AU3800495A - Process for coating electrically non-conducting surfaces with connected metal structures - Google Patents
Process for coating electrically non-conducting surfaces with connected metal structuresInfo
- Publication number
- AU3800495A AU3800495A AU38004/95A AU3800495A AU3800495A AU 3800495 A AU3800495 A AU 3800495A AU 38004/95 A AU38004/95 A AU 38004/95A AU 3800495 A AU3800495 A AU 3800495A AU 3800495 A AU3800495 A AU 3800495A
- Authority
- AU
- Australia
- Prior art keywords
- electrically non
- metal layer
- deposition
- conducting surfaces
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Electroplating Methods And Accessories (AREA)
- Insulated Conductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Laminated Bodies (AREA)
Abstract
According to the present invention, sharply defined metal structures can be produced on electrically non-conducting surfaces without the use of etching processes by using a process involving the following essential process steps: application of a catalyst suitable for currentless metal deposition; subsequent formation of interconnected structures on the surfaces using mask technology; currentless deposition of an initial thin metal layer onto catalytically coated surface regions which have been exposed following and by the action of structuring processes; electrolytic deposition of a second metal layer on the first metal layer which forms interconnected structures.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4438799A DE4438799A1 (en) | 1994-10-18 | 1994-10-18 | Process for coating electrically non-conductive surfaces with metal structures |
DE4438799 | 1994-10-18 | ||
PCT/DE1995/001502 WO1996012393A1 (en) | 1994-10-18 | 1995-10-18 | Process for coating electrically non-conducting surfaces with connected metal structures |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3800495A true AU3800495A (en) | 1996-05-06 |
Family
ID=6532087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU38004/95A Abandoned AU3800495A (en) | 1994-10-18 | 1995-10-18 | Process for coating electrically non-conducting surfaces with connected metal structures |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0788728B1 (en) |
JP (1) | JPH10507229A (en) |
AT (1) | ATE189762T1 (en) |
AU (1) | AU3800495A (en) |
BR (1) | BR9509376A (en) |
CA (1) | CA2203171A1 (en) |
DE (3) | DE4438799A1 (en) |
ES (1) | ES2143655T3 (en) |
PT (1) | PT788728E (en) |
WO (1) | WO1996012393A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19641219C1 (en) * | 1996-09-27 | 1998-02-12 | Atotech Deutschland Gmbh | Data carrier for data storage |
EP0841839A1 (en) | 1996-11-06 | 1998-05-13 | ATOTECH Deutschland GmbH | Process for structuring plastic surfaces, particularly for the manufacture of means for irreversible information storage |
DE19841900A1 (en) * | 1998-09-11 | 2000-03-30 | Schott Glas | Process for applying metallic conductor tracks as electrodes on a channel plate for large flat screens |
DE10011455B4 (en) * | 2000-03-10 | 2005-12-08 | Schott Ag | Method for applying metallic conductor tracks as electrodes to a channel plate made of glass for large-surface flat screens |
JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
JP2003069218A (en) * | 2001-08-23 | 2003-03-07 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed wiring board having extra-fine pattern |
US20040082859A1 (en) | 2002-07-01 | 2004-04-29 | Alan Schaer | Method and apparatus employing ultrasound energy to treat body sphincters |
DE10254927B4 (en) * | 2002-11-25 | 2012-11-22 | Infineon Technologies Ag | Process for the preparation of conductive structures on a support and use of the process |
DE102004001107B4 (en) * | 2004-01-05 | 2005-12-29 | Siemens Ag | Structuring on surfaces by means of foil |
US7524775B2 (en) | 2006-07-13 | 2009-04-28 | Infineon Technologies Ag | Method for producing a dielectric layer for an electronic component |
KR101988708B1 (en) | 2009-10-30 | 2019-06-12 | 레코 메디컬, 인코포레이티드 | Method and apparatus for treatment of hypertension through percutaneous ultrasound renal denervation |
CN101706703B (en) * | 2009-11-24 | 2011-06-22 | 无锡阿尔法电子科技有限公司 | Manufacturing method of metal film on periphery of capacitive touch screen |
JP6337080B2 (en) * | 2013-03-14 | 2018-06-06 | リコール メディカル インコーポレイテッドReCor Medical, Inc. | Method for plating or coating an ultrasonic transducer |
EP3799931A1 (en) | 2013-03-14 | 2021-04-07 | ReCor Medical, Inc. | Ultrasound-based neuromodulation system |
EP3235399B1 (en) * | 2016-04-11 | 2020-07-01 | Bolta Werke GmbH | Method and device for selectively applying a cover varnish |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2433384A (en) * | 1942-11-05 | 1947-12-30 | Int Standard Electric Corp | Method of manufacturing unitary multiple connections |
US3573973A (en) * | 1967-11-13 | 1971-04-06 | Ibm | High speed additive circuit process |
US3907621A (en) * | 1971-07-29 | 1975-09-23 | Photocircuits Corp | Method of sensitizing substrates for chemical metallization |
US3772161A (en) * | 1972-01-03 | 1973-11-13 | Borg Warner | Method of selectively electroplating thermoplastic substrates using a strippable coating mask |
JPS58193390A (en) * | 1982-05-06 | 1983-11-11 | Mitsubishi Rayon Co Ltd | Method of partially plating plastics |
US4431685A (en) * | 1982-07-02 | 1984-02-14 | International Business Machines Corporation | Decreasing plated metal defects |
DE3407114A1 (en) * | 1984-02-28 | 1985-09-05 | Bayer Ag, 5090 Leverkusen | METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS |
DE3430290A1 (en) * | 1984-08-17 | 1986-02-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method for selective metallisation |
DE3510982A1 (en) * | 1985-03-22 | 1986-09-25 | Schering AG, Berlin und Bergkamen, 1000 Berlin | MANUFACTURE OF METALLIC STRUCTURES ON NON-CONDUCTORS |
US4748104A (en) * | 1986-11-10 | 1988-05-31 | Macdermid, Incorporated | Selective metallization process and additive method for manufactured printed circuit boards |
US4810333A (en) * | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
US4948707A (en) * | 1988-02-16 | 1990-08-14 | International Business Machines Corporation | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
BR9105585A (en) * | 1991-12-19 | 1993-06-22 | Brasilia Telecom | PROCESS FOR ELECTRICITY DEPOSITION OF METALLIC FILM ON INSULATING SUBSTRATE |
-
1994
- 1994-10-18 DE DE4438799A patent/DE4438799A1/en not_active Withdrawn
-
1995
- 1995-10-18 DE DE19581160T patent/DE19581160D2/en not_active Ceased
- 1995-10-18 DE DE59507798T patent/DE59507798D1/en not_active Expired - Fee Related
- 1995-10-18 AU AU38004/95A patent/AU3800495A/en not_active Abandoned
- 1995-10-18 ES ES95935819T patent/ES2143655T3/en not_active Expired - Lifetime
- 1995-10-18 AT AT95935819T patent/ATE189762T1/en not_active IP Right Cessation
- 1995-10-18 WO PCT/DE1995/001502 patent/WO1996012393A1/en active IP Right Grant
- 1995-10-18 BR BR9509376A patent/BR9509376A/en not_active IP Right Cessation
- 1995-10-18 JP JP8512857A patent/JPH10507229A/en active Pending
- 1995-10-18 CA CA002203171A patent/CA2203171A1/en not_active Abandoned
- 1995-10-18 EP EP95935819A patent/EP0788728B1/en not_active Expired - Lifetime
- 1995-10-18 PT PT95935819T patent/PT788728E/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE19581160D2 (en) | 1997-07-31 |
WO1996012393A1 (en) | 1996-04-25 |
ES2143655T3 (en) | 2000-05-16 |
DE4438799A1 (en) | 1996-04-25 |
CA2203171A1 (en) | 1996-04-25 |
DE59507798D1 (en) | 2000-03-16 |
JPH10507229A (en) | 1998-07-14 |
ATE189762T1 (en) | 2000-02-15 |
EP0788728B1 (en) | 2000-02-09 |
BR9509376A (en) | 1997-11-18 |
PT788728E (en) | 2000-07-31 |
EP0788728A1 (en) | 1997-08-13 |
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