AU2105300A - Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards - Google Patents

Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards

Info

Publication number
AU2105300A
AU2105300A AU21053/00A AU2105300A AU2105300A AU 2105300 A AU2105300 A AU 2105300A AU 21053/00 A AU21053/00 A AU 21053/00A AU 2105300 A AU2105300 A AU 2105300A AU 2105300 A AU2105300 A AU 2105300A
Authority
AU
Australia
Prior art keywords
polymers
coated
sides
printed circuit
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU21053/00A
Inventor
Hans-Jurgen Schafer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19931692A external-priority patent/DE19931692A1/en
Application filed by Individual filed Critical Individual
Publication of AU2105300A publication Critical patent/AU2105300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
AU21053/00A 1999-01-14 2000-01-04 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards Abandoned AU2105300A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE19901153 1999-01-14
DE19901153 1999-01-14
DE19931692A DE19931692A1 (en) 1999-01-14 1999-07-08 Method and device for producing dielectric-coated copper foil, which is laminated on printed circuit boards
DE19931692 1999-07-08
PCT/EP2000/000022 WO2000042830A1 (en) 1999-01-14 2000-01-04 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards

Publications (1)

Publication Number Publication Date
AU2105300A true AU2105300A (en) 2000-08-01

Family

ID=26051325

Family Applications (1)

Application Number Title Priority Date Filing Date
AU21053/00A Abandoned AU2105300A (en) 1999-01-14 2000-01-04 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards

Country Status (2)

Country Link
AU (1) AU2105300A (en)
WO (1) WO2000042830A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2163146A2 (en) * 2007-05-24 2010-03-17 Basf Se Method for the production of polymer-coated metal foils, and use thereof
CN107159515B (en) * 2017-05-31 2019-06-28 浙江凯澳新材料有限公司 A kind of glass-fiber-fabric feeding drying composite integrated machine
CN117468061A (en) * 2023-11-02 2024-01-30 河北海伟电子新材料科技股份有限公司 Composite copper foil, preparation method and lithium ion battery

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403976A (en) * 1971-08-30 1975-08-28 Perstorp Ab Method for producing printed circuit boards
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
GB1583544A (en) * 1977-07-25 1981-01-28 Uop Inc Metal-clad laminates
DE3620601A1 (en) * 1986-06-19 1987-12-23 Akzo Gmbh METHOD FOR PRODUCING POLYIMIDE METAL LAMINATES
JPS6446998A (en) * 1987-08-17 1989-02-21 Reiko Kk Conductive transfer sheet
JP2556897B2 (en) * 1989-02-23 1996-11-27 ファナック株式会社 Outer layer material for multilayer printed wiring board and manufacturing method
SE470277B (en) * 1992-11-06 1993-12-20 Metfoils Ab Process for the production of printed circuit boards and their use
WO1994027190A1 (en) * 1993-05-12 1994-11-24 Ciba-Geigy Ag Process and device for coating printed circuit boards
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
DE19516193A1 (en) * 1994-05-13 1995-11-16 Schaefer Hans Juergen Coating circuit boards
JP3084352B2 (en) * 1995-08-28 2000-09-04 太陽インキ製造株式会社 Insulating resin composition for copper foil lamination type build-up and method for producing multilayer printed wiring board using the same

Also Published As

Publication number Publication date
WO2000042830A1 (en) 2000-07-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase