BR112017002697A2 - ?gerador de fluxo de ar e arranjo de geradores de fluxo de ar? - Google Patents

?gerador de fluxo de ar e arranjo de geradores de fluxo de ar?

Info

Publication number
BR112017002697A2
BR112017002697A2 BR112017002697-0A BR112017002697A BR112017002697A2 BR 112017002697 A2 BR112017002697 A2 BR 112017002697A2 BR 112017002697 A BR112017002697 A BR 112017002697A BR 112017002697 A2 BR112017002697 A2 BR 112017002697A2
Authority
BR
Brazil
Prior art keywords
air flow
arrangement
flow generator
generators
generator
Prior art date
Application number
BR112017002697-0A
Other languages
English (en)
Inventor
James Dusseau Michael
Nils Holen Stephen
Original Assignee
Ge Aviation Systems Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ge Aviation Systems Llc filed Critical Ge Aviation Systems Llc
Publication of BR112017002697A2 publication Critical patent/BR112017002697A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Reciprocating Pumps (AREA)

Abstract

trata-se de um gerador de fluxo de ar e arranjo de geradores de fluxo de ar para uso com um objeto em que cada um dos geradores de fluxo de ar inclui uma estrutura flexível que tem um primeiro lado distanciado de uma porção do objeto para definir um espaço de ar entre os mesmos e pelo menos uma estrutura piezoelétrica localizada na estrutura flexível.
BR112017002697-0A 2014-08-25 2014-08-25 ?gerador de fluxo de ar e arranjo de geradores de fluxo de ar? BR112017002697A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/052547 WO2016032429A1 (en) 2014-08-25 2014-08-25 Airflow generator and array of airflow generators

Publications (1)

Publication Number Publication Date
BR112017002697A2 true BR112017002697A2 (pt) 2018-01-30

Family

ID=51541301

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017002697-0A BR112017002697A2 (pt) 2014-08-25 2014-08-25 ?gerador de fluxo de ar e arranjo de geradores de fluxo de ar?

Country Status (7)

Country Link
US (1) US20170276149A1 (pt)
EP (1) EP3186516A1 (pt)
JP (1) JP6542872B2 (pt)
CN (1) CN106662122B (pt)
BR (1) BR112017002697A2 (pt)
CA (1) CA2958278C (pt)
WO (1) WO2016032429A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11464140B2 (en) 2019-12-06 2022-10-04 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
US11456234B2 (en) 2018-08-10 2022-09-27 Frore Systems Inc. Chamber architecture for cooling devices
WO2021086873A1 (en) * 2019-10-30 2021-05-06 Frore System Inc. Mems-based airflow system
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
US11510341B2 (en) 2019-12-06 2022-11-22 Frore Systems Inc. Engineered actuators usable in MEMs active cooling devices
WO2022060594A1 (en) * 2020-09-16 2022-03-24 Frore Systems Inc. Method and system for fabricating mems-based cooling systems
CN116325139A (zh) 2020-10-02 2023-06-23 福珞尔***公司 主动式热沉
WO2022187160A1 (en) 2021-03-02 2022-09-09 Frore Systems Inc. Exhaust blending for piezoelectric cooling systems

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
WO1980002445A1 (en) * 1979-05-07 1980-11-13 Rotron Inc Solid state blower
US4595338A (en) * 1983-11-17 1986-06-17 Piezo Electric Products, Inc. Non-vibrational oscillating blade piezoelectric blower
JPH01233796A (ja) * 1988-03-14 1989-09-19 Murata Mfg Co Ltd 放熱器
US4923000A (en) * 1989-03-03 1990-05-08 Microelectronics And Computer Technology Corporation Heat exchanger having piezoelectric fan means
WO1996018823A1 (en) * 1994-12-15 1996-06-20 The Whitaker Corporation Metal enforced pvdf vibrational fan
JPH10141300A (ja) * 1996-11-06 1998-05-26 Honda Motor Co Ltd 流体輸送装置
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
US20020175596A1 (en) * 2001-05-23 2002-11-28 Garimella Suresh V. Thin profile piezoelectric jet device
JP2005026473A (ja) * 2003-07-02 2005-01-27 Sharp Corp 冷却装置およびそれを備えた電子機器
US20060196638A1 (en) * 2004-07-07 2006-09-07 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
US7336486B2 (en) * 2005-09-30 2008-02-26 Intel Corporation Synthetic jet-based heat dissipation device
BRPI0715138A2 (pt) * 2006-08-09 2013-06-04 Koninkl Philips Electronics Nv sistema micro-fluÍdico, mÉtodos para fabricar um sistema micro-fluÍdico e para controlar um fluxo de fluido atravÉs de um micro-canal de um sistema micro-fluÍdico, e, uso do sistema micro-fluÍdico
US8322889B2 (en) * 2006-09-12 2012-12-04 GE Lighting Solutions, LLC Piezofan and heat sink system for enhanced heat transfer
JP2008280917A (ja) * 2007-05-10 2008-11-20 Alps Electric Co Ltd 圧電式気体噴射装置
CN101803011B (zh) * 2007-09-14 2012-06-27 株式会社村田制作所 冷却装置
JP5089538B2 (ja) * 2008-09-12 2012-12-05 古河電気工業株式会社 圧電ファン付きヒートシンク
US10274263B2 (en) * 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US20110150669A1 (en) * 2009-12-18 2011-06-23 Frayne Shawn Michael Non-Propeller Fan
KR101275361B1 (ko) * 2011-05-26 2013-06-17 삼성전기주식회사 압전 방식의 냉각 장치
US9006956B2 (en) * 2012-05-09 2015-04-14 Qualcomm Incorporated Piezoelectric active cooling device
US9559287B2 (en) * 2014-07-11 2017-01-31 The Boeing Company Orthotropic bimorph for improved performance synthetic jet
US9932992B2 (en) * 2014-07-30 2018-04-03 R-Flow Co., Ltd. Piezoelectric fan
US10184493B2 (en) * 2016-03-04 2019-01-22 Tung Thanh NGUYEN Piezo flapping fan

Also Published As

Publication number Publication date
CA2958278A1 (en) 2016-03-03
JP2017532477A (ja) 2017-11-02
CN106662122B (zh) 2020-06-16
US20170276149A1 (en) 2017-09-28
JP6542872B2 (ja) 2019-07-10
EP3186516A1 (en) 2017-07-05
CN106662122A (zh) 2017-05-10
CA2958278C (en) 2020-03-24
WO2016032429A1 (en) 2016-03-03

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements