application Discontinuation
- 2005-09-26 RU RU2005129980/28A patent/RU2005129980A/ru not_active Application Discontinuation
- 2005-09-27 JP JP2005279055A patent/JP2006123160A/ja active Pending
- 2005-09-27 KR KR1020050089830A patent/KR20060092916A/ko not_active Application Discontinuation
- 2005-09-27 BR BRPI0503900-2A patent/BRPI0503900A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU2005204263A1 (en) | 2006-04-13 |
US20060076631A1 (en) | 2006-04-13 |
SG121148A1 (en) | 2006-04-26 |
EP1640326A2 (en) | 2006-03-29 |
RU2005129980A (ru) | 2007-04-10 |
MXPA05010088A (es) | 2006-04-27 |
JP2006123160A (ja) | 2006-05-18 |
EP1640326A3 (en) | 2008-04-02 |
CA2519484A1 (en) | 2006-03-27 |
KR20060092916A (ko) | 2006-08-23 |
TW200627603A (en) | 2006-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |