BR112018014282A2 - método para produzir um módulo de cartão com chip e um cartão com chip - Google Patents
método para produzir um módulo de cartão com chip e um cartão com chipInfo
- Publication number
- BR112018014282A2 BR112018014282A2 BR112018014282-4A BR112018014282A BR112018014282A2 BR 112018014282 A2 BR112018014282 A2 BR 112018014282A2 BR 112018014282 A BR112018014282 A BR 112018014282A BR 112018014282 A2 BR112018014282 A2 BR 112018014282A2
- Authority
- BR
- Brazil
- Prior art keywords
- chip card
- module
- producing
- antenna
- chip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Abstract
resumo método para produzir um módulo de cartão com chip e um cartão com chip a invenção se refere a um método para a produção de um módulo de cartão com chip (2). de acordo com este método, são produzidos os seguintes: - um módulo (2), com um substrato (13) que tem contatos e chip eletrônico (17) conectado a pelo menos alguns contatos; - uma antena em um suporte, esta antena que compreende duas extremidades, cada um equipado com uma zona de conexão; - uma cavidade, pelo menos, numa camada do cartão, pelo menos parcialmente cobrindo o suporte para abrigar o módulo (2) e para expor as zonas de conexão da antena; - um primeiro final de um fio (18) é conectado diretamente a um bloco de conexão do chip (17), e outra parte (23) é conectada diretamente a uma zona de conexão da antena, após ter inserido o módulo (2) na cavidade.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1650587 | 2016-01-26 | ||
FR1650587A FR3047101B1 (fr) | 2016-01-26 | 2016-01-26 | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
PCT/FR2017/050172 WO2017129904A1 (fr) | 2016-01-26 | 2017-01-25 | Procédé de fabrication d'un module de carte à puce et d'une carte à puce |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112018014282A2 true BR112018014282A2 (pt) | 2018-12-18 |
Family
ID=56117830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018014282-4A BR112018014282A2 (pt) | 2016-01-26 | 2017-01-25 | método para produzir um módulo de cartão com chip e um cartão com chip |
Country Status (13)
Country | Link |
---|---|
US (1) | US10706346B2 (pt) |
EP (1) | EP3408799B1 (pt) |
JP (1) | JP6901207B2 (pt) |
CN (1) | CN108496187B (pt) |
BR (1) | BR112018014282A2 (pt) |
CL (1) | CL2018002017A1 (pt) |
ES (1) | ES2817578T3 (pt) |
FR (1) | FR3047101B1 (pt) |
MX (1) | MX2018009123A (pt) |
MY (1) | MY197068A (pt) |
SG (2) | SG11201806384RA (pt) |
TW (1) | TWI662480B (pt) |
WO (1) | WO2017129904A1 (pt) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
WO2019138260A1 (en) * | 2018-01-12 | 2019-07-18 | Linxens Holding | Method for manufacturing a sim card and sim card |
FR3086098B1 (fr) * | 2018-09-18 | 2020-12-04 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour objet portatif |
CN111626395A (zh) * | 2020-05-29 | 2020-09-04 | 东信和平科技股份有限公司 | 一种双界面安全芯片卡及制作方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639630A1 (de) | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US5080279A (en) | 1990-06-27 | 1992-01-14 | At&T Bell Laboratories | Method for tape automated bonding |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
JPH08282167A (ja) | 1995-04-13 | 1996-10-29 | Rohm Co Ltd | Icカード |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
JP4153056B2 (ja) | 1997-01-27 | 2008-09-17 | 大日本印刷株式会社 | Icモジュールの製造方法 |
US6046504A (en) * | 1997-02-17 | 2000-04-04 | Nippon Steel Corporation | Resin-encapsulated LOC semiconductor device having a thin inner lead |
IL122250A (en) | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
FR2847365B1 (fr) | 2002-11-15 | 2005-03-11 | Gemplus Card Int | Connexion/raccordement simultane par un percage d'adhesif d'encartage |
DE10257111B4 (de) | 2002-12-05 | 2005-12-22 | Mühlbauer Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
AU2003241968A1 (en) * | 2003-05-30 | 2005-01-21 | Renesas Technology Corp. | Semiconductor device and its manufacturing method |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
FR2922342B1 (fr) | 2007-10-11 | 2010-07-30 | Ask Sa | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
JP2010072930A (ja) | 2008-09-18 | 2010-04-02 | Toshiba Corp | Icモジュール、及びこれを用いたicカード |
EP3073419B1 (en) * | 2011-11-17 | 2020-11-18 | Toppan Printing Co., Ltd. | Composite ic card |
CA2860909C (en) * | 2012-01-23 | 2021-11-16 | David Finn | Offsetting shielding and enhancing coupling in metallized smart cards |
FR2996944B1 (fr) | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
CN203134786U (zh) | 2012-12-28 | 2013-08-14 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具 |
DE102013102718A1 (de) * | 2013-03-18 | 2014-09-18 | Infineon Technologies Ag | Chipkartenmodulanordnung |
JP6090006B2 (ja) * | 2013-06-25 | 2017-03-08 | 凸版印刷株式会社 | Icモジュール、デュアルicカードおよびicモジュールの製造方法 |
US9424507B2 (en) * | 2014-04-01 | 2016-08-23 | Nxp B.V. | Dual interface IC card components and method for manufacturing the dual-interface IC card components |
FR3021145B1 (fr) | 2014-05-14 | 2018-08-31 | Linxens Holding | Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce |
DE102014107299B4 (de) * | 2014-05-23 | 2019-03-28 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
EP3059698B1 (fr) | 2015-02-20 | 2021-03-31 | Thales Dis France SA | Procédé de fabrication d'un module électronique simple face comprenant des zones d'interconnexion |
TWM544072U (zh) | 2017-04-10 | 2017-06-21 | Tendays Co Ltd | 床組的遠端控制系統 |
-
2016
- 2016-01-26 FR FR1650587A patent/FR3047101B1/fr active Active
-
2017
- 2017-01-25 SG SG11201806384RA patent/SG11201806384RA/en unknown
- 2017-01-25 SG SG10201913048XA patent/SG10201913048XA/en unknown
- 2017-01-25 MX MX2018009123A patent/MX2018009123A/es unknown
- 2017-01-25 US US16/070,814 patent/US10706346B2/en active Active
- 2017-01-25 CN CN201780008226.8A patent/CN108496187B/zh active Active
- 2017-01-25 MY MYPI2018702609A patent/MY197068A/en unknown
- 2017-01-25 WO PCT/FR2017/050172 patent/WO2017129904A1/fr active Application Filing
- 2017-01-25 BR BR112018014282-4A patent/BR112018014282A2/pt not_active Application Discontinuation
- 2017-01-25 EP EP17707369.9A patent/EP3408799B1/fr active Active
- 2017-01-25 ES ES17707369T patent/ES2817578T3/es active Active
- 2017-01-25 JP JP2018557217A patent/JP6901207B2/ja active Active
- 2017-01-26 TW TW106103346A patent/TWI662480B/zh active
-
2018
- 2018-07-25 CL CL2018002017A patent/CL2018002017A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
SG11201806384RA (en) | 2018-08-30 |
CN108496187B (zh) | 2021-12-28 |
US20190026621A1 (en) | 2019-01-24 |
MY197068A (en) | 2023-05-24 |
ES2817578T3 (es) | 2021-04-07 |
MX2018009123A (es) | 2018-11-09 |
FR3047101A1 (fr) | 2017-07-28 |
CN108496187A (zh) | 2018-09-04 |
TWI662480B (zh) | 2019-06-11 |
FR3047101B1 (fr) | 2022-04-01 |
SG10201913048XA (en) | 2020-02-27 |
JP6901207B2 (ja) | 2021-07-14 |
EP3408799B1 (fr) | 2020-07-08 |
TW201732688A (zh) | 2017-09-16 |
WO2017129904A1 (fr) | 2017-08-03 |
US10706346B2 (en) | 2020-07-07 |
JP2019504431A (ja) | 2019-02-14 |
EP3408799A1 (fr) | 2018-12-05 |
CL2018002017A1 (es) | 2019-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 5A ANUIDADE. |
|
B08G | Application fees: restoration [chapter 8.7 patent gazette] | ||
B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |