AU2003261884A1 - Pattern inspection method and inspection device therefor - Google Patents

Pattern inspection method and inspection device therefor

Info

Publication number
AU2003261884A1
AU2003261884A1 AU2003261884A AU2003261884A AU2003261884A1 AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1 AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1
Authority
AU
Australia
Prior art keywords
device therefor
inspection
pattern
inspection device
inspection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261884A
Inventor
Naomichi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Foundation for Science and Technology Promotion
Original Assignee
Hamamatsu Foundation for Science and Technology Promotion
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Foundation for Science and Technology Promotion filed Critical Hamamatsu Foundation for Science and Technology Promotion
Publication of AU2003261884A1 publication Critical patent/AU2003261884A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3563Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
AU2003261884A 2002-09-03 2003-09-02 Pattern inspection method and inspection device therefor Abandoned AU2003261884A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002258204 2002-09-03
JP2002-258204 2002-09-03
PCT/JP2003/011187 WO2004023122A1 (en) 2002-09-03 2003-09-02 Pattern inspection method and inspection device therefor

Publications (1)

Publication Number Publication Date
AU2003261884A1 true AU2003261884A1 (en) 2004-03-29

Family

ID=31973020

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261884A Abandoned AU2003261884A1 (en) 2002-09-03 2003-09-02 Pattern inspection method and inspection device therefor

Country Status (3)

Country Link
JP (1) JP4504191B2 (en)
AU (1) AU2003261884A1 (en)
WO (1) WO2004023122A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006112845A (en) * 2004-10-13 2006-04-27 Ushio Inc Pattern inspection device
JP2007139727A (en) * 2005-11-22 2007-06-07 Omron Corp Solder material inspection device, solder material inspection method, control program for solder material inspection device, and recording medium for recording control program for solder material inspection device
JP2007139451A (en) * 2005-11-15 2007-06-07 Omron Corp Inspection device of solder material, inspection method of solder material, control program of inspection device of solder material and recording medium having control program recorded thereon of inspection device of solder material
EP1953534A1 (en) * 2005-11-15 2008-08-06 Omron Corporation Solder material inspecting device
JP2009117425A (en) 2007-11-01 2009-05-28 Nitto Denko Corp Method of manufacturing wired circuit board
JP2009117424A (en) 2007-11-01 2009-05-28 Nitto Denko Corp Method of manufacturing wired circuit board
JP5244020B2 (en) * 2009-04-15 2013-07-24 日東電工株式会社 Method for manufacturing printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59218938A (en) * 1983-05-27 1984-12-10 Fujitsu Ltd Method for testing wiring pattern of printed board
JPS61189443A (en) * 1985-02-19 1986-08-23 Hitachi Ltd Pattern inspecting device for printed board
JP3617547B2 (en) * 1995-02-14 2005-02-09 富士通株式会社 Method and processing apparatus for observing wiring pattern
JP2001283194A (en) * 2000-03-28 2001-10-12 Sony Corp Method and device for inspecting appearance of circuit board
JP2001308494A (en) * 2000-04-25 2001-11-02 Nikkiso Co Ltd Method and apparatus for inspecting printed board
JP2003172711A (en) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd Surface inspection of inspected object using image processing

Also Published As

Publication number Publication date
JPWO2004023122A1 (en) 2005-12-22
JP4504191B2 (en) 2010-07-14
WO2004023122A1 (en) 2004-03-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase