BR112015030497A2 - método para fazer um dispositivo eletrônico antitrincas. - Google Patents

método para fazer um dispositivo eletrônico antitrincas.

Info

Publication number
BR112015030497A2
BR112015030497A2 BR112015030497A BR112015030497A BR112015030497A2 BR 112015030497 A2 BR112015030497 A2 BR 112015030497A2 BR 112015030497 A BR112015030497 A BR 112015030497A BR 112015030497 A BR112015030497 A BR 112015030497A BR 112015030497 A2 BR112015030497 A2 BR 112015030497A2
Authority
BR
Brazil
Prior art keywords
antitrack
electronic
making
electronic antitrack
antitrack device
Prior art date
Application number
BR112015030497A
Other languages
English (en)
Other versions
BR112015030497B1 (pt
Inventor
Allot Francis
Blachon Frédéric
Lankinen Mikko
Lombardo Sophie
Kamagate Youssiph
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of BR112015030497A2 publication Critical patent/BR112015030497A2/pt
Publication of BR112015030497B1 publication Critical patent/BR112015030497B1/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Details Of Aerials (AREA)
BR112015030497-4A 2013-06-07 2014-06-03 Método para fazer um dispositivo eletrônico antitrincas BR112015030497B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13305764.6 2013-06-07
EP13305764.6A EP2811427A1 (fr) 2013-06-07 2013-06-07 Procédé de fabrication d'un dispositif électronique anti-fissuration
PCT/EP2014/061473 WO2014195308A1 (fr) 2013-06-07 2014-06-03 Procede de fabrication d'un dispositif electronique anti-fissuration

Publications (2)

Publication Number Publication Date
BR112015030497A2 true BR112015030497A2 (pt) 2017-07-25
BR112015030497B1 BR112015030497B1 (pt) 2023-01-10

Family

ID=48692409

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015030497-4A BR112015030497B1 (pt) 2013-06-07 2014-06-03 Método para fazer um dispositivo eletrônico antitrincas

Country Status (7)

Country Link
US (1) US10395158B2 (pt)
EP (2) EP2811427A1 (pt)
KR (2) KR102069747B1 (pt)
CN (2) CN114757319A (pt)
BR (1) BR112015030497B1 (pt)
SG (1) SG11201509935SA (pt)
WO (1) WO2014195308A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3217330A1 (fr) * 2016-03-07 2017-09-13 Gemalto Sa Procede de fabrication de module a puce de circuit integre et dispositif comprenant un tel module
CN108564159B (zh) * 2018-07-09 2023-11-24 东莞市芯安智能科技有限公司 一种双界面智能卡
WO2021079165A1 (en) * 2019-10-22 2021-04-29 Linxens Holding Rfid device having an antenna with increased weight
WO2022042963A1 (en) * 2020-08-27 2022-03-03 Linxens Holding A pre-form for a smartcard, a smartcard and a method of forming the same
FR3138546A1 (fr) 2022-08-01 2024-02-02 Paragon Id Dispositif électronique stratifié et procédé de fabrication d’un tel dispositif

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601477B1 (fr) 1986-07-11 1988-10-21 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
US5608262A (en) * 1995-02-24 1997-03-04 Lucent Technologies Inc. Packaging multi-chip modules without wire-bond interconnection
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
US5889654A (en) * 1997-04-09 1999-03-30 International Business Machines Corporation Advanced chip packaging structure for memory card applications
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
WO2001067513A1 (fr) * 2000-03-09 2001-09-13 Fujitsu Limited Dispositif a semi-conducteurs, araignee de connexions, et procedes de fabrication correspondants
DE10016135A1 (de) * 2000-03-31 2001-10-18 Infineon Technologies Ag Gehäusebaugruppe für ein elektronisches Bauteil
US20020020898A1 (en) * 2000-08-16 2002-02-21 Vu Quat T. Microelectronic substrates with integrated devices
JP3794411B2 (ja) * 2003-03-14 2006-07-05 セイコーエプソン株式会社 表示装置および電子機器
FR2861201B1 (fr) 2003-10-17 2006-01-27 Oberthur Card Syst Sa Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue.
FR2882174B1 (fr) 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
US8083150B2 (en) * 2005-09-26 2011-12-27 Panasonic Corporation Noncontact information storage medium and method for manufacturing same
TWI325745B (en) * 2006-11-13 2010-06-01 Unimicron Technology Corp Circuit board structure and fabrication method thereof
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
US9697459B2 (en) * 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
FR2997535B1 (fr) * 2012-10-30 2016-07-08 Oberthur Technologies Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue

Also Published As

Publication number Publication date
CN105453115A (zh) 2016-03-30
KR102069747B1 (ko) 2020-01-28
CN114757319A (zh) 2022-07-15
KR20160018725A (ko) 2016-02-17
KR20170054535A (ko) 2017-05-17
WO2014195308A1 (fr) 2014-12-11
EP3005244B1 (fr) 2023-07-26
SG11201509935SA (en) 2016-01-28
BR112015030497B1 (pt) 2023-01-10
EP3005244A1 (fr) 2016-04-13
US10395158B2 (en) 2019-08-27
EP2811427A1 (fr) 2014-12-10
US20160125284A1 (en) 2016-05-05

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 03/06/2014, OBSERVADAS AS CONDICOES LEGAIS