AU2003284272A1 - A film stack having a silicon germanium layer and a thin amorphous seed layer - Google Patents

A film stack having a silicon germanium layer and a thin amorphous seed layer

Info

Publication number
AU2003284272A1
AU2003284272A1 AU2003284272A AU2003284272A AU2003284272A1 AU 2003284272 A1 AU2003284272 A1 AU 2003284272A1 AU 2003284272 A AU2003284272 A AU 2003284272A AU 2003284272 A AU2003284272 A AU 2003284272A AU 2003284272 A1 AU2003284272 A1 AU 2003284272A1
Authority
AU
Australia
Prior art keywords
layer
silicon germanium
film stack
thin amorphous
amorphous seed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003284272A
Inventor
Aihua Chen
Kevin L. Cunningham
Li Fu
Lee Luo
Paul L. Meissner
Xianzhi Tao
Shulin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2003284272A1 publication Critical patent/AU2003284272A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/2807Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
AU2003284272A 2002-10-18 2003-10-16 A film stack having a silicon germanium layer and a thin amorphous seed layer Abandoned AU2003284272A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27477702A 2002-10-18 2002-10-18
US10/274,777 2002-10-18
PCT/US2003/032966 WO2004036636A1 (en) 2002-10-18 2003-10-16 A film stack having a silicon germanium layer and a thin amorphous seed layer

Publications (1)

Publication Number Publication Date
AU2003284272A1 true AU2003284272A1 (en) 2004-05-04

Family

ID=32106473

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003284272A Abandoned AU2003284272A1 (en) 2002-10-18 2003-10-16 A film stack having a silicon germanium layer and a thin amorphous seed layer

Country Status (2)

Country Link
AU (1) AU2003284272A1 (en)
WO (1) WO2004036636A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060060920A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc. Poly-silicon-germanium gate stack and method for forming the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765394B1 (en) * 1997-06-25 1999-09-24 France Telecom PROCESS FOR OBTAINING A SILICON-GERMANIUM GRID TRANSISTOR
FR2775119B1 (en) * 1998-02-19 2000-04-07 France Telecom METHOD FOR LIMITING INTERDIFFUSION IN A SEMICONDUCTOR DEVICE WITH A COMPOSITE GRID SI / SI 1-X GE X, O LESS THAN X LESS THAN OR EQUAL TO 1.
WO2001041544A2 (en) * 1999-12-11 2001-06-14 Asm America, Inc. Deposition of gate stacks including silicon germanium layers
JP2001320045A (en) * 2000-05-11 2001-11-16 Nec Corp Manufacturing method for mis type semiconductor device
JP2002043566A (en) * 2000-07-27 2002-02-08 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
KR100425934B1 (en) * 2000-12-29 2004-04-03 주식회사 하이닉스반도체 Method of forming a silicon-germanium film
US7026219B2 (en) * 2001-02-12 2006-04-11 Asm America, Inc. Integration of high k gate dielectric

Also Published As

Publication number Publication date
WO2004036636A1 (en) 2004-04-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase