AU2003257379A1 - Power circuit breaker - Google Patents
Power circuit breakerInfo
- Publication number
- AU2003257379A1 AU2003257379A1 AU2003257379A AU2003257379A AU2003257379A1 AU 2003257379 A1 AU2003257379 A1 AU 2003257379A1 AU 2003257379 A AU2003257379 A AU 2003257379A AU 2003257379 A AU2003257379 A AU 2003257379A AU 2003257379 A1 AU2003257379 A1 AU 2003257379A1
- Authority
- AU
- Australia
- Prior art keywords
- circuit breaker
- power circuit
- power
- breaker
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10231836 | 2002-07-12 | ||
DE10231836.0 | 2002-07-12 | ||
DE10257100A DE10257100B4 (de) | 2002-07-12 | 2002-12-05 | Leistungsschalter |
DE10257100.7 | 2002-12-05 | ||
PCT/DE2003/002202 WO2004015774A1 (fr) | 2002-07-12 | 2003-07-02 | Commutateur de puissance |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003257379A1 true AU2003257379A1 (en) | 2004-02-25 |
Family
ID=31716585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003257379A Abandoned AU2003257379A1 (en) | 2002-07-12 | 2003-07-02 | Power circuit breaker |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003257379A1 (fr) |
WO (1) | WO2004015774A1 (fr) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL60513C (fr) * | 1940-07-17 | |||
DE970502C (de) * | 1950-07-01 | 1958-09-25 | Siemens Ag | Trockengleichrichteranordnung kleiner Bauart mit einer Vielzahl von Gleichrichtertabletten |
FR2620296B1 (fr) * | 1987-09-03 | 1990-01-19 | Bendix Electronics Sa | Boitier pour circuit electronique |
-
2003
- 2003-07-02 WO PCT/DE2003/002202 patent/WO2004015774A1/fr not_active Application Discontinuation
- 2003-07-02 AU AU2003257379A patent/AU2003257379A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004015774A1 (fr) | 2004-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2003217689A1 (en) | Circuit breaker lockout | |
AUPS131202A0 (en) | Circuit arrangement for power control | |
AU2003219535A1 (en) | Electronic circuit breaker | |
AU2003288446A1 (en) | Power integrated circuits | |
GB0224133D0 (en) | Electric circuit | |
AU2003231552A1 (en) | High frequency switch circuit | |
AU2003260315A1 (en) | Circuit for power amplification | |
SG112868A1 (en) | Electric circuit | |
AU2003283750A1 (en) | Integrated half-bridge power circuit | |
AU2003282290A1 (en) | Bus controlled power switch | |
AU2003276625A1 (en) | Feedback circuit for power switching circuit | |
AU2002326145A1 (en) | Bootstrap circuit for switching power supplies | |
AU2003266073A1 (en) | Cooled power switching device | |
AU2003298648A1 (en) | Two stage power conversion circuit | |
AU2002344034A1 (en) | Circuit breaker | |
HK1079623A1 (en) | Insertable power circuit breaker | |
AU2003201474A1 (en) | Charging circuit | |
AU2002345765A1 (en) | Circuit breaker | |
AU2002950581A0 (en) | Electrical safety circuit | |
EP1681700A4 (fr) | Disjoncteur | |
AU2003270732A1 (en) | Current limiting circuit | |
HK1083934A1 (en) | Low-voltage circuit breaker | |
AU2003267332A1 (en) | Electrical circuit arrangement | |
AU2003285694A1 (en) | Circuit arrangement | |
HK1079614A1 (en) | Low voltage circuit breaker |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |