FR2601477B1 - Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant - Google Patents
Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultantInfo
- Publication number
- FR2601477B1 FR2601477B1 FR8610207A FR8610207A FR2601477B1 FR 2601477 B1 FR2601477 B1 FR 2601477B1 FR 8610207 A FR8610207 A FR 8610207A FR 8610207 A FR8610207 A FR 8610207A FR 2601477 B1 FR2601477 B1 FR 2601477B1
- Authority
- FR
- France
- Prior art keywords
- card
- mounting
- integrated circuit
- resulting
- electronic microcircuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8610207A FR2601477B1 (fr) | 1986-07-11 | 1986-07-11 | Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8610207A FR2601477B1 (fr) | 1986-07-11 | 1986-07-11 | Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2601477A1 FR2601477A1 (fr) | 1988-01-15 |
FR2601477B1 true FR2601477B1 (fr) | 1988-10-21 |
Family
ID=9337391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8610207A Expired FR2601477B1 (fr) | 1986-07-11 | 1986-07-11 | Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2601477B1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1002529A6 (nl) * | 1988-09-27 | 1991-03-12 | Bell Telephone Mfg | Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast. |
US4954878A (en) * | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
DE4223371A1 (de) * | 1992-07-16 | 1994-01-20 | Thomson Brandt Gmbh | Verfahren und Platine zur Montage von Bauelementen |
FR2703489B1 (fr) * | 1993-03-30 | 1995-06-02 | Francois Droz | Procédé de fabrication d'une carte comprenant au moins un élément électronique et carte obtenue par un tel procédé. |
DK0650620T4 (da) * | 1993-03-18 | 2001-12-10 | Nagraid Sa | Fremgangsmåde til fremstilling af kort omfattende mindst ét elektronisk element og et kort tilvejebragt ved en sådan fremgangsmåde |
CN1236982A (zh) * | 1998-01-22 | 1999-12-01 | 株式会社日立制作所 | 压力接触型半导体器件及其转换器 |
EP2811427A1 (fr) | 2013-06-07 | 2014-12-10 | Gemalto SA | Procédé de fabrication d'un dispositif électronique anti-fissuration |
EP2871595A1 (fr) * | 2013-11-12 | 2015-05-13 | Gemalto SA | Carte à puce comprenant un module électronique électriquement connecté à un circuit électrique |
GB2548639A (en) * | 2016-03-24 | 2017-09-27 | Zwipe As | Method of manufacturing a smartcard |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2439438A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux |
FR2440077A1 (fr) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication |
-
1986
- 1986-07-11 FR FR8610207A patent/FR2601477B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2601477A1 (fr) | 1988-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2584235B1 (fr) | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques | |
FR2599893B1 (fr) | Procede de montage d'un module electronique sur un substrat et carte a circuit integre | |
FR2584236B1 (fr) | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques | |
FR2660092B1 (fr) | Procede de fabrication d'une carte a circuit integre. | |
FR2562287B1 (fr) | Dispositif electronique en forme de carte | |
FR2603766B1 (fr) | Dispositif et procede pour le montage automatique d'elements de circuit sur une plaquette a circuits imprimes | |
FR2502816B1 (fr) | Carte d'identification comportant un module de circuit integre | |
FR2519166B1 (fr) | Carte d'identification comprenant un module de circuit integre | |
FR2507800B1 (fr) | Procede de fabrication d'une carte d'identification comportant un module incorpore a circuit integre | |
FR2691817B1 (fr) | Procede et carte electronique pour le developpement d'un circuit integre. | |
FR2756955B1 (fr) | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact | |
BE889816A (fr) | Carte d'identification comportant un module a circuit integre et procede de fabrication | |
FR2591780B1 (fr) | Dispositif electronique portatif, tel qu'une carte a circuit integre | |
DE3585439D1 (de) | Sicherheitsmodul fuer eine elektronische geldueberweisungsvorrichtung. | |
FR2666190B1 (fr) | Procede et dispositif d'encapsulation hermetique de composants electroniques. | |
FR2762929B1 (fr) | Boitier de semi-conducteur ayant un element semi-conducteur, une structure de fixation de boitier de semi-conducteur montee sur une plaquette de circuits imprimes, et procede d'assemblage de boitier de semi-conducteur | |
FR2729045B1 (fr) | Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes | |
FR2646942B1 (fr) | Carte a circuit integre | |
DE59804136D1 (de) | Modular aufgebauter, elektronischer datenträger | |
FR2591007B1 (fr) | Procede de paiement electronique a l'aide d'une carte a memoire | |
GB2308213B (en) | Integrated circuit (IC) card reader | |
IT8967974A0 (it) | Sistema di montaggio e di collegamento di schede di circuiti elettronici, in particolare per l'impiego a bordo di autoveicoli | |
FR2601477B1 (fr) | Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant | |
BE892607A (fr) | Carte d'identite pourvue d'un composant a circuit integre | |
FR2781298B1 (fr) | Procede de fabrication d'une carte a puce electronique et carte a puce electronique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CL | Concession to grant licenses | ||
CA | Change of address | ||
TP | Transmission of property |