BR9712155A - Módulo de chip, especialmente para a implantação em um corpo de cartão de chip. - Google Patents
Módulo de chip, especialmente para a implantação em um corpo de cartão de chip.Info
- Publication number
- BR9712155A BR9712155A BR9712155-0A BR9712155A BR9712155A BR 9712155 A BR9712155 A BR 9712155A BR 9712155 A BR9712155 A BR 9712155A BR 9712155 A BR9712155 A BR 9712155A
- Authority
- BR
- Brazil
- Prior art keywords
- chip
- implantation
- card body
- chip module
- module
- Prior art date
Links
- 238000002513 implantation Methods 0.000 title abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Patente de Invenção: <B>''MóDULO DE CHIP, ESPECIALMENTE PARA A IMPLANTACãO EM UM CORPO DE CARTãO DE CHIP''<D>. Descreve-se um módulo de chip, especialmente para a implantação em um corpo de cartão de chip (25), com um portador (10) e um chip (13) colocado sobre o portador. O módulo de chip descrito caracteriza-se pelo fato de que sobre o portador é prevista uma elevação (23) em forma de base, a qual circunda o chip total ou parcialmente
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19640304A DE19640304C2 (de) | 1996-09-30 | 1996-09-30 | Chipmodul insbesondere zur Implantation in einen Chipkartenkörper |
PCT/DE1997/001921 WO1998015004A1 (de) | 1996-09-30 | 1997-09-02 | Chipmodul insbesondere zur implantation in einen chipkartenkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9712155A true BR9712155A (pt) | 1999-08-31 |
Family
ID=7807447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9712155-0A BR9712155A (pt) | 1996-09-30 | 1997-09-02 | Módulo de chip, especialmente para a implantação em um corpo de cartão de chip. |
Country Status (12)
Country | Link |
---|---|
US (1) | US6288904B1 (pt) |
EP (1) | EP0931343B1 (pt) |
JP (1) | JP3230683B2 (pt) |
KR (1) | KR100395843B1 (pt) |
CN (1) | CN1143383C (pt) |
AT (1) | ATE222026T1 (pt) |
BR (1) | BR9712155A (pt) |
DE (2) | DE19640304C2 (pt) |
ES (1) | ES2182119T3 (pt) |
RU (1) | RU2193231C2 (pt) |
UA (1) | UA57036C2 (pt) |
WO (1) | WO1998015004A1 (pt) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6914196B2 (en) * | 1998-01-09 | 2005-07-05 | Samsung Electronics Co., Ltd. | Reel-deployed printed circuit board |
JP3180086B2 (ja) * | 1998-08-31 | 2001-06-25 | 株式会社シーメディア | 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触icメディア |
FR2793069B1 (fr) * | 1999-04-28 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de dispositif electronique portable a circuit integre protege par resine photosensible |
JP3461308B2 (ja) * | 1999-07-30 | 2003-10-27 | Necマイクロシステム株式会社 | データ処理装置、その動作制御方法 |
US7638195B2 (en) * | 1999-08-04 | 2009-12-29 | Hybrid Plastics, Inc. | Surface modification with polyhedral oligomeric silsesquioxanes silanols |
US7553904B2 (en) * | 1999-08-04 | 2009-06-30 | Hybrid Plastics, Inc. | High use temperature nanocomposite resins |
US20060194919A1 (en) * | 1999-08-04 | 2006-08-31 | Lichtenhan Joseph D | Porosity control with polyhedral oligomeric silsesquioxanes |
US7485692B2 (en) | 1999-08-04 | 2009-02-03 | Hybrid Plastics, Inc. | Process for assembly of POSS monomers |
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-
1996
- 1996-09-30 DE DE19640304A patent/DE19640304C2/de not_active Expired - Fee Related
-
1997
- 1997-02-09 UA UA99031799A patent/UA57036C2/uk unknown
- 1997-09-02 DE DE59707929T patent/DE59707929D1/de not_active Expired - Lifetime
- 1997-09-02 EP EP97942775A patent/EP0931343B1/de not_active Expired - Lifetime
- 1997-09-02 BR BR9712155-0A patent/BR9712155A/pt not_active IP Right Cessation
- 1997-09-02 KR KR10-1999-7002708A patent/KR100395843B1/ko not_active IP Right Cessation
- 1997-09-02 AT AT97942775T patent/ATE222026T1/de active
- 1997-09-02 WO PCT/DE1997/001921 patent/WO1998015004A1/de not_active Application Discontinuation
- 1997-09-02 RU RU99109106/28A patent/RU2193231C2/ru active
- 1997-09-02 ES ES97942775T patent/ES2182119T3/es not_active Expired - Lifetime
- 1997-09-02 CN CNB971983674A patent/CN1143383C/zh not_active Expired - Lifetime
- 1997-09-02 JP JP51610298A patent/JP3230683B2/ja not_active Expired - Fee Related
-
1999
- 1999-03-30 US US09/281,693 patent/US6288904B1/en not_active Expired - Fee Related
Also Published As
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ES2182119T3 (es) | 2003-03-01 |
UA57036C2 (uk) | 2003-06-16 |
WO1998015004A1 (de) | 1998-04-09 |
DE59707929D1 (de) | 2002-09-12 |
EP0931343B1 (de) | 2002-08-07 |
US6288904B1 (en) | 2001-09-11 |
DE19640304A1 (de) | 1998-04-02 |
EP0931343A1 (de) | 1999-07-28 |
DE19640304C2 (de) | 2000-10-12 |
CN1143383C (zh) | 2004-03-24 |
CN1231765A (zh) | 1999-10-13 |
JP2000503155A (ja) | 2000-03-14 |
KR100395843B1 (ko) | 2003-08-27 |
KR20000048732A (ko) | 2000-07-25 |
JP3230683B2 (ja) | 2001-11-19 |
RU2193231C2 (ru) | 2002-11-20 |
ATE222026T1 (de) | 2002-08-15 |
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