AU2003250808A1 - Coating of an integrated semiconductor circuit, and method for producing said coating - Google Patents
Coating of an integrated semiconductor circuit, and method for producing said coatingInfo
- Publication number
- AU2003250808A1 AU2003250808A1 AU2003250808A AU2003250808A AU2003250808A1 AU 2003250808 A1 AU2003250808 A1 AU 2003250808A1 AU 2003250808 A AU2003250808 A AU 2003250808A AU 2003250808 A AU2003250808 A AU 2003250808A AU 2003250808 A1 AU2003250808 A1 AU 2003250808A1
- Authority
- AU
- Australia
- Prior art keywords
- coating
- producing
- semiconductor circuit
- integrated semiconductor
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10236605 | 2002-08-09 | ||
DE10236605.5 | 2002-08-09 | ||
PCT/DE2003/002646 WO2004021437A1 (de) | 2002-08-09 | 2003-08-06 | Beschichtung einer intergrierten halbleiterschaltung und verfahren zum herstellen der beschichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003250808A1 true AU2003250808A1 (en) | 2004-03-19 |
Family
ID=31968955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003250808A Abandoned AU2003250808A1 (en) | 2002-08-09 | 2003-08-06 | Coating of an integrated semiconductor circuit, and method for producing said coating |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003250808A1 (de) |
WO (1) | WO2004021437A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2872610B1 (fr) * | 2004-07-02 | 2007-06-08 | Commissariat Energie Atomique | Dispositif de securisation de composants |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1180908A (en) * | 1966-11-17 | 1970-02-11 | English Electric Co Ltd | Improvements in or relating to processes for Forming an Insulating Coating on Silicon, and to Coated Silicon |
US4997795A (en) * | 1986-10-02 | 1991-03-05 | General Electric Company | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide |
CA2088107A1 (en) * | 1992-02-24 | 1993-08-25 | Ronald Howard Baney | Silicone infiltrated ceramic nanocomposite coatings |
US5399441A (en) * | 1994-04-12 | 1995-03-21 | Dow Corning Corporation | Method of applying opaque coatings |
US5693701A (en) * | 1995-10-26 | 1997-12-02 | Dow Corning Corporation | Tamper-proof electronic coatings |
-
2003
- 2003-08-06 WO PCT/DE2003/002646 patent/WO2004021437A1/de not_active Application Discontinuation
- 2003-08-06 AU AU2003250808A patent/AU2003250808A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004021437A1 (de) | 2004-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |