BR9713942A - Composição adesiva condutiva anisotrópica termicamente reprocessável, e, processo para a ligação de um componente a um substrato - Google Patents
Composição adesiva condutiva anisotrópica termicamente reprocessável, e, processo para a ligação de um componente a um substratoInfo
- Publication number
- BR9713942A BR9713942A BR9713942A BR9713942A BR9713942A BR 9713942 A BR9713942 A BR 9713942A BR 9713942 A BR9713942 A BR 9713942A BR 9713942 A BR9713942 A BR 9713942A BR 9713942 A BR9713942 A BR 9713942A
- Authority
- BR
- Brazil
- Prior art keywords
- substrate
- reprocessing
- bonding
- component
- adhesive composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Abstract
MENTE REPROCESSáVEL, E, PROCESSO PARA A LIGAçãO DEmente reprocessável para ligar um dispositivo semicondutor a um substrato. A composição compreende (a) uma resina reticulada termicamente reprocessável produzida pelo aquecimento de pelo menos um dienófilo tendo uma funcionalidade maior que um e pelo menos um polímero contendo furano substituído porcamente condutivo presente em uma quantidade efetiva para prover um meio condutor em apenas uma direção.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/768,055 US5840215A (en) | 1996-12-16 | 1996-12-16 | Anisotropic conductive adhesive compositions |
PCT/EP1997/007158 WO1998027178A1 (en) | 1996-12-16 | 1997-12-15 | Anisotropic conductive adhesive compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9713942A true BR9713942A (pt) | 2000-03-21 |
Family
ID=25081383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9713942A BR9713942A (pt) | 1996-12-16 | 1997-12-15 | Composição adesiva condutiva anisotrópica termicamente reprocessável, e, processo para a ligação de um componente a um substrato |
Country Status (13)
Country | Link |
---|---|
US (1) | US5840215A (pt) |
EP (1) | EP0944684A1 (pt) |
JP (1) | JP2002501554A (pt) |
KR (1) | KR20000069493A (pt) |
AU (1) | AU729554B2 (pt) |
BR (1) | BR9713942A (pt) |
CA (1) | CA2274863A1 (pt) |
HU (1) | HUP0000764A3 (pt) |
ID (1) | ID21670A (pt) |
IL (1) | IL130212A0 (pt) |
TW (1) | TW448222B (pt) |
WO (1) | WO1998027178A1 (pt) |
ZA (1) | ZA9711199B (pt) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
JP2000273317A (ja) * | 1999-02-12 | 2000-10-03 | Natl Starch & Chem Investment Holding Corp | エレクトロニクスデバイス用の電気的安定性をもつ導電性および抵抗性材料 |
US6287894B1 (en) | 1999-10-04 | 2001-09-11 | Andersen Laboratories, Inc. | Acoustic device packaged at wafer level |
JP3346376B2 (ja) * | 1999-11-05 | 2002-11-18 | ソニーケミカル株式会社 | 異方性導電接続用導電性粒子及び異方性導電接続材料 |
US6271335B1 (en) * | 2000-01-18 | 2001-08-07 | Sandia Corporation | Method of making thermally removable polymeric encapsulants |
US6703566B1 (en) | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
TW494449B (en) * | 2001-02-06 | 2002-07-11 | United Microelectronics Corp | Method for fabricating test piece of transmission electron microscope |
US6942824B1 (en) * | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
US6733613B2 (en) * | 2002-07-25 | 2004-05-11 | S. Kumar Khanna | Method for curing an anisotropic conductive compound |
US6838022B2 (en) * | 2002-07-25 | 2005-01-04 | Nexaura Systems, Llc | Anisotropic conductive compound |
US6909100B2 (en) * | 2002-07-25 | 2005-06-21 | Ii-Vi Incorporated | Radiation detector assembly |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
JP2004307859A (ja) * | 2003-04-05 | 2004-11-04 | Rohm & Haas Electronic Materials Llc | 電子デバイス製造 |
JP4293181B2 (ja) * | 2005-03-18 | 2009-07-08 | セイコーエプソン株式会社 | 金属粒子分散液、金属粒子分散液の製造方法、導電膜形成基板の製造方法、電子デバイスおよび電子機器 |
CN101194540B (zh) * | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | 导电产品的连接方法和具有由该连接方法连接的部分的电气或电子元件 |
WO2007006633A1 (en) * | 2005-07-08 | 2007-01-18 | Cypak Ab | Use of heat-activated adhesive for manufacture and a device so manufactured |
GB0710425D0 (en) * | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
US8420722B2 (en) | 2008-07-10 | 2013-04-16 | Electronics And Telecommunications Research Institute | Composition and methods of forming solder bump and flip chip using the same |
WO2011119878A1 (en) * | 2010-03-25 | 2011-09-29 | Tyco Healthcare Group Lp | Functionalized adhesive for medical devices |
US8917510B2 (en) | 2011-01-14 | 2014-12-23 | International Business Machines Corporation | Reversibly adhesive thermal interface material |
US8511369B2 (en) | 2011-04-18 | 2013-08-20 | International Business Machines Corporation | Thermally reversible crosslinked polymer modified particles and methods for making the same |
US9085719B2 (en) | 2013-03-18 | 2015-07-21 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
US9193139B2 (en) * | 2013-05-30 | 2015-11-24 | Xerox Corporation | Reversible polymer adhesive composition |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
US20150218425A1 (en) * | 2014-02-05 | 2015-08-06 | Apple Inc. | Stretch release conductive adhesive |
JP6613649B2 (ja) * | 2014-06-23 | 2019-12-04 | 東洋インキScホールディングス株式会社 | 接着剤組成物、積層シート、太陽電池用裏面保護シート |
US9601435B2 (en) * | 2015-01-22 | 2017-03-21 | Qualcomm Incorporated | Semiconductor package with embedded components and method of making the same |
US9545011B2 (en) | 2015-05-13 | 2017-01-10 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
GB2539684B (en) | 2015-06-24 | 2018-04-04 | Dst Innovations Ltd | Method of surface-mounting components |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
GB1477780A (en) * | 1974-08-14 | 1977-06-29 | Seikosha Kk | Assembly incorporating electrically conductive adhesive |
US3979373A (en) * | 1975-06-13 | 1976-09-07 | Shell Oil Company | Polymeric furan derivative |
US4826932A (en) * | 1987-12-29 | 1989-05-02 | Shell Oil Company | Dioxolane containing polymer |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
US5121190A (en) * | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
EP0591174B1 (en) * | 1990-06-08 | 1997-07-16 | Minnesota Mining And Manufacturing Company | Reworkable adhesive for electronic applications |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
US5288769A (en) * | 1991-03-27 | 1994-02-22 | Motorola, Inc. | Thermally conducting adhesive containing aluminum nitride |
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
US5233046A (en) * | 1991-11-04 | 1993-08-03 | Hay Allan S | Diarylacetylenes, enamines and acetylenic polymers and their production |
US5390082A (en) * | 1992-07-06 | 1995-02-14 | International Business Machines, Corp. | Chip carrier with protective coating for circuitized surface |
US5371328A (en) * | 1993-08-20 | 1994-12-06 | International Business Machines Corporation | Component rework |
TW338044B (en) * | 1994-11-15 | 1998-08-11 | Shell Internattonale Res Mij B V | A cross linked resin |
MY114204A (en) * | 1994-11-15 | 2002-08-30 | Shell Int Research | A cross-linked resin |
-
1996
- 1996-12-16 US US08/768,055 patent/US5840215A/en not_active Expired - Lifetime
-
1997
- 1997-12-12 ZA ZA9711199A patent/ZA9711199B/xx unknown
- 1997-12-15 EP EP97953870A patent/EP0944684A1/en not_active Withdrawn
- 1997-12-15 JP JP52734698A patent/JP2002501554A/ja active Pending
- 1997-12-15 BR BR9713942A patent/BR9713942A/pt unknown
- 1997-12-15 IL IL13021297A patent/IL130212A0/xx unknown
- 1997-12-15 AU AU57614/98A patent/AU729554B2/en not_active Ceased
- 1997-12-15 KR KR1019997005355A patent/KR20000069493A/ko not_active Application Discontinuation
- 1997-12-15 WO PCT/EP1997/007158 patent/WO1998027178A1/en not_active Application Discontinuation
- 1997-12-15 ID IDW990526A patent/ID21670A/id unknown
- 1997-12-15 CA CA002274863A patent/CA2274863A1/en not_active Abandoned
- 1997-12-15 HU HU0000764A patent/HUP0000764A3/hu unknown
- 1997-12-24 TW TW086119714A patent/TW448222B/zh active
Also Published As
Publication number | Publication date |
---|---|
ID21670A (id) | 1999-07-08 |
WO1998027178A1 (en) | 1998-06-25 |
AU729554B2 (en) | 2001-02-01 |
EP0944684A1 (en) | 1999-09-29 |
TW448222B (en) | 2001-08-01 |
AU5761498A (en) | 1998-07-15 |
US5840215A (en) | 1998-11-24 |
HUP0000764A2 (en) | 2000-07-28 |
HUP0000764A3 (en) | 2001-05-28 |
ZA9711199B (en) | 1998-06-23 |
IL130212A0 (en) | 2000-06-01 |
CA2274863A1 (en) | 1998-06-25 |
JP2002501554A (ja) | 2002-01-15 |
KR20000069493A (ko) | 2000-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |