AUPP699698A0 - Indirect laser patterning of resist - Google Patents

Indirect laser patterning of resist

Info

Publication number
AUPP699698A0
AUPP699698A0 AUPP6996A AUPP699698A AUPP699698A0 AU PP699698 A0 AUPP699698 A0 AU PP699698A0 AU PP6996 A AUPP6996 A AU PP6996A AU PP699698 A AUPP699698 A AU PP699698A AU PP699698 A0 AUPP699698 A0 AU PP699698A0
Authority
AU
Australia
Prior art keywords
resist
laser patterning
indirect laser
indirect
patterning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AUPP6996A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pacific Solar Pty Ltd
Original Assignee
Pacific Solar Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pacific Solar Pty Ltd filed Critical Pacific Solar Pty Ltd
Priority to AUPP6996A priority Critical patent/AUPP699698A0/en
Publication of AUPP699698A0 publication Critical patent/AUPP699698A0/en
Priority to AU15329/00A priority patent/AU757477B2/en
Priority to JP2000581702A priority patent/JP2002529802A/en
Priority to PCT/AU1999/000975 priority patent/WO2000028604A1/en
Priority to EP99957707A priority patent/EP1135810A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
AUPP6996A 1998-11-06 1998-11-06 Indirect laser patterning of resist Abandoned AUPP699698A0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AUPP6996A AUPP699698A0 (en) 1998-11-06 1998-11-06 Indirect laser patterning of resist
AU15329/00A AU757477B2 (en) 1998-11-06 1999-11-05 Indirect laser patterning of resist
JP2000581702A JP2002529802A (en) 1998-11-06 1999-11-05 Indirect laser patterning of resist
PCT/AU1999/000975 WO2000028604A1 (en) 1998-11-06 1999-11-05 Indirect laser patterning of resist
EP99957707A EP1135810A1 (en) 1998-11-06 1999-11-05 Indirect laser patterning of resist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AUPP6996A AUPP699698A0 (en) 1998-11-06 1998-11-06 Indirect laser patterning of resist

Publications (1)

Publication Number Publication Date
AUPP699698A0 true AUPP699698A0 (en) 1998-12-03

Family

ID=3811209

Family Applications (1)

Application Number Title Priority Date Filing Date
AUPP6996A Abandoned AUPP699698A0 (en) 1998-11-06 1998-11-06 Indirect laser patterning of resist

Country Status (4)

Country Link
EP (1) EP1135810A1 (en)
JP (1) JP2002529802A (en)
AU (1) AUPP699698A0 (en)
WO (1) WO2000028604A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101115291B1 (en) 2003-04-25 2012-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Droplet discharging device, method for forming pattern and method for manufacturing semiconductor device
US7462514B2 (en) 2004-03-03 2008-12-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same, liquid crystal television, and EL television
US7642038B2 (en) 2004-03-24 2010-01-05 Semiconductor Energy Laboratory Co., Ltd. Method for forming pattern, thin film transistor, display device, method for manufacturing thereof, and television apparatus
JP5276811B2 (en) * 2006-08-25 2013-08-28 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US7749907B2 (en) 2006-08-25 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7867907B2 (en) * 2006-10-17 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2008153354A (en) * 2006-12-15 2008-07-03 Sony Corp Method of forming organic semiconductor pattern, and method of manufacturing semiconductor device
DE102009018112B3 (en) * 2009-04-20 2010-12-16 Institut Für Solarenergieforschung Gmbh Method for producing a semiconductor component, in particular a solar cell, with a locally opened dielectric layer and corresponding semiconductor component

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4119483A (en) * 1974-07-30 1978-10-10 U.S. Philips Corporation Method of structuring thin layers
US4448636A (en) * 1982-06-02 1984-05-15 Texas Instruments Incorporated Laser assisted lift-off
US4780867A (en) * 1986-10-02 1988-10-25 Optical Data, Inc. Method for erasably recording data by viscoelastic shear deformation
JPH02141283A (en) * 1988-11-22 1990-05-30 Kuraray Co Ltd Optical recording medium
US5234539A (en) * 1990-02-23 1993-08-10 France Telecom (C.N.E.T.) Mechanical lift-off process of a metal layer on a polymer
IT1273373B (en) * 1994-03-04 1997-07-08 Smaltiriva S P A PROCEDURE FOR THE REMOVAL OF FLUOROCARBONIC RESIN COATINGS

Also Published As

Publication number Publication date
JP2002529802A (en) 2002-09-10
WO2000028604A1 (en) 2000-05-18
EP1135810A1 (en) 2001-09-26

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