AU4295072A - Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method - Google Patents

Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method

Info

Publication number
AU4295072A
AU4295072A AU42950/72A AU4295072A AU4295072A AU 4295072 A AU4295072 A AU 4295072A AU 42950/72 A AU42950/72 A AU 42950/72A AU 4295072 A AU4295072 A AU 4295072A AU 4295072 A AU4295072 A AU 4295072A
Authority
AU
Australia
Prior art keywords
forthe
realisation
multiple layers
fabrication
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU42950/72A
Other versions
AU469693B2 (en
Inventor
La Roy And Erik Adriaan Willem Van Rabenhorst Tengbergen Dick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Nederland BV
Original Assignee
Thales Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Nederland BV filed Critical Thales Nederland BV
Application granted granted Critical
Publication of AU469693B2 publication Critical patent/AU469693B2/en
Publication of AU4295072A publication Critical patent/AU4295072A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU42950/72A 1971-06-07 1972-05-31 Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method Expired AU469693B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NLNL7107750 1971-06-07
NL7107750.A NL166171C (en) 1971-06-07 1971-06-07 METHOD FOR MANUFACTURING MULTIPLE LAYER PRINTED CIRCUITS AND DEVICE FOR REALIZING THIS METHOD

Publications (2)

Publication Number Publication Date
AU469693B2 AU469693B2 (en) 1973-12-06
AU4295072A true AU4295072A (en) 1973-12-06

Family

ID=19813317

Family Applications (1)

Application Number Title Priority Date Filing Date
AU42950/72A Expired AU469693B2 (en) 1971-06-07 1972-05-31 Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method

Country Status (11)

Country Link
JP (1) JPS5615156B1 (en)
AU (1) AU469693B2 (en)
BE (1) BE784154A (en)
CA (1) CA970075A (en)
CH (1) CH537139A (en)
DE (1) DE2226430C3 (en)
FR (1) FR2140453B1 (en)
GB (1) GB1367737A (en)
IT (1) IT960854B (en)
NL (1) NL166171C (en)
SE (1) SE378973B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU582251B2 (en) * 1985-08-26 1989-03-16 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
DE3027336A1 (en) * 1980-07-18 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Through hole insulation - for metal core printed circuit board, by evacuation, heating and pressure application
DE3032931C2 (en) * 1980-09-02 1982-07-29 Robert Bürkle GmbH & Co, 7290 Freudenstadt Method and arrangement for the production of multilayer printed circuit boards
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
GB2179001A (en) * 1985-08-16 1987-02-25 Burr Brown Corp Method of bonding using paste or non-dry film adhesives
CA1256502A (en) * 1986-05-28 1989-06-27 Reinhold Henke Low rf emission fiber optic transmission system
JPH03121379A (en) * 1989-09-30 1991-05-23 Matsushita Electric Ind Co Ltd Flow control device
JP2824180B2 (en) * 1993-02-03 1998-11-11 ローム株式会社 Heating press equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU582251B2 (en) * 1985-08-26 1989-03-16 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board

Also Published As

Publication number Publication date
FR2140453B1 (en) 1977-12-23
SE378973B (en) 1975-09-15
DE2226430B2 (en) 1977-09-15
AU469693B2 (en) 1973-12-06
DE2226430C3 (en) 1978-05-11
GB1367737A (en) 1974-09-25
JPS5615156B1 (en) 1981-04-08
NL7107750A (en) 1972-12-11
CH537139A (en) 1973-05-15
FR2140453A1 (en) 1973-01-19
NL166171B (en) 1981-01-15
BE784154A (en) 1972-09-18
CA970075A (en) 1975-06-24
IT960854B (en) 1973-11-30
DE2226430A1 (en) 1973-01-11
NL166171C (en) 1981-01-15

Similar Documents

Publication Publication Date Title
CA978658A (en) Molded printed circuits and method
AU474945B2 (en) Integrated circuit
AU524785B2 (en) Multilayer printed circuits
CA1028050A (en) Error control circuits and methods
AU467330B2 (en) Printed circuit fabrication
AU469693B2 (en) Method forthe fabrication of printed circuits composed of multiple layers, anda device forthe realisation ofthis method
AU467917B2 (en) Drive circuits
CA969673A (en) Integrated circuit resistor structures
CA984061A (en) Multilayer metal integrated circuit
CA957709A (en) Circuit board tool
CA948731A (en) Warning circuits
CA884592A (en) Multilayer laminated printed circuit
CA885690A (en) Printed circuits
CA888944A (en) Diode-transistor-transistor-logic (dttl) circuits
CA885678A (en) Compensated readback circuit
CA860470A (en) Frequency-changer circuits
CA881109A (en) Phase-responsive circuits
CA886791A (en) Circuits
AU437121B2 (en) Printed circuit assembly and method for fabrication thereof
CA960786A (en) Multi-layer thin-film circuits
CA896991A (en) Printed circuits
AU476270B2 (en) Printed circuits
CA878080A (en) Printed circuit keyboard
CA952203A (en) Control circuits
AU4288172A (en) Printed circuit assembly and method for fabrication thereof