BR8602231A - Solucao liquida,alcalina,aquosa,de namn04,processo para preparar um substrato resinoso,processo aperfeicoado para desuntar resina das paredes de buracos,processo aperfeicoado para limpeza de buraco e processo para atacar a parte suporte da superficie de um painel de circuito - Google Patents
Solucao liquida,alcalina,aquosa,de namn04,processo para preparar um substrato resinoso,processo aperfeicoado para desuntar resina das paredes de buracos,processo aperfeicoado para limpeza de buraco e processo para atacar a parte suporte da superficie de um painel de circuitoInfo
- Publication number
- BR8602231A BR8602231A BR8602231A BR8602231A BR8602231A BR 8602231 A BR8602231 A BR 8602231A BR 8602231 A BR8602231 A BR 8602231A BR 8602231 A BR8602231 A BR 8602231A BR 8602231 A BR8602231 A BR 8602231A
- Authority
- BR
- Brazil
- Prior art keywords
- support
- perfect
- holes
- sup
- sub
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Detergent Compositions (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/739,726 US4601784A (en) | 1985-05-31 | 1985-05-31 | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8602231A true BR8602231A (pt) | 1987-01-13 |
Family
ID=24973524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8602231A BR8602231A (pt) | 1985-05-31 | 1986-05-16 | Solucao liquida,alcalina,aquosa,de namn04,processo para preparar um substrato resinoso,processo aperfeicoado para desuntar resina das paredes de buracos,processo aperfeicoado para limpeza de buraco e processo para atacar a parte suporte da superficie de um painel de circuito |
Country Status (15)
Country | Link |
---|---|
US (1) | US4601784A (pt) |
EP (1) | EP0207586B2 (pt) |
JP (1) | JP2562811B2 (pt) |
KR (1) | KR900001827B1 (pt) |
AT (1) | ATE58560T1 (pt) |
AU (1) | AU580146B2 (pt) |
BR (1) | BR8602231A (pt) |
CA (1) | CA1274456A (pt) |
DE (2) | DE3675700D1 (pt) |
DK (1) | DK255386A (pt) |
ES (1) | ES8801696A1 (pt) |
IL (1) | IL78268A (pt) |
NO (1) | NO861344L (pt) |
NZ (1) | NZ215545A (pt) |
ZA (1) | ZA862434B (pt) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4781853A (en) * | 1986-12-01 | 1988-11-01 | Harris Corp. | Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions |
US4781788A (en) * | 1986-12-29 | 1988-11-01 | Delco Electronics Corporation | Process for preparing printed circuit boards |
US4940510A (en) * | 1987-06-01 | 1990-07-10 | Digital Equipment Corporation | Method of etching in the presence of positive photoresist |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
DE3816494A1 (de) * | 1988-05-10 | 1989-11-16 | Schering Ag | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
US4978422A (en) * | 1990-03-20 | 1990-12-18 | Macdermid, Incorporated | Method for improving insulation resistance of printed circuits |
US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
US5221418A (en) * | 1992-02-11 | 1993-06-22 | Macdermid, Incorporated | Method for improving the surface insulation resistance of printed circuits |
DE4221948C1 (de) * | 1992-07-02 | 1993-10-21 | Schering Ag | Verfahren zur Metallisierung von Kunststoffen und Verwendung |
JP3400049B2 (ja) * | 1993-11-26 | 2003-04-28 | 住友ベークライト株式会社 | プリント配線板用接着剤及びこの接着剤を用いたプリント配線板の製造方法 |
US6066612A (en) | 1996-05-03 | 2000-05-23 | The Procter & Gamble Company | Detergent compositions comprising polyamine polymers with improved soil dispersancy |
US6454954B1 (en) | 2000-05-22 | 2002-09-24 | Shipley Company, L.L.C. | Desmear etchant and use thereof |
GB0225012D0 (en) * | 2002-10-28 | 2002-12-04 | Shipley Co Llc | Desmear and texturing method |
JP2010114358A (ja) * | 2008-11-10 | 2010-05-20 | Kaneka Corp | デスミア処理する方法 |
US8906515B2 (en) * | 2009-06-02 | 2014-12-09 | Integran Technologies, Inc. | Metal-clad polymer article |
US8741392B2 (en) * | 2009-06-02 | 2014-06-03 | Integran Technologies, Inc. | Anodically assisted chemical etching of conductive polymers and polymer composites |
US8247050B2 (en) * | 2009-06-02 | 2012-08-21 | Integran Technologies, Inc. | Metal-coated polymer article of high durability and vacuum and/or pressure integrity |
US8394507B2 (en) * | 2009-06-02 | 2013-03-12 | Integran Technologies, Inc. | Metal-clad polymer article |
KR101154409B1 (ko) * | 2010-07-30 | 2012-06-15 | 현대자동차주식회사 | 차량용 연료 전지 장치 및 그 제어 방법 |
DE102011111294B4 (de) * | 2011-08-26 | 2018-12-20 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung |
JP5330474B2 (ja) * | 2011-09-22 | 2013-10-30 | 上村工業株式会社 | デスミア液及びデスミア処理方法 |
US9004240B2 (en) | 2013-02-27 | 2015-04-14 | Integran Technologies Inc. | Friction liner |
JP2015064337A (ja) * | 2013-08-30 | 2015-04-09 | キヤノン株式会社 | 微細構造体の製造方法 |
CN109321921A (zh) * | 2018-09-28 | 2019-02-12 | 东莞优诺电子焊接材料有限公司 | 一种汽车模具pvd用的退镀液及其制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1969678A (en) * | 1931-09-25 | 1934-08-07 | Dow Chemical Co | Ferric chloride etching solutions |
US2908557A (en) * | 1957-01-07 | 1959-10-13 | Rca Corp | Method of etching copper |
US3095380A (en) * | 1958-07-14 | 1963-06-25 | Purex Corp Ltd | Composition for removal of heat scale and carbon deposits |
US3080323A (en) * | 1959-04-07 | 1963-03-05 | Purex Corp Ltd | Composition for radioactive decontamination and descaling of cobalt alloys |
US3293148A (en) * | 1964-02-27 | 1966-12-20 | Hooker Chemical Corp | Method of cleaning steel surfaces |
NL6606730A (pt) * | 1965-05-17 | 1966-11-18 | ||
US3457107A (en) * | 1965-07-20 | 1969-07-22 | Diversey Corp | Method and composition for chemically polishing metals |
AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
US3425947A (en) * | 1966-05-02 | 1969-02-04 | Hooker Chemical Corp | Method of treating metal surfaces |
US3528924A (en) * | 1967-01-24 | 1970-09-15 | Purex Corp Ltd | Plastic case desoiling process |
US3506397A (en) * | 1967-12-22 | 1970-04-14 | Gen Motors Corp | Phosphoric acid recovery from spent plastic conditioner solution |
US3647699A (en) * | 1967-12-22 | 1972-03-07 | Gen Motors Corp | Surface conditioner composition for abs resin |
US3598630A (en) * | 1967-12-22 | 1971-08-10 | Gen Motors Corp | Method of conditioning the surface of acrylonitrile-butadiene-styrene |
US3652417A (en) * | 1968-03-01 | 1972-03-28 | Carus Corp | Stabilization of alkali metal permanganate in alkaline solution |
US3652351A (en) * | 1970-05-13 | 1972-03-28 | Carus Corp | Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions |
US3689303A (en) * | 1970-12-21 | 1972-09-05 | Crown City Plating Co | Process for electroless plating of abs resins |
US3833414A (en) * | 1972-09-05 | 1974-09-03 | Gen Electric | Aluminide coating removal method |
US4042729A (en) * | 1972-12-13 | 1977-08-16 | Kollmorgen Technologies Corporation | Process for the activation of resinous bodies for adherent metallization |
US4054693A (en) * | 1974-11-07 | 1977-10-18 | Kollmorgen Technologies Corporation | Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition |
DK154600C (da) * | 1974-11-07 | 1989-04-17 | Kollmorgen Tech Corp | Fremgangsmaade til forbehandling af kredsloebspladerpaa formstofbasis. |
US4073740A (en) * | 1975-06-18 | 1978-02-14 | Kollmorgen Technologies Corporation | Composition for the activation of resinous bodies for adherent metallization |
JPS55153338A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Surface treatment of semiconductor substrate |
DE3110415C2 (de) * | 1981-03-18 | 1983-08-18 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten |
US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
-
1985
- 1985-05-31 US US06/739,726 patent/US4601784A/en not_active Expired - Lifetime
-
1986
- 1986-03-20 CA CA000504643A patent/CA1274456A/en not_active Expired - Lifetime
- 1986-03-20 NZ NZ215545A patent/NZ215545A/xx unknown
- 1986-03-25 IL IL78268A patent/IL78268A/xx unknown
- 1986-03-26 AU AU55268/86A patent/AU580146B2/en not_active Ceased
- 1986-03-27 DE DE8686302336T patent/DE3675700D1/de not_active Expired - Fee Related
- 1986-03-27 AT AT86302336T patent/ATE58560T1/de not_active IP Right Cessation
- 1986-03-27 DE DE198686302336T patent/DE207586T1/de active Pending
- 1986-03-27 EP EP86302336A patent/EP0207586B2/en not_active Expired - Lifetime
- 1986-04-02 ZA ZA862434A patent/ZA862434B/xx unknown
- 1986-04-07 NO NO861344A patent/NO861344L/no unknown
- 1986-05-16 BR BR8602231A patent/BR8602231A/pt unknown
- 1986-05-20 JP JP61113845A patent/JP2562811B2/ja not_active Expired - Fee Related
- 1986-05-30 DK DK255386A patent/DK255386A/da unknown
- 1986-05-30 ES ES555511A patent/ES8801696A1/es not_active Expired
- 1986-05-30 KR KR1019860004262A patent/KR900001827B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU580146B2 (en) | 1989-01-05 |
DK255386A (da) | 1986-12-01 |
ATE58560T1 (de) | 1990-12-15 |
KR860009098A (ko) | 1986-12-20 |
AU5526886A (en) | 1987-01-15 |
US4601784A (en) | 1986-07-22 |
DE3675700D1 (de) | 1991-01-03 |
EP0207586B2 (en) | 1999-03-17 |
ES8801696A1 (es) | 1988-02-16 |
EP0207586A1 (en) | 1987-01-07 |
NZ215545A (en) | 1989-01-27 |
CA1274456A (en) | 1990-09-25 |
JPS61278598A (ja) | 1986-12-09 |
DE207586T1 (de) | 1988-03-17 |
KR900001827B1 (ko) | 1990-03-24 |
NO861344L (no) | 1986-12-01 |
DK255386D0 (da) | 1986-05-30 |
JP2562811B2 (ja) | 1996-12-11 |
ES555511A0 (es) | 1988-02-16 |
IL78268A (en) | 1989-01-31 |
ZA862434B (en) | 1986-11-26 |
IL78268A0 (en) | 1986-07-31 |
EP0207586B1 (en) | 1990-11-22 |
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