AU2003261884A1 - Pattern inspection method and inspection device therefor - Google Patents
Pattern inspection method and inspection device thereforInfo
- Publication number
- AU2003261884A1 AU2003261884A1 AU2003261884A AU2003261884A AU2003261884A1 AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1 AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A AU2003261884 A AU 2003261884A AU 2003261884 A1 AU2003261884 A1 AU 2003261884A1
- Authority
- AU
- Australia
- Prior art keywords
- device therefor
- inspection
- pattern
- inspection device
- inspection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007689 inspection Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002258204 | 2002-09-03 | ||
JP2002-258204 | 2002-09-03 | ||
PCT/JP2003/011187 WO2004023122A1 (en) | 2002-09-03 | 2003-09-02 | Pattern inspection method and inspection device therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003261884A1 true AU2003261884A1 (en) | 2004-03-29 |
Family
ID=31973020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003261884A Abandoned AU2003261884A1 (en) | 2002-09-03 | 2003-09-02 | Pattern inspection method and inspection device therefor |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4504191B2 (en) |
AU (1) | AU2003261884A1 (en) |
WO (1) | WO2004023122A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006112845A (en) * | 2004-10-13 | 2006-04-27 | Ushio Inc | Pattern inspection device |
JP2007139727A (en) * | 2005-11-22 | 2007-06-07 | Omron Corp | Solder material inspection device, solder material inspection method, control program for solder material inspection device, and recording medium for recording control program for solder material inspection device |
JP2007139451A (en) * | 2005-11-15 | 2007-06-07 | Omron Corp | Inspection device of solder material, inspection method of solder material, control program of inspection device of solder material and recording medium having control program recorded thereon of inspection device of solder material |
EP1953534A1 (en) * | 2005-11-15 | 2008-08-06 | Omron Corporation | Solder material inspecting device |
JP2009117425A (en) | 2007-11-01 | 2009-05-28 | Nitto Denko Corp | Method of manufacturing wired circuit board |
JP2009117424A (en) | 2007-11-01 | 2009-05-28 | Nitto Denko Corp | Method of manufacturing wired circuit board |
JP5244020B2 (en) * | 2009-04-15 | 2013-07-24 | 日東電工株式会社 | Method for manufacturing printed circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59218938A (en) * | 1983-05-27 | 1984-12-10 | Fujitsu Ltd | Method for testing wiring pattern of printed board |
JPS61189443A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Ltd | Pattern inspecting device for printed board |
JP3617547B2 (en) * | 1995-02-14 | 2005-02-09 | 富士通株式会社 | Method and processing apparatus for observing wiring pattern |
JP2001283194A (en) * | 2000-03-28 | 2001-10-12 | Sony Corp | Method and device for inspecting appearance of circuit board |
JP2001308494A (en) * | 2000-04-25 | 2001-11-02 | Nikkiso Co Ltd | Method and apparatus for inspecting printed board |
JP2003172711A (en) * | 2001-09-26 | 2003-06-20 | Dainippon Screen Mfg Co Ltd | Surface inspection of inspected object using image processing |
-
2003
- 2003-09-02 AU AU2003261884A patent/AU2003261884A1/en not_active Abandoned
- 2003-09-02 WO PCT/JP2003/011187 patent/WO2004023122A1/en active Application Filing
- 2003-09-02 JP JP2004534134A patent/JP4504191B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2004023122A1 (en) | 2005-12-22 |
JP4504191B2 (en) | 2010-07-14 |
WO2004023122A1 (en) | 2004-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |