BE690811A - - Google Patents

Info

Publication number: BE690811A
Authority: BE; Belgium

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1965-06-11

Filing date

1966-12-07

Publication date

1967-05-16

1966-12-07 Application filed filed Critical

1967-05-16 Publication of BE690811A publication Critical patent/BE690811A/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys

BE690811D 1965-06-11 1966-12-07 BE690811A (xx)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DES0097564		1965-06-11
DES0100912		1965-12-11

Publications (1)

Publication Number	Publication Date
BE690811A true BE690811A (xx)	1967-05-16

Family

ID=25998118

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
BE681655D BE681655A (xx)	1965-06-11	1966-05-26
BE690811D BE690811A (xx)	1965-06-11	1966-12-07

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
BE681655D BE681655A (xx)	1965-06-11	1966-05-26

Country Status (7)

Country	Link
US (2)	US3441812A (xx)
BE (2)	BE681655A (xx)
DE (2)	DE1483298B1 (xx)
FR (1)	FR1504284A (xx)
GB (2)	GB1106287A (xx)
NL (2)	NL6607137A (xx)
SE (1)	SE321723B (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3664874A (en) *	1969-12-31	1972-05-23	Nasa	Tungsten contacts on silicon substrates
US3989546A (en) *	1971-05-10	1976-11-02	Arco Medical Products Company	Thermoelectric generator with hinged assembly for fins
DE2739242C2 (de) *	1977-08-31	1979-10-04	Siemens Ag, 1000 Berlin Und 8000 Muenchen	Hochleistungsstromrichter
AU555193B2 (en) *	1980-11-10	1986-09-18	Edwin James Freeburn	Cooling device
US5028988A (en) *	1989-12-27	1991-07-02	Ncr Corporation	Method and apparatus for low temperature integrated circuit chip testing and operation
GB9015687D0 (en) *	1990-07-17	1990-09-05	Global Domestic Prod Ltd	Peltier devices
JP2002518989A (ja) *	1996-12-02	2002-06-25	ラリガン，パスカル	わずかな温度差から低消費電力の自立型装置に電気を供給することを可能にする熱出力変換器
US5936193A (en) *	1997-05-09	1999-08-10	Parise; Ronald J.	Nighttime solar cell
US20060021648A1 (en) *	1997-05-09	2006-02-02	Parise Ronald J	Device and method to transmit waste heat or thermal pollution into deep space
JP4446064B2 (ja) *	2004-07-07	2010-04-07	独立行政法人産業技術総合研究所	熱電変換素子及び熱電変換モジュール
CN101836285B (zh)	2007-08-21	2014-11-12	加州大学评议会	具有高性能热电性质的纳米结构
US20110114146A1 (en) *	2009-11-13	2011-05-19	Alphabet Energy, Inc.	Uniwafer thermoelectric modules
US9240328B2 (en)	2010-11-19	2016-01-19	Alphabet Energy, Inc.	Arrays of long nanostructures in semiconductor materials and methods thereof
US8736011B2 (en)	2010-12-03	2014-05-27	Alphabet Energy, Inc.	Low thermal conductivity matrices with embedded nanostructures and methods thereof
US9051175B2 (en)	2012-03-07	2015-06-09	Alphabet Energy, Inc.	Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same
US9257627B2 (en)	2012-07-23	2016-02-09	Alphabet Energy, Inc.	Method and structure for thermoelectric unicouple assembly
US9082930B1 (en)	2012-10-25	2015-07-14	Alphabet Energy, Inc.	Nanostructured thermolectric elements and methods of making the same
US9691849B2 (en)	2014-04-10	2017-06-27	Alphabet Energy, Inc.	Ultra-long silicon nanostructures, and methods of forming and transferring the same
DE102016209683A1 (de) *	2016-06-02	2017-12-07	Mahle International Gmbh	Thermoelektrisches Modul

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH328594A (fr) *	1954-07-03	1958-03-15	Csf	Dispositif électronique comportant un élément semi-conducteur
NL98125C (xx) *	1954-08-26	1900-01-01
DE1080313B (de) *	1954-09-18	1960-04-21	Siemens Planiawerke Ag	Molybdaendisilizid enthaltende Werkstuecke fuer hohe Temperaturen, insbesondere elektrisches Heizelement
US2902392A (en) *	1954-09-18	1959-09-01	Siemens Planiawerke Ag	Work pieces for high temperature operation and method of making them
DE1189282B (de) *	1954-12-28	1965-03-18	Siemens Planiawerke Ag	Verwendung einer Sinterlegierung aus Kohlenstoff, Silizium und Molybdaen als Werkstoff zur Herstellung von warmfesten, elektrisch leitenden Teilen
NL109558C (xx) *	1955-05-10	1900-01-01
US2898743A (en) *	1956-07-23	1959-08-11	Philco Corp	Electronic cooling device and method for the fabrication thereof
DE1155609B (de) *	1956-12-04	1963-10-10	Union Carbide Corp	Ausgangsmaterial zur Herstellung oxydationsbestaendiger und hochtemperaturfester Gegenstaende, insbesondere selbst regenerierende Schutzueberzuege fuer Metallkoerper
US2952786A (en) *	1957-04-12	1960-09-13	Minnesota Mining & Mfg	Temperature compensated crystal device
DE1120154B (de) *	1958-04-29	1961-12-21	Union Carbide Corp	Gesinterte feuerfeste Hartmetallegierung auf der Grundlage von Molybdaendisilicid
US3086886A (en) *	1958-06-04	1963-04-23	Schwarzkopf Dev Co	Process of providing oxidizable refractory-metal bodies with a corrosion-resistant surface coating
SE175893C1 (xx) *	1958-07-16	1961-07-04	Kanthal Ab
US2955145A (en) *	1958-07-16	1960-10-04	Kanthal Ab	Thermo-electric alloys
US2994203A (en) *	1960-01-14	1961-08-01	Westinghouse Electric Corp	Thermoelectric cooling device
NL299055A (xx) *	1961-06-09
US3256699A (en) *	1962-01-29	1966-06-21	Monsanto Co	Thermoelectric unit and process of using to interconvert heat and electrical energy
US3192065A (en) *	1962-06-01	1965-06-29	North American Aviation Inc	Method of forming molybdenum silicide coating on molybdenum
US3342567A (en) *	1963-12-27	1967-09-19	Rca Corp	Low resistance bonds to germaniumsilicon bodies and method of making such bonds

1965
- 1965-06-11 DE DE19651483298 patent/DE1483298B1/de active Pending
- 1965-12-11 DE DE19651489283 patent/DE1489283B2/de active Pending
1966
- 1966-05-24 NL NL6607137A patent/NL6607137A/xx unknown
- 1966-05-26 BE BE681655D patent/BE681655A/xx unknown
- 1966-06-13 GB GB26335/66A patent/GB1106287A/en not_active Expired
- 1966-12-07 US US599934A patent/US3441812A/en not_active Expired - Lifetime
- 1966-12-07 BE BE690811D patent/BE690811A/xx unknown
- 1966-12-09 FR FR86935A patent/FR1504284A/fr not_active Expired
- 1966-12-09 SE SE16915/66A patent/SE321723B/xx unknown
- 1966-12-09 NL NL6617324A patent/NL6617324A/xx unknown
- 1966-12-12 GB GB55640/66A patent/GB1106260A/en not_active Expired
1969
- 1969-06-09 US US834595A patent/US3523832A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE1489283B2 (de)	1970-10-15
DE1489283A1 (de)	1970-02-26
FR1504284A (fr)	1967-12-01
GB1106260A (en)	1968-03-13
US3441812A (en)	1969-04-29
NL6617324A (xx)	1967-06-12
SE321723B (xx)	1970-03-16
NL6607137A (xx)	1966-12-12
GB1106287A (en)	1968-03-13
DE1483298B1 (de)	1971-01-28
BE681655A (xx)	1966-10-31
US3523832A (en)	1970-08-11

Publication	Publication Date	Title
JPS4330268Y1 (xx)	1968-12-11
JPS4414102Y1 (xx)	1969-06-14
FR1487004A (xx)	1967-10-13
JPS4830747B1 (xx)	1973-09-22
JPS4417871Y1 (xx)	1969-08-02
JPS4416031Y1 (xx)	1969-07-10
JPS4416020Y1 (xx)	1969-07-10
JPS4310460Y1 (xx)	1968-05-07
JPS4410307Y1 (xx)	1969-04-25
BE670576A (xx)	1966-01-31
BE687862A (xx)	1967-03-16
SE321723B (xx)	1970-03-16
SE332923B (xx)	1971-02-22
SE314360B (xx)	1969-09-08
SE312163B (xx)	1969-07-07
SE301221B (xx)	1968-05-27
NL6503257A (xx)	1966-09-16
BE668279A (xx)	1966-02-14
BE664265A (xx)	1965-09-16
BE674579A (xx)	1966-04-15
BE674523A (xx)
BE668355A (xx)	1965-12-16
BE672700A (xx)	1966-03-16
BE662045A (xx)	1965-08-02
BE674615A (xx)	1966-04-15