GB2179001A - Method of bonding using paste or non-dry film adhesives - Google Patents

Method of bonding using paste or non-dry film adhesives Download PDF

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Publication number
GB2179001A
GB2179001A GB08606545A GB8606545A GB2179001A GB 2179001 A GB2179001 A GB 2179001A GB 08606545 A GB08606545 A GB 08606545A GB 8606545 A GB8606545 A GB 8606545A GB 2179001 A GB2179001 A GB 2179001A
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United Kingdom
Prior art keywords
adhesive
fabric
microelectronic substrate
ceramic package
fabric preform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08606545A
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GB8606545D0 (en
Inventor
Sumner H Wolfson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of GB8606545D0 publication Critical patent/GB8606545D0/en
Publication of GB2179001A publication Critical patent/GB2179001A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
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    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

In a method for joining two surfaces by employing a fabric preform an adhesive is applied to one surface, a fabric preform affixed thereto, said surface is joined to the other surface and the resultant assembly clamped together under a temperature and for a time sufficient to effect airing. The present invention is particularly useful in the microelectronics industry, for example to join a microelectronic substrate bearing electronic circuitry to a ceramic or metal package while avoiding problems with runout and voiding.

Description

SPECIFICATION Method of bonding using paste or non-dry film adhesives This invention relates generally to a method for applying adhesives to permit bonding together of flat surfaces. More particularly, this invention relates to a method applying a fabric preform to provide a more uniform and integral bond between two flat surfaces.
Generally, there are two problems encountered when bonding together surfaces. These problems are runout and voiding. When an adhesive is sandwiched between two surfaces to be bonded together, and the assembly is heated of otherwise activated to cure the adhesive, the adhesive usually softens and becomes less viscous. When the adhesive softens, it has a tendency to be extruded from between the two surfaces to be bonded. Excessive extrusion of the material, commonly known as runout, can cause serious problems in the fabrication of a product. The problem is made more serious when a clamping force is applied to hold the adhesive and bonding surfaces in intimate contact during the curing period. Curing may be achieved by polymerization, imidization, melting, catalysis or other means for causing bonding.
The second problem which is encountered when bonding together two flat surfaces, is that of leaving gaps in the layer of adhesive between the surfaces.
This problem is generally known as void formation or voiding. The effect of voiding is to decrease the contact area between the adhesive layer and the surfaces to be bonded. This voiding reduces the overall bond strength of the entire assembly.
The problems of runout and voiding are particularly acute in the bonding of electronic components or parts. The bonding of large dice to substrates, or the bonding of substrates into packages often presents serious problems with runout or voiding. In the fabrication of hybrid microelectronic devices, for example, it is desirable to secure a substrate bearing the electronic circuitry to a package surface or to the bottom of the cavity. Excessive runout during the process of substrate attachment may cause the adhesive to cover areas to be wire bonded resulting in either the destruction of the part or in higher repair costs. Where a substrate bearing the electronic circuitry is to be bonded into a cavity slightly larger than the substrate itself, this runout phenomenon renders the application of any clamping force to the substrate virtually impossible.Application of a clamping force to the substrate decreases the thickness of the adhesive under the substrate, and magnifies the height to which the adhesive rises around the substrate. The height to which the adhesive will rise under a clamping force is equal to the ratio of the area under the substrate to the free area around the substrate. This ratio can be of the order of 50 to 1. The application of a paste adhesive into a cavity by conventional means is virtually impossible without encountering the runout phenomenon resulting in an outwelling and overflowing of the adhesive onto the top of the substrate. This phenomenon is particularly noticeable when clamping pressure is applied or when the viscosity of the adhesive decreases during the cure.
Void formation, on the other hand, serves to decrease thermal conductivity to the bond assembly.
Thermal conductivity may be reduced to the extent that a resistor or another active component will operate at a higher temperature, leading to shifting or drifting of electrical parameters. This is specifically critical when a resistor or an active electronic component such as a die is bonded to a substrate which in turn is then bonded to a package having a layer of adhesive with a significantly large void. The same result, of course, occurs when the void resides in the adhesive between the active component and the substrate.
Accordingly, it is an object of this invention to bond together flat surfaces using a layer of adhesive without the problems of runout and voiding.
It is another object of this invention to prevent runout and voiding when bonding together flat surfaces by using a fabric preform.
It is a further object of this invention to provide an economical method of bonding a substrate into a ceramic cavity package when the package is to be sealed using a gold-tin solder or its equivalent.
It is another object of this invention to provide a method of attaching large dice to substrate or substrates into cavity packages where a nonconductive polymide is used as the adhesive.
According to the present invention a method of bonding surfaces comprises the steps of applying an adhesive to a surface of an object; affixing a fabric preform to said surface; joining said surface to another surface of another object; clamping together said surfaces; and curing said surfaces at a temperature and for a time sufficient to cause adhesion of the surfaces.
According to a second aspect of the present invention a method of bonding a microelectronic substrate bearing electronic circuitry to a ceramic package comprises the steps of applying an adhesive to a surface of said microelectronic substrate; affixing a fabric preform to said surface; joining said surface to a cavity of said ceramic package; clamping together said microelectronic substrate to said ceramic package; and curing said microelectronic substrate and ceramic package wherein said curing comprises the steps of: heating said microelectronic substrate and ceramic package for one hour at 150 degrees Centigrade and post hearing for 30 minutes at 250 degrees Centigrade.
Further preferred features of the invention are defined in the claims appended to this specification.
The invention is further described by means of example and not in any limitative sense with reference to the accompanying drawings of which: Figure 1 is an inverted perspective plan view of a substrate; and Figure 2 is an exploded perspective plan view of the substrate and ceramic packaging.
Figure 1 shows a substrate 10 having a substrate base 12 and a layer of polyimide adhesive 14.
Figure 2 shows the inter-relationship between the substrate 10 and a fabric backing 20 and a "L Braze" ceramic package 40 having a cavity bottom 30 to which the substrate 10 is to be attached. The adhesive 14 may be applied to the substrate base 12 of substrate 10 or may be screened onto the substrate by a standard screen printer commonly used in the microelectronics industry to apply thick film inks.
Generally, a solid pattern of adhesive 14 is applied leaving a margin 16 of about 0.020 inch around the perimeter of the substrate base 12. The margin 16 compensates for misalignment of the substrate base 12 to the fabric preform 20 and for any slight adhesive runout. The fabric preform 20, preferably made of fiberglass, is cut slightly larger than the pattern of the adhesive 14 and equal to or slightly smaller than the substrate base 12. The fabric preform may be one mil.
to two mils. thick and have a thread count of from 60 x 35 to 60 x 60 per inch. Assembly of the package is achieved by centering the fabric preform 20 on the cavity base 30 of the package. The substrate 10 is then centered in a package cavity 30 over the fabric preform 20 and is clipped to the package. The substrate 10 is placed in the cavity 40 while the adhesive 14 is wet or tacky. A clip applying a force of one-fourth to four pounds per square inch may be used. The clipped assembly is then cured in a conventional oven for one hour at 150 degrees Centigrade and then post cured at 250 degrees Centigrade for 30 minutes.
Polyimide is the adhesive of choice due to the high temperatures encountered during the package sealing process. The polyimide adhesives have not previously been used to adhere relatively large areas, such as those larger than 0.25 inches square because of the excessive voiding problems. The present invention performs the attachment and packaging economically and with little voiding.
When present, any voids encountered with the present process are of such small size, due to the use of the fabric preform, that they do not significantly interfere with heat conduction away from the heat producing devices.
Adhesive application may be by any suitable method such as controlled volume past dispensing, dotting, stamping or screening. Ordinarily, the adhesive is applied to one surface to be bonded, but it may also be applied to the second surface to be bonded, to the fabric preform only, or to any combination of the three so long as the adhesive is applied to at least one of the two surfaces or to the fabric.
Under certain circumstances, it may be desirable to use an adhesive film preform with a fabric preform rather than a layer or adhesive and a fabric preform.
The permeable fabric preform will still be used to achieve the same benefits imparted by the use of paste adhesives. The adhesive film, if used, may be a dried or semi-dried material as is ordinarily available, but it may also be a wet or tacky material. Certain adhesives, then, which cannot be dried before cure may be applied in film form. Generally, however, such nondryable adhesives are never used, but offer a practical solution, under the present invention, to some bonding problems. A permeable fabric may be impregnated with the non-dryable adhesive and serve as a base for the adhesive film. The nonimpregnated permeable fabric is still essential to this process, it serves to control bonding problems present with the use of adhesive, even when the adhesive is applied as a preform.
The use of the permeable fabric, which is ordinarily cut to approximate size and shape of the smaller of the two surfaces to the bonded is critical to the present invention. The fabric serves three major purposes: 1. The fabric provides a "damming" action which provides resistance to the spread of adhesive and controls or prevents runout either during the initial application of clamping force or during the curing cycle; 2. The fabric prevents the formation of significantly large voids. The combination of surface tension of the adhesive, capillary forces, and the high thread count prevent the trapping of gases in the adhesive layer by providing escape channels for the gases, thereby limiting voids, if any, to a size much smaller than the openings between the threads of the fabric; 3.The fabric reinforces the adhesive layer thereby increasing its bond strength, the fabric reinforcement also allows for a thinner adhesive layer which guarantees uniform and consistent electrical and thermal conductivity parameters.
The adhesive used with the present invention was "P60-2" by Epoxy Technology, which is an oxide filled low temperature curing polyimide. The adhesive uses a special proprietary solvent, P.l. thinner by Epoxy Technology which vaporizes much more slowly than conventional solvents so that the fluid properties of the polyimide paste do not change significantly during its application.
While the invention has been particularly shown and described in reference to the preferred embodiments thereof, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the invention. For example, a metal alloy, a glass or a glass-metal combination may be used as the adhesive while a metal mesh or perforated metal preform may be used instead of fiberglass.

Claims (27)

1. A method of bonding surfaces comprising the steps of: applying an adhesive to a surface of an object; affixing a fabric preform to said surface; joining said surface to another surface of another object; clamping together said surfaces; and curing said surfaces at a temperature and for a time sufficient to cause adhesion of the surfaces.
2. The method of Claim 1 wherein said adhesive is selected from the class consisting of epoxy resins and polyimide resins.
3. The method of Claim 1 wherein said adhesive is a paste or liquid adhesive.
4. The method of Claim 1 wherein said adhesive is applied in a solid pattern by controlled volume paste dispensing, dotting, stamping or screening.
5. The method of Claim 1 wherein said fabric preform comprises a fiberglass fabric.
6. The method of Claim 5 wherein said fiberglass fabric is 1 mil. to 2 mils. thick.
7. The method of Claim 6 wherein said fiberglass fabric has a thread count of from 60 x 35 to 60 x 60 threads per inch.
8. The method of Claim 1 wherein said fabric preform is impregnated with said adhesive.
9. The method of Claim 1 wherein said adhesive is applied in a manner such that a margin of at least 0.020 inches exists around the perimeter of said surface of an object.
10. The method of Claim 1 wherein said fabric preform is permeable.
11. The method of Claim 2 wherein said surface of an object is a surface of a microelectronic substrate bearing electronic circuitry.
12. The method of Claim 1 wherein said adhesive is applied to at least one of the two surfaces or to the fabric.
13. The method of Claim 1 wherein said another surface of another object is the bottom surface of a ceramic package.
14. The method of Claim 1 wherein said another surface of another object is a surface of a metal platform package.
15. The method of Claim 1 wherein said clamping step employs a clamping means for applying a force to said surfaces.
16. The method of Claim 15 wherein said clamping means applies a force of at least one-fourth to four pounds.
17. The method of Claim 1 wherein said curing comprises the steps of: heating said surfaces for one hour at 150 degrees Centigrade; and post-heating said surfaces for 30 minutes at 250 degrees Centigrade,
18. A method of bonding a microelectronic substrate bearing electronic circuitry to a ceramic package comprising the steps of: applying an adhesive to a surface of said microelectronic substrate; affixing a fabric preform to said surface; joining said surface to a cavity of said ceramic package; clamping together said microelectronic substrate to said ceramic package; and curing said microelectronic substrate and ceramic package wherein said curing comprises the steps of: heating said microelectronic substrate and ceramic package for one hour at 150 degrees Centigrade and post heating for 30 minutes at 250 degrees Centigrade.
19. A method of Claim 18 wherein said adhesive is selected from the class consisting of polyimide resin and epoxy resin.
20. The method of Claim 18 wherein said fabric preform comprises a fiberglass fabric having a thread count of from 60 x 35 to 60 x 60 threads per inch, and is 1 mil. to 2 mils. thick.
21. The method of Claim 18 wherein said fabric preform is impregnated with said adhesive.
22. The method of Claim 18 wherein said adhesive is applied in a manner such that a margin of at least 0.020 inches exists around the perimeter of said microelectronic substrate.
23. The method of Claim 18 wherein said fabric preform is permeable.
24. The method of Claim 18 wherein said adhesive is applied to at least one of said microelectronic substrate, said fabric preform and said ceramic package.
25. The method of Claim 18 wherein said clamping step employs a clamping means for applying a force to said microelectronic substrate, and said ceramic package.
26. The method of Claim 25 wherein said clamping means applies a force of at least one-fourth to four pounds.
27. A method of bonding surfaces substantially as hereinbefore described with reference to the accompanying drawings.
GB08606545A 1985-08-16 1986-03-17 Method of bonding using paste or non-dry film adhesives Withdrawn GB2179001A (en)

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EP0950082A1 (en) * 1997-01-06 1999-10-20 Quantum Materials, Inc. Reducing void formation in curable adhesive formulations
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Also Published As

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DE3625596A1 (en) 1987-02-19
JPS6239681A (en) 1987-02-20
FR2586251A1 (en) 1987-02-20
GB8606545D0 (en) 1986-04-23

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