BR8900513A - Processo para a adesao conjunta de pelo menos duas superficies e processo para a aplicacao de um revestimento - Google Patents
Processo para a adesao conjunta de pelo menos duas superficies e processo para a aplicacao de um revestimentoInfo
- Publication number
- BR8900513A BR8900513A BR898900513A BR8900513A BR8900513A BR 8900513 A BR8900513 A BR 8900513A BR 898900513 A BR898900513 A BR 898900513A BR 8900513 A BR8900513 A BR 8900513A BR 8900513 A BR8900513 A BR 8900513A
- Authority
- BR
- Brazil
- Prior art keywords
- metal
- coating
- application
- accession
- joint
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title abstract 6
- 238000000576 coating method Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000004907 flux Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
- C23C2/0222—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating in a reactive atmosphere, e.g. oxidising or reducing atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/06—Zinc or cadmium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
- C23C2/29—Cooling or quenching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating With Molten Metal (AREA)
- Chemically Coating (AREA)
- Molten Solder (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/154,081 US4821947A (en) | 1988-02-08 | 1988-02-08 | Fluxless application of a metal-comprising coating |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8900513A true BR8900513A (pt) | 1989-10-03 |
Family
ID=22549922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR898900513A BR8900513A (pt) | 1988-02-08 | 1989-02-03 | Processo para a adesao conjunta de pelo menos duas superficies e processo para a aplicacao de um revestimento |
Country Status (10)
Country | Link |
---|---|
US (1) | US4821947A (pt) |
EP (1) | EP0330867B1 (pt) |
JP (1) | JPH02147161A (pt) |
KR (1) | KR930007144B1 (pt) |
AT (1) | ATE91936T1 (pt) |
BR (1) | BR8900513A (pt) |
CA (1) | CA1337037C (pt) |
DE (1) | DE68907745T2 (pt) |
ES (1) | ES2042816T3 (pt) |
MX (1) | MX165299B (pt) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4937006A (en) * | 1988-07-29 | 1990-06-26 | International Business Machines Corporation | Method and apparatus for fluxless solder bonding |
US4979664A (en) * | 1989-11-15 | 1990-12-25 | At&T Bell Laboratories | Method for manufacturing a soldered article |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5255840A (en) * | 1989-12-26 | 1993-10-26 | Praxair Technology, Inc. | Fluxless solder coating and joining |
BR9006515A (pt) * | 1989-12-26 | 1991-10-01 | Union Carbide Ind Gases Tech | Revestimento e juncao de solda sem fundente |
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
US5121875A (en) * | 1991-02-22 | 1992-06-16 | Union Carbide Industrial Gases Technology Corporation | Wave soldering in a protective atmosphere enclosure over a solder pot |
GB9118115D0 (en) * | 1991-08-22 | 1991-10-09 | Multicore Solders Ltd | Lead-based solder alloy and its use in soft soldering |
WO1993008949A1 (fr) * | 1991-10-28 | 1993-05-13 | Jacqueline Brizais | Installation de soudage a la vague |
US5158224A (en) * | 1992-02-24 | 1992-10-27 | Robotic Process Systems, Inc. | Soldering machine having a vertical transfer oven |
GB2281309B (en) * | 1993-08-27 | 1997-04-23 | Boc Group Plc | A method of galvanising |
NL9301935A (nl) * | 1993-11-08 | 1995-06-01 | Soltec Bv | Soldeermachine met aangepaste soldeertoren. |
US5499754A (en) * | 1993-11-19 | 1996-03-19 | Mcnc | Fluxless soldering sample pretreating system |
US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
US5411200A (en) * | 1994-02-28 | 1995-05-02 | American Air Liquide, Inc. | Process and apparatus for the wave soldering of circuit boards |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5615825A (en) * | 1995-05-12 | 1997-04-01 | Mcnc | Fluorinated fluxless soldering |
US6013381A (en) * | 1996-12-06 | 2000-01-11 | Mcnc | Fluorinated fluxless soldering |
EP1211011B1 (en) * | 1999-10-20 | 2011-04-06 | Senju Metal Industry Co., Ltd. | Method of manufacturing a solder coated material ; corresponding solder coated material |
DE19955659A1 (de) * | 1999-11-19 | 2001-05-31 | Messer Griesheim Gmbh | Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen |
KR100748613B1 (ko) * | 2007-02-20 | 2007-08-10 | 김진택 | 다중변환 주파수를 이용한 전자유량 측정시스템. |
EP1967312A1 (de) * | 2007-03-06 | 2008-09-10 | Siemens Aktiengesellschaft | Verfahren zur Lötreparatur eines Bauteils unter Vakuum und einem eingestellten Sauerstoffpartialdruck |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
DE2346993C2 (de) * | 1973-09-18 | 1975-03-13 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Lotbad zum fluBmittelfreien Verzinnen mittels Ultraschall |
SU563240A1 (ru) * | 1974-08-09 | 1977-06-30 | Предприятие П/Я Г-4645 | Устройство дл ультразвуковой пайки и лужени изделий волной припо |
US3993236A (en) * | 1975-09-08 | 1976-11-23 | Blackstone Corporation | Methods and apparatus for soldering |
JPS5395854A (en) * | 1977-02-02 | 1978-08-22 | Asahi Glass Co Ltd | Method and apparatus for soldering with no flux |
JPS579011U (pt) * | 1980-05-31 | 1982-01-18 | ||
US4530457A (en) * | 1982-01-12 | 1985-07-23 | Electrovert Ltd. | Wave-soldering of printed circuit boards |
US4568012A (en) * | 1982-01-14 | 1986-02-04 | Toshiba Seiki Co., Ltd. | Soldering apparatus |
JPS5927771A (ja) * | 1982-08-09 | 1984-02-14 | Hitachi Ltd | 半田付け装置 |
US4504007A (en) * | 1982-09-14 | 1985-03-12 | International Business Machines Corporation | Solder and braze fluxes and processes for using the same |
DE3309648A1 (de) * | 1983-03-15 | 1984-09-20 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung |
US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
JPS6182965A (ja) * | 1984-09-28 | 1986-04-26 | Ginya Ishii | 噴流はんだ装置のはんだ酸化防止方法 |
US4610391A (en) * | 1984-12-18 | 1986-09-09 | Union Carbide Corporation | Process for wave soldering |
US4684056A (en) * | 1985-05-03 | 1987-08-04 | Electrovert Limited | Vibratory wave soldering |
JPS61286058A (ja) * | 1985-06-11 | 1986-12-16 | Meisho Kk | 噴流式半田槽 |
US4646958A (en) * | 1985-10-31 | 1987-03-03 | International Business Machines Corp. | Fluxless soldering process using a silane atmosphere |
DD246718A1 (de) * | 1986-03-18 | 1987-06-17 | Univ Schiller Jena | Verfahren zum rueckstandsarmen weichloeten von metallen |
JPS62275568A (ja) * | 1986-05-22 | 1987-11-30 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
-
1988
- 1988-02-08 US US07/154,081 patent/US4821947A/en not_active Expired - Fee Related
-
1989
- 1989-02-03 BR BR898900513A patent/BR8900513A/pt not_active IP Right Cessation
- 1989-02-07 ES ES89102084T patent/ES2042816T3/es not_active Expired - Lifetime
- 1989-02-07 MX MX014812A patent/MX165299B/es unknown
- 1989-02-07 EP EP89102084A patent/EP0330867B1/en not_active Expired - Lifetime
- 1989-02-07 DE DE89102084T patent/DE68907745T2/de not_active Expired - Fee Related
- 1989-02-07 AT AT89102084T patent/ATE91936T1/de not_active IP Right Cessation
- 1989-02-07 JP JP1026812A patent/JPH02147161A/ja active Pending
- 1989-02-07 CA CA000590290A patent/CA1337037C/en not_active Expired - Fee Related
- 1989-02-08 KR KR1019890001490A patent/KR930007144B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
MX165299B (es) | 1992-11-04 |
DE68907745T2 (de) | 1993-11-11 |
EP0330867A1 (en) | 1989-09-06 |
DE68907745D1 (de) | 1993-09-02 |
KR890013207A (ko) | 1989-09-22 |
JPH02147161A (ja) | 1990-06-06 |
KR930007144B1 (ko) | 1993-07-30 |
EP0330867B1 (en) | 1993-07-28 |
US4821947A (en) | 1989-04-18 |
CA1337037C (en) | 1995-09-19 |
ES2042816T3 (es) | 1993-12-16 |
ATE91936T1 (de) | 1993-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Decision: intention to grant | ||
KD | Notifcation of receipt (letter patent) | ||
FG | Letter patent granted | ||
B21A | Patent or certificate of addition expired [chapter 21.1 patent gazette] |
Free format text: PATENTE EXTINTA EM 03/02/2004 |