BR112014018456A8 - STACKED INTEGRATED COMPONENT MEDIA INSERTION ELEMENT FOR AN OPHTHALMIC DEVICE - Google Patents

STACKED INTEGRATED COMPONENT MEDIA INSERTION ELEMENT FOR AN OPHTHALMIC DEVICE

Info

Publication number
BR112014018456A8
BR112014018456A8 BR112014018456A BR112014018456A BR112014018456A8 BR 112014018456 A8 BR112014018456 A8 BR 112014018456A8 BR 112014018456 A BR112014018456 A BR 112014018456A BR 112014018456 A BR112014018456 A BR 112014018456A BR 112014018456 A8 BR112014018456 A8 BR 112014018456A8
Authority
BR
Brazil
Prior art keywords
integrated component
stacked integrated
insertion element
ophthalmic device
stacked
Prior art date
Application number
BR112014018456A
Other languages
Portuguese (pt)
Other versions
BR112014018456A2 (en
Inventor
B Pugh Randall
A Flitsch Frederick
B Otts Daniel
Daniel Riall James
Toner Adam
Original Assignee
Johnson & Johnson Vision Care
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,577 external-priority patent/US9914273B2/en
Application filed by Johnson & Johnson Vision Care filed Critical Johnson & Johnson Vision Care
Publication of BR112014018456A2 publication Critical patent/BR112014018456A2/pt
Publication of BR112014018456A8 publication Critical patent/BR112014018456A8/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Abstract

ELEMENTO DE INSERÇÃO DE MÍDIA DE COMPONENTE INTEGRADO EMPILHADO PARA UM DISPOSITIVO OFTÁLMICO. A presente invenção refere-se a um método para form ar um elemento de inserção de camada de componente integrado empilhado e a um elemento de inserção de camada de componente integrado empilhado. O elemento de inserção de camada de componente compreende camadas de substrato com funcionalidade. As camadas de substrato são montadas para formar interconexões elétricas entre as camadas de substrato que criam um recurso empilhado .O recurso empilhado é encapsulado com um material para ligação dentro do corpo de uma lente oftálmica moldada.STACKED INTEGRATED COMPONENT MEDIA INSERTION ELEMENT FOR AN OPHTHALMIC DEVICE. The present invention relates to a method of forming a stacked integrated component layer insert and a stacked integrated component layer insert. The component layer insert comprises substrate layers with functionality. The substrate layers are assembled to form electrical interconnections between the substrate layers that create a stacked feature. The stacked feature is encapsulated with a bonding material within the body of a molded ophthalmic lens.

BR112014018456A 2012-01-26 2013-01-25 STACKED INTEGRATED COMPONENT MEDIA INSERTION ELEMENT FOR AN OPHTHALMIC DEVICE BR112014018456A8 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
PCT/US2013/023182 WO2013112862A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Publications (2)

Publication Number Publication Date
BR112014018456A2 BR112014018456A2 (en) 2017-06-20
BR112014018456A8 true BR112014018456A8 (en) 2017-07-11

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014018456A BR112014018456A8 (en) 2012-01-26 2013-01-25 STACKED INTEGRATED COMPONENT MEDIA INSERTION ELEMENT FOR AN OPHTHALMIC DEVICE

Country Status (12)

Country Link
EP (1) EP2807518A1 (en)
JP (1) JP6312605B2 (en)
KR (1) KR20140117618A (en)
CN (1) CN104204914B (en)
AU (1) AU2013211968B2 (en)
BR (1) BR112014018456A8 (en)
CA (1) CA2862666A1 (en)
HK (1) HK1204680A1 (en)
RU (1) RU2629902C2 (en)
SG (1) SG11201404174SA (en)
TW (1) TWI616325B (en)
WO (1) WO2013112862A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (en) * 2015-06-01 2021-05-06 삼성전자주식회사 Contact lens with an energy harvesting unit
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (en) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 A kind of production method of intelligent invisible glasses

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837190A (en) * 1994-07-22 1996-02-06 Nec Corp Semiconductor device
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (en) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 Surface electrode structure of ceramic multilayer substrate and method of manufacturing surface electrode
WO2004015460A2 (en) * 2002-08-09 2004-02-19 E-Vision, Llc Electro-active contact lens system
EP1760515A3 (en) * 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (en) * 2006-01-10 2009-03-25 E-视觉有限公司 An improved device and method for manufacturing an electro-active spectacle lens involving a mechanically flexible integration insert
JP5011820B2 (en) * 2006-05-24 2012-08-29 オムロン株式会社 Multilayer device and manufacturing method thereof
AR064985A1 (en) * 2007-01-22 2009-05-06 E Vision Llc FLEXIBLE ELECTROACTIVE LENS
WO2008103906A2 (en) * 2007-02-23 2008-08-28 Pixeloptics, Inc. Ophthalmic dynamic aperture
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
WO2010082993A2 (en) * 2008-12-11 2010-07-22 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
WO2011163080A1 (en) * 2010-06-20 2011-12-29 Elenza, Inc. Ophthalmic devices and methods with application specific integrated circuits

Also Published As

Publication number Publication date
TW201341165A (en) 2013-10-16
CN104204914A (en) 2014-12-10
CA2862666A1 (en) 2013-08-01
TWI616325B (en) 2018-03-01
KR20140117618A (en) 2014-10-07
HK1204680A1 (en) 2015-11-27
SG11201404174SA (en) 2014-10-30
EP2807518A1 (en) 2014-12-03
RU2629902C2 (en) 2017-09-04
BR112014018456A2 (en) 2017-06-20
AU2013211968B2 (en) 2016-09-29
CN104204914B (en) 2018-06-15
WO2013112862A1 (en) 2013-08-01
JP6312605B2 (en) 2018-04-18
AU2013211968A1 (en) 2014-09-11
JP2015510143A (en) 2015-04-02
RU2014134722A (en) 2016-03-20

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2551 DE 26-11-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.