BR112022016141A2 - Liga de solda, esfera de solda e junta de solda livres de chumbo e de antimônio - Google Patents

Liga de solda, esfera de solda e junta de solda livres de chumbo e de antimônio

Info

Publication number
BR112022016141A2
BR112022016141A2 BR112022016141A BR112022016141A BR112022016141A2 BR 112022016141 A2 BR112022016141 A2 BR 112022016141A2 BR 112022016141 A BR112022016141 A BR 112022016141A BR 112022016141 A BR112022016141 A BR 112022016141A BR 112022016141 A2 BR112022016141 A2 BR 112022016141A2
Authority
BR
Brazil
Prior art keywords
solder
lead
alloy
free
antimonium
Prior art date
Application number
BR112022016141A
Other languages
English (en)
Inventor
Iijima Yuuki
Yoshikawa Shunsaku
Saito Takashi
Dei Kanta
Matsufuji Takahiro
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of BR112022016141A2 publication Critical patent/BR112022016141A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

LIGA DE SOLDA, ESFERA DE SOLDA E JUNTA DE SOLDA LIVRES DE CHUMBO E DE ANTIMÔNIO. A presente invenção refere-se a uma liga de solda, uma esfera de solda e uma junta de solda livres de chumbo e de antimônio que tenham resistência ao cisalhamento melhorada obtida por miudeza granular em uma interface unida e que possam suprimir a falha de fusão. A liga de solda livre de chumbo e de antimônio apresenta uma composição de liga que consiste, por % em massa, de 0,1 a 4,5% de Ag, 0,20 a 0,85% de Cu, 0,005 a 0,090% de Ni e 0,0005 a 0,0090% de Ge com o equilíbrio sendo Sn, e a composição da liga satisfaz às relações (1) e (2) a seguir: 0,006 ¿¿ (Ag + Cu + Ni) ¿ Ge < 0,023 (1), (Sn/Cu) ¿ (Ni ¿ Ge)/(Ni + Ge) < 0,89 (2). Ag, Cu, Ni, Ge e Sn nas relações (1) e (2), cada um, representa os teores (% em massa) da composição da liga.
BR112022016141A 2020-02-14 2021-02-08 Liga de solda, esfera de solda e junta de solda livres de chumbo e de antimônio BR112022016141A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
PCT/JP2021/004570 WO2021161953A1 (ja) 2020-02-14 2021-02-08 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (1)

Publication Number Publication Date
BR112022016141A2 true BR112022016141A2 (pt) 2022-10-04

Family

ID=77292175

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112022016141A BR112022016141A2 (pt) 2020-02-14 2021-02-08 Liga de solda, esfera de solda e junta de solda livres de chumbo e de antimônio

Country Status (9)

Country Link
US (1) US20230060857A1 (pt)
EP (1) EP4105349A4 (pt)
JP (2) JP6928284B1 (pt)
KR (1) KR102543580B1 (pt)
CN (1) CN115397605B (pt)
BR (1) BR112022016141A2 (pt)
MX (2) MX2022009912A (pt)
TW (2) TWI781050B (pt)
WO (1) WO2021161953A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP7381980B1 (ja) 2023-04-28 2023-11-16 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路

Family Cites Families (19)

* Cited by examiner, † Cited by third party
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JPS5816877A (ja) * 1981-07-24 1983-01-31 Fuji Xerox Co Ltd 記録装置のロ−ル紙給紙機構
JP3649384B2 (ja) * 2000-07-03 2005-05-18 日立金属株式会社 はんだボールおよびその製造方法
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP3865396B2 (ja) * 2003-07-08 2007-01-10 日本ピラー工業株式会社 融着型の樹脂製管継手構造
JP4807724B2 (ja) * 2005-02-28 2011-11-02 財団法人電力中央研究所 鉄道車両の製造方法
JP2007160401A (ja) * 2005-11-15 2007-06-28 Hitachi Metals Ltd はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
KR20130073995A (ko) * 2006-03-09 2013-07-03 신닛테츠스미킹 마테리알즈 가부시키가이샤 무연 솔더 합금, 솔더 볼 및 전자 부재와, 자동차 탑재 전자 부재용 무연 솔더 합금, 솔더 볼 및 전자 부재
KR100797161B1 (ko) 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
JP5079170B1 (ja) * 2012-04-16 2012-11-21 株式会社谷黒組 はんだ付け装置及び方法並びに製造された基板及び電子部品
ES2665854T3 (es) * 2012-06-30 2018-04-27 Senju Metal Industry Co., Ltd. Bola de soldadura sin plomo
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法
TWI576195B (zh) * 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20150127445A (ko) * 2014-05-07 2015-11-17 애큐러스 사이언티픽 컴퍼니 리미티드 은-비함유 및 납-비함유 솔더 조성물
EP3321025B1 (en) * 2016-03-22 2020-11-25 Tamura Corporation Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
PT3381601T (pt) * 2016-09-13 2021-01-05 Senju Metal Industry Co Liga de solda, esferas de solda e juntas de solda
JP2018167310A (ja) * 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
JP2019155467A (ja) * 2018-03-16 2019-09-19 千住金属工業株式会社 鉛フリーはんだ合金
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Also Published As

Publication number Publication date
MX2022009912A (es) 2022-09-09
TWI765570B (zh) 2022-05-21
JP2021126704A (ja) 2021-09-02
WO2021161953A1 (ja) 2021-08-19
JP6928284B1 (ja) 2021-09-01
TW202138576A (zh) 2021-10-16
JP7025679B2 (ja) 2022-02-25
EP4105349A1 (en) 2022-12-21
JP2021126685A (ja) 2021-09-02
TW202219287A (zh) 2022-05-16
TWI781050B (zh) 2022-10-11
CN115397605A (zh) 2022-11-25
KR102543580B1 (ko) 2023-06-15
US20230060857A1 (en) 2023-03-02
KR20220129112A (ko) 2022-09-22
MX2023008513A (es) 2024-01-02
CN115397605B (zh) 2024-04-30
EP4105349A4 (en) 2023-09-06

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B12B Appeal against refusal [chapter 12.2 patent gazette]