AU2003242400A1 - Polisher - Google Patents
PolisherInfo
- Publication number
- AU2003242400A1 AU2003242400A1 AU2003242400A AU2003242400A AU2003242400A1 AU 2003242400 A1 AU2003242400 A1 AU 2003242400A1 AU 2003242400 A AU2003242400 A AU 2003242400A AU 2003242400 A AU2003242400 A AU 2003242400A AU 2003242400 A1 AU2003242400 A1 AU 2003242400A1
- Authority
- AU
- Australia
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002175623A JP2004022804A (en) | 2002-06-17 | 2002-06-17 | Polishing device |
JP2002-175623 | 2002-06-17 | ||
PCT/JP2003/007555 WO2003107408A1 (en) | 2002-06-17 | 2003-06-13 | Polisher |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003242400A1 true AU2003242400A1 (en) | 2003-12-31 |
Family
ID=29728046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003242400A Abandoned AU2003242400A1 (en) | 2002-06-17 | 2003-06-13 | Polisher |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2004022804A (en) |
AU (1) | AU2003242400A1 (en) |
WO (1) | WO2003107408A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1860688A4 (en) * | 2005-03-16 | 2010-08-18 | Asahi Glass Co Ltd | Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method |
KR101146696B1 (en) | 2009-12-18 | 2012-05-22 | 주식회사 엘지실트론 | Apparatus and method for supplying wafer polishing slurry |
JP2015062987A (en) * | 2013-09-26 | 2015-04-09 | 株式会社ディスコ | Method for sticking polishing pad |
US10875149B2 (en) * | 2017-03-30 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for timed dispensing various slurry components |
JP6901905B2 (en) * | 2017-05-11 | 2021-07-14 | 株式会社ディスコ | Polishing liquid manufacturing method |
JP6920141B2 (en) | 2017-09-05 | 2021-08-18 | 株式会社ディスコ | Polishing equipment |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0864562A (en) * | 1994-08-24 | 1996-03-08 | Matsushita Electric Ind Co Ltd | Polishing of semiconductor wafer and device |
JP2000237952A (en) * | 1999-02-19 | 2000-09-05 | Hitachi Ltd | Manufacture of polishing device and semiconductor device |
JP2000317826A (en) * | 1999-05-07 | 2000-11-21 | Okamoto Machine Tool Works Ltd | Method of detecting polishing end point of substrate and detecting device therefor |
JP2001232557A (en) * | 2000-02-23 | 2001-08-28 | Toshiba Ceramics Co Ltd | Device and method for polishing both faces of workpiece |
JP2002170792A (en) * | 2000-11-29 | 2002-06-14 | Mitsubishi Electric Corp | Polishing liquid supplying apparatus, polishing liquid supplying method, polishing apparatus and method for manufacturing semiconductor device |
-
2002
- 2002-06-17 JP JP2002175623A patent/JP2004022804A/en active Pending
-
2003
- 2003-06-13 WO PCT/JP2003/007555 patent/WO2003107408A1/en active Application Filing
- 2003-06-13 AU AU2003242400A patent/AU2003242400A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2004022804A (en) | 2004-01-22 |
WO2003107408A1 (en) | 2003-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |