BR0207882A - Formação de modelo metálico - Google Patents
Formação de modelo metálicoInfo
- Publication number
- BR0207882A BR0207882A BR0207882-1A BR0207882A BR0207882A BR 0207882 A BR0207882 A BR 0207882A BR 0207882 A BR0207882 A BR 0207882A BR 0207882 A BR0207882 A BR 0207882A
- Authority
- BR
- Brazil
- Prior art keywords
- varnish
- layer
- metal surface
- base metal
- ablated
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000010953 base metal Substances 0.000 abstract 3
- 239000002966 varnish Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000969 carrier Substances 0.000 abstract 1
- 238000001962 electrophoresis Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Paints Or Removers (AREA)
Abstract
"FORMAçãO DE MODELO METáLICO". Um método de produzir-se reprodutivamente condutores de circuito com estruturas de circuito muito finas e um verniz eletroforético a ser aplicado neste método são descritos, nos quais um substrato dielétrico compreendendo uma superfície de metal base é fornecido. Uma camada de verniz é aplicada à superfície do substrato eletrodepositando o verniz eletroforético, portanto a camada de verniz sofre ablação em pelo menos partes das regiões que não correspondem ao modelo metálico a ser formado por meio de radiação ultravioleta, a superfície do metal base sendo deixada descoberta, e finalmente a superfície do metal base descoberta é causticada.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10112023A DE10112023A1 (de) | 2001-03-07 | 2001-03-07 | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
PCT/EP2002/001464 WO2002071466A1 (en) | 2001-03-07 | 2002-02-12 | Metal pattern formation |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0207882A true BR0207882A (pt) | 2004-03-02 |
Family
ID=7677266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0207882-1A BR0207882A (pt) | 2001-03-07 | 2002-02-12 | Formação de modelo metálico |
Country Status (14)
Country | Link |
---|---|
US (2) | US6593249B2 (pt) |
EP (1) | EP1366511B1 (pt) |
JP (1) | JP2004530291A (pt) |
KR (1) | KR20040030528A (pt) |
CN (1) | CN1305120C (pt) |
AT (1) | ATE301872T1 (pt) |
BR (1) | BR0207882A (pt) |
CA (1) | CA2435755A1 (pt) |
DE (2) | DE10112023A1 (pt) |
HK (1) | HK1057129A1 (pt) |
MX (1) | MXPA03007648A (pt) |
MY (1) | MY141591A (pt) |
TW (1) | TW573446B (pt) |
WO (1) | WO2002071466A1 (pt) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19944908A1 (de) * | 1999-09-10 | 2001-04-12 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten |
DE10112023A1 (de) * | 2001-03-07 | 2002-10-02 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
KR100577406B1 (ko) * | 2003-09-17 | 2006-05-10 | 박재상 | Pcb 방식을 이용한 히터 제조방법 및 히터 |
KR101255866B1 (ko) * | 2004-11-30 | 2013-04-17 | 가부시끼가이샤 다이셀 | 지환식 에폭시(메트)아크릴레이트 및 그의 제조 방법, 및공중합체 |
US20060250744A1 (en) * | 2005-05-05 | 2006-11-09 | Mctigue Michael T | Micro gap method and ESD protection device |
CN102490526B (zh) * | 2011-11-15 | 2013-09-25 | 东莞市泉硕五金加工有限公司 | 一种在工件表面镀膜和设置图案的方法 |
JP2015023251A (ja) * | 2013-07-23 | 2015-02-02 | ソニー株式会社 | 多層配線基板およびその製造方法、並びに半導体製品 |
US10438812B2 (en) * | 2017-03-30 | 2019-10-08 | Intel Corporation | Anisotropic etching systems and methods using a photochemically enhanced etchant |
FR3077302B1 (fr) * | 2018-01-29 | 2019-12-27 | Avipo | Depot de pvd en fond de gravure |
CN110634999A (zh) * | 2018-06-21 | 2019-12-31 | 君泰创新(北京)科技有限公司 | 太阳能电池及其制作方法 |
CN112892619B (zh) * | 2019-12-04 | 2022-07-15 | 香港城市大学深圳研究院 | 弧形边缘截面的pdms母模、微流控阀和芯片及其制备 |
CN110996553B (zh) * | 2019-12-17 | 2021-06-04 | 中国电子科技集团公司第五十八研究所 | 一种适用于深腔型印制板的焊膏分配方法 |
DE102020201869A1 (de) | 2020-02-14 | 2021-08-19 | Robert Bosch Gesellschaft mit beschränkter Haftung | Schaltungsträger mit einer keramischen Lotstopp-Barriere |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1811377A1 (de) * | 1968-11-28 | 1970-06-18 | Telefunken Patent | Verfahren zur Herstellung gedruckter Leiterplatten |
US3755119A (en) * | 1971-04-29 | 1973-08-28 | American Cyanamid Co | Article electrocoated with adhesively bondable acrylic resin containing bis-urea |
US4345969A (en) * | 1981-03-23 | 1982-08-24 | Motorola, Inc. | Metal etch solution and method |
DE3113855A1 (de) * | 1981-04-06 | 1982-10-21 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur herstellung von leiterplatten |
JPS59227186A (ja) | 1983-06-08 | 1984-12-20 | 株式会社ヤマトヤ商会 | 銅スル・ホ−ル基板の製造方法 |
US4592816A (en) * | 1984-09-26 | 1986-06-03 | Rohm And Haas Company | Electrophoretic deposition process |
US4708925A (en) * | 1984-12-11 | 1987-11-24 | Minnesota Mining And Manufacturing Company | Photosolubilizable compositions containing novolac phenolic resin |
JPH0644150B2 (ja) | 1986-05-09 | 1994-06-08 | 関西ペイント株式会社 | プリント配線フオトレジスト用電着塗料組成物 |
EP0662636A3 (en) | 1986-10-23 | 1995-11-22 | Ciba Geigy Ag | Imaging processes. |
US4871591A (en) | 1987-01-27 | 1989-10-03 | Kansai Paint Company, Limited | Finish coating method |
DE3732249A1 (de) * | 1987-09-24 | 1989-04-13 | Siemens Ag | Verfahren zur herstellung von dreidimensionalen leiterplatten |
US4943346A (en) * | 1988-09-29 | 1990-07-24 | Siemens Aktiengesellschaft | Method for manufacturing printed circuit boards |
US5104480A (en) * | 1990-10-12 | 1992-04-14 | General Electric Company | Direct patterning of metals over a thermally inefficient surface using a laser |
JPH0539444A (ja) * | 1990-11-30 | 1993-02-19 | Hitachi Chem Co Ltd | ポジ型感光性アニオン電着塗料樹脂組成物、これを用いた電着塗装浴、電着塗装法及びプリント回路板の製造方法 |
US5211805A (en) * | 1990-12-19 | 1993-05-18 | Rangaswamy Srinivasan | Cutting of organic solids by continuous wave ultraviolet irradiation |
JPH04329543A (ja) * | 1991-04-30 | 1992-11-18 | Toagosei Chem Ind Co Ltd | フォトレジスト膜形成用電着塗料組成物 |
DE4131065A1 (de) * | 1991-08-27 | 1993-03-04 | Siemens Ag | Verfahren zur herstellung von leiterplatten |
JPH06145602A (ja) | 1992-09-02 | 1994-05-27 | Nippon Paint Co Ltd | 熱硬化性塗料組成物 |
US5354633A (en) * | 1993-09-22 | 1994-10-11 | Presstek, Inc. | Laser imageable photomask constructions |
CA2134156A1 (en) * | 1993-11-22 | 1995-05-23 | Thomas P. Klun | Coatable compositions, abrasive articles made therefrom, and methods of making and using same |
DE4417245A1 (de) * | 1994-04-23 | 1995-10-26 | Lpkf Cad Cam Systeme Gmbh | Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten |
EP0757885B1 (de) * | 1994-04-25 | 1998-08-12 | Siemens S.A. | Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen |
US5705570A (en) | 1995-06-07 | 1998-01-06 | International Business Machines Corporation | Ablatively photodecomposable compositions |
US5830836A (en) * | 1995-10-27 | 1998-11-03 | Eldorado Chemical Co., Inc. | Compositions and methods for coating removal |
DE10112023A1 (de) * | 2001-03-07 | 2002-10-02 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
-
2001
- 2001-03-07 DE DE10112023A patent/DE10112023A1/de not_active Withdrawn
- 2001-05-10 US US09/852,384 patent/US6593249B2/en not_active Expired - Fee Related
-
2002
- 2002-02-12 WO PCT/EP2002/001464 patent/WO2002071466A1/en active IP Right Grant
- 2002-02-12 US US10/469,374 patent/US20040069636A1/en not_active Abandoned
- 2002-02-12 CN CNB028061470A patent/CN1305120C/zh not_active Expired - Fee Related
- 2002-02-12 MX MXPA03007648A patent/MXPA03007648A/es not_active Application Discontinuation
- 2002-02-12 KR KR10-2003-7011688A patent/KR20040030528A/ko not_active Application Discontinuation
- 2002-02-12 DE DE60205464T patent/DE60205464T2/de not_active Expired - Lifetime
- 2002-02-12 BR BR0207882-1A patent/BR0207882A/pt not_active Application Discontinuation
- 2002-02-12 JP JP2002570285A patent/JP2004530291A/ja active Pending
- 2002-02-12 AT AT02719808T patent/ATE301872T1/de not_active IP Right Cessation
- 2002-02-12 EP EP02719808A patent/EP1366511B1/en not_active Expired - Lifetime
- 2002-02-12 CA CA002435755A patent/CA2435755A1/en not_active Abandoned
- 2002-02-25 MY MYPI20020636A patent/MY141591A/en unknown
- 2002-03-01 TW TW91103786A patent/TW573446B/zh not_active IP Right Cessation
-
2003
- 2003-12-24 HK HK03109374A patent/HK1057129A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE301872T1 (de) | 2005-08-15 |
HK1057129A1 (en) | 2004-03-12 |
CN1305120C (zh) | 2007-03-14 |
TW573446B (en) | 2004-01-21 |
CN1541409A (zh) | 2004-10-27 |
DE60205464T2 (de) | 2006-05-24 |
US20040069636A1 (en) | 2004-04-15 |
US20030036288A1 (en) | 2003-02-20 |
EP1366511B1 (en) | 2005-08-10 |
DE60205464D1 (de) | 2005-09-15 |
MXPA03007648A (es) | 2003-12-04 |
KR20040030528A (ko) | 2004-04-09 |
MY141591A (en) | 2010-05-14 |
US6593249B2 (en) | 2003-07-15 |
EP1366511A1 (en) | 2003-12-03 |
DE10112023A1 (de) | 2002-10-02 |
CA2435755A1 (en) | 2002-09-12 |
WO2002071466A1 (en) | 2002-09-12 |
JP2004530291A (ja) | 2004-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR0207882A (pt) | Formação de modelo metálico | |
DK0679052T3 (da) | Fremgangsmåde til struktureret metallisering af substratoverflader | |
SG126765A1 (en) | Laser beam processing method and laser beam processing machine | |
MY134849A (en) | Laser annealing method and semiconductor device fabricating method | |
ATE398343T1 (de) | Beschichtetes substrat mit frequenzselektiver oberfläche | |
ATE355726T1 (de) | Verbessertes verfahren zur herstellung leitender spuren und so hergestellte gedruckte leiterplatten | |
TW200501216A (en) | Organic semiconductor device and method of manufacture of same | |
MY134252A (en) | Method for forming a magnetic pattern in a magnetic recording medium, magnetic recording medium, magnetic recording device and photomask | |
DE50000836D1 (de) | Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial | |
ATE216322T1 (de) | Diamantmarkierverfahren | |
ATE373411T1 (de) | Verfahren zur modifizierung von oberflächen | |
WO2001020059A3 (de) | Verfahren zum bilden eines leitermusters auf dielektrischen substraten | |
TW328167B (en) | Method for manufacturing lead frame | |
DE60216182D1 (de) | Verfahren zur Herstellung einer gedruckten Leiterplatte | |
ATE250323T1 (de) | Verfahren zur herstellung von leiterplatten mit groben leiterstrukturen und mindestens einem bereich mit feinen leiterstrukturen | |
TH59178B (th) | การขึ้นรูปแบบรูปโลหะ | |
DE59903322D1 (de) | Verfahren zum erzeugen einer struktur in einem substrat | |
WO2004086147A3 (en) | Method of imparting patterns of surface relief to rigid substrates | |
KR970076503A (ko) | 박막 자기 헤드의 코일 제조방법 | |
TW200516653A (en) | Method for manufacturing gate structure with sides of its metal layer partially removed |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |