BR0208242A - Processos de tratamento por plasma de uma superfìcie a tratar de um objeto ou partìculas e de formação de pós e, dispositivo para a realização de um processo de tratamento de superfìcie - Google Patents
Processos de tratamento por plasma de uma superfìcie a tratar de um objeto ou partìculas e de formação de pós e, dispositivo para a realização de um processo de tratamento de superfìcieInfo
- Publication number
- BR0208242A BR0208242A BR0208242-0A BR0208242A BR0208242A BR 0208242 A BR0208242 A BR 0208242A BR 0208242 A BR0208242 A BR 0208242A BR 0208242 A BR0208242 A BR 0208242A
- Authority
- BR
- Brazil
- Prior art keywords
- surface treatment
- plasma
- particles
- carrying
- powder formation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Plasma Technology (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cleaning In General (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Drying Of Semiconductors (AREA)
Abstract
"PROCESSOS DE TRATAMENTO POR PLASMA DE UMA SUPERFìCIE A TRATAR DE UM OBJETO OU PARTìCULAS E DE FORMAçãO DE PóS E, DISPOSITIVO PARA A REALIZAçãO DE UM PROCESSO DE TRATAMENTO DE SUPERFìCIE." Um processo de tratamento por plasma de uma superfície a tratar de um objeto ou partículas, compreende a criação de um plasma e a aplicação do plasma contra a superfície a tratar, é caracterizado em que se excita a superfície a tratar ou que se faz vibrar acusticamente o plasma para criar um movimento ondulatório da superfície a tratar ou para criar um movimento ondulatório relativo entre o plasma e a superfície a tratar.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01810318 | 2001-03-27 | ||
EP01120974 | 2001-08-31 | ||
EP01810915 | 2001-09-20 | ||
PCT/IB2002/001001 WO2002076511A2 (fr) | 2001-03-27 | 2002-03-26 | Procédé de traitement de surface par plasma et dispositif pour la mise en oeuvre du procédé |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0208242A true BR0208242A (pt) | 2004-04-13 |
Family
ID=27224223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0208242-0A BR0208242A (pt) | 2001-03-27 | 2002-03-26 | Processos de tratamento por plasma de uma superfìcie a tratar de um objeto ou partìculas e de formação de pós e, dispositivo para a realização de um processo de tratamento de superfìcie |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1374276B1 (pt) |
JP (1) | JP2004527077A (pt) |
CN (1) | CN100437883C (pt) |
AT (1) | ATE373314T1 (pt) |
AU (1) | AU2002242923A1 (pt) |
BR (1) | BR0208242A (pt) |
DE (1) | DE60222391T2 (pt) |
ES (1) | ES2294112T3 (pt) |
MX (1) | MXPA03008615A (pt) |
WO (1) | WO2002076511A2 (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2911610B1 (fr) * | 2007-01-24 | 2012-09-21 | Air Liquide | Procede de traitement de surface de substrats polymeres, substrats ainsi obtenus et leur utilisation pour la realisation de materiaux multicouches. |
NL1033408C2 (nl) * | 2007-02-16 | 2008-08-19 | Omve Netherlands B V | Werkwijze resp. inrichting voor het desinfecteren van micro-organismen etc. |
US8399795B2 (en) * | 2007-05-11 | 2013-03-19 | Force Technology | Enhancing plasma surface modification using high intensity and high power ultrasonic acoustic waves |
NL1033958C2 (nl) * | 2007-06-11 | 2008-12-12 | Omve Netherlands B V | Werkwijze voor het desinfecteren van kunststof flessen etc. |
CN101974298A (zh) * | 2010-11-11 | 2011-02-16 | 复旦大学 | 用氩等离子体处理金属表面方法 |
WO2012113568A1 (de) * | 2011-02-25 | 2012-08-30 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Desinfektionseinrichtung, behälter, verwendung eines behälters und desinfektionsverfahren zur desinfektion eines behälters, insbesondere für einen lebensmittelbehälter |
DE102012206081A1 (de) * | 2012-04-13 | 2013-10-17 | Krones Ag | Beschichtung von Behältern mit Plasmadüsen |
CN102785376B (zh) * | 2012-08-14 | 2016-03-30 | 明尼苏达矿业制造特殊材料(上海)有限公司 | 聚乙烯表面处理方法 |
JP6328537B2 (ja) * | 2014-10-31 | 2018-05-23 | エア・ウォーター・マッハ株式会社 | プラズマ処理方法およびプラズマ処理装置 |
JP5795427B1 (ja) * | 2014-12-26 | 2015-10-14 | 竹本容器株式会社 | 被膜付き樹脂容器の製造方法及び樹脂容器被覆装置 |
US20190093226A1 (en) * | 2016-04-08 | 2019-03-28 | Sio2 Medical Products, Inc. | Method for applying a pecvd lubricity layer with a moving gas inlet |
CN106944419A (zh) * | 2017-05-12 | 2017-07-14 | 中国工程物理研究院核物理与化学研究所 | 一种去除表面氚污染的等离子体去污*** |
Family Cites Families (28)
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US4778583A (en) * | 1987-05-11 | 1988-10-18 | Eastman Kodak Company | Semiconductor etching process which produces oriented sloped walls |
JPH01111333A (ja) * | 1987-10-26 | 1989-04-28 | Oki Electric Ind Co Ltd | ドライエッチング装置 |
DE3900768C1 (en) * | 1989-01-12 | 1990-02-22 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | Plasma etching device and method for operating it |
US5277740A (en) * | 1990-08-31 | 1994-01-11 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for forming a fine pattern |
JPH04111313A (ja) * | 1990-08-31 | 1992-04-13 | Mitsubishi Electric Corp | 微細加工装置及び方法 |
JPH04357662A (ja) * | 1991-04-19 | 1992-12-10 | Matsushita Electric Works Ltd | 無電極放電ランプ |
RU2000890C1 (ru) * | 1992-01-16 | 1993-10-15 | Совместное межотраслевое и межрегиональное производственно-торговое объединение "Край" | Установка дл получени ультрадисперсного порошка |
US5569502A (en) * | 1992-09-11 | 1996-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and method for forming a film |
JP3297881B2 (ja) * | 1992-10-27 | 2002-07-02 | イーシー化学株式会社 | 超微粒子の表面処理方法 |
JPH07106092A (ja) * | 1993-10-04 | 1995-04-21 | Matsushita Electric Ind Co Ltd | 衝撃波プラズマ発生装置 |
JPH07155529A (ja) * | 1993-12-01 | 1995-06-20 | Takuma Co Ltd | ガス処理装置とそれの運転方法 |
JP3459672B2 (ja) * | 1993-12-01 | 2003-10-20 | 株式会社タクマ | ガス処理装置 |
JP3287124B2 (ja) * | 1994-08-17 | 2002-05-27 | ソニー株式会社 | SiN系絶縁膜の成膜方法 |
JP3428169B2 (ja) * | 1994-08-31 | 2003-07-22 | ソニー株式会社 | ニオブ系薄膜のドライエッチング方法 |
JP3309581B2 (ja) * | 1994-08-31 | 2002-07-29 | ソニー株式会社 | ペロブスカイト型酸化膜のドライエッチング方法 |
DE4438359C2 (de) * | 1994-10-27 | 2001-10-04 | Schott Glas | Behälter aus Kunststoff mit einer Sperrbeschichtung |
JP3806847B2 (ja) * | 1995-11-24 | 2006-08-09 | イーシー化学株式会社 | 大気圧グロー放電プラズマによる粉体の処理方法及び装置 |
JPH09157845A (ja) * | 1995-12-06 | 1997-06-17 | Hitachi Ltd | カオス処理成膜装置,カオス処理成膜方法及びカオス処理成膜媒体 |
FR2744805B1 (fr) * | 1996-02-13 | 1998-03-20 | Pechiney Aluminium | Cibles de pulverisation cathodique selectionnees par controle ultrasons pour leur faible taux d'emissions de particules |
JPH1033976A (ja) * | 1996-05-24 | 1998-02-10 | Sekisui Chem Co Ltd | 放電プラズマ処理方法及びその装置 |
JPH1187098A (ja) * | 1997-09-03 | 1999-03-30 | Toshiba Corp | プラズマ処理装置 |
US6423924B1 (en) * | 1998-03-10 | 2002-07-23 | Tepla Ag | Method for treating the surface of a material or an object and implementing device |
JP3572942B2 (ja) * | 1998-05-22 | 2004-10-06 | 日新電機株式会社 | 放電ガス処理装置 |
JP2000077372A (ja) * | 1998-08-31 | 2000-03-14 | Sumitomo Metal Ind Ltd | 気相成長用半導体ウェーハの製造方法 |
JP3555470B2 (ja) * | 1998-12-04 | 2004-08-18 | セイコーエプソン株式会社 | 大気圧高周波プラズマによるエッチング方法 |
US6231933B1 (en) * | 1999-03-18 | 2001-05-15 | Primaxx, Inc. | Method and apparatus for metal oxide chemical vapor deposition on a substrate surface |
JP4372918B2 (ja) * | 1999-06-30 | 2009-11-25 | パナソニック電工株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP2001035691A (ja) * | 1999-07-16 | 2001-02-09 | Japan Atom Energy Res Inst | Zピンチ放電によるレーザー光ガイド用プラズマチャンネルの形成法 |
-
2002
- 2002-03-26 CN CNB028073835A patent/CN100437883C/zh not_active Expired - Fee Related
- 2002-03-26 DE DE60222391T patent/DE60222391T2/de not_active Expired - Lifetime
- 2002-03-26 WO PCT/IB2002/001001 patent/WO2002076511A2/fr active IP Right Grant
- 2002-03-26 BR BR0208242-0A patent/BR0208242A/pt not_active IP Right Cessation
- 2002-03-26 MX MXPA03008615A patent/MXPA03008615A/es not_active Application Discontinuation
- 2002-03-26 AT AT02708589T patent/ATE373314T1/de not_active IP Right Cessation
- 2002-03-26 ES ES02708589T patent/ES2294112T3/es not_active Expired - Lifetime
- 2002-03-26 EP EP02708589A patent/EP1374276B1/fr not_active Expired - Lifetime
- 2002-03-26 JP JP2002575023A patent/JP2004527077A/ja active Pending
- 2002-03-26 AU AU2002242923A patent/AU2002242923A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1374276B1 (fr) | 2007-09-12 |
EP1374276A2 (fr) | 2004-01-02 |
AU2002242923A1 (en) | 2002-10-08 |
DE60222391D1 (de) | 2007-10-25 |
WO2002076511A2 (fr) | 2002-10-03 |
ES2294112T3 (es) | 2008-04-01 |
CN1511333A (zh) | 2004-07-07 |
WO2002076511A3 (fr) | 2003-04-17 |
MXPA03008615A (es) | 2005-03-07 |
DE60222391T2 (de) | 2008-06-05 |
JP2004527077A (ja) | 2004-09-02 |
CN100437883C (zh) | 2008-11-26 |
ATE373314T1 (de) | 2007-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A(S) 8A E 9A ANUIDADE(S) |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2103 DE 26/04/2011. |