AU2003241758A1 - Electroless plating apparatus and electroless plating method - Google Patents

Electroless plating apparatus and electroless plating method

Info

Publication number
AU2003241758A1
AU2003241758A1 AU2003241758A AU2003241758A AU2003241758A1 AU 2003241758 A1 AU2003241758 A1 AU 2003241758A1 AU 2003241758 A AU2003241758 A AU 2003241758A AU 2003241758 A AU2003241758 A AU 2003241758A AU 2003241758 A1 AU2003241758 A1 AU 2003241758A1
Authority
AU
Australia
Prior art keywords
electroless plating
plating method
plating apparatus
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003241758A
Inventor
Gishi Chung
Miho Jomen
Takayuki Komiya
Yoshinori Marumo
Hiroshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003241758A1 publication Critical patent/AU2003241758A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
AU2003241758A 2002-09-19 2003-05-23 Electroless plating apparatus and electroless plating method Abandoned AU2003241758A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002273668A JP3495033B1 (en) 2002-09-19 2002-09-19 Electroless plating apparatus and electroless plating method
JP2002-273668 2002-09-19
PCT/JP2003/006498 WO2004027114A1 (en) 2002-09-19 2003-05-23 Electroless plating apparatus and electroless plating method

Publications (1)

Publication Number Publication Date
AU2003241758A1 true AU2003241758A1 (en) 2004-04-08

Family

ID=31712367

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003241758A Abandoned AU2003241758A1 (en) 2002-09-19 2003-05-23 Electroless plating apparatus and electroless plating method

Country Status (6)

Country Link
US (1) US20060037858A1 (en)
JP (1) JP3495033B1 (en)
KR (1) KR20050057334A (en)
CN (1) CN1681965A (en)
AU (1) AU2003241758A1 (en)
WO (1) WO2004027114A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485120B2 (en) 2007-04-16 2013-07-16 Lam Research Corporation Method and apparatus for wafer electroless plating
US8844461B2 (en) * 2007-04-16 2014-09-30 Lam Research Corporation Fluid handling system for wafer electroless plating and associated methods
US8069813B2 (en) * 2007-04-16 2011-12-06 Lam Research Corporation Wafer electroless plating system and associated methods
US7874260B2 (en) * 2006-10-25 2011-01-25 Lam Research Corporation Apparatus and method for substrate electroless plating
JP2006057171A (en) * 2004-08-23 2006-03-02 Tokyo Electron Ltd Electroless plating apparatus
JP2006111938A (en) * 2004-10-15 2006-04-27 Tokyo Electron Ltd Electroless plating apparatus
US20060219566A1 (en) * 2005-03-29 2006-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating metal layer
JP5105833B2 (en) * 2005-12-02 2012-12-26 東京エレクトロン株式会社 Electroless plating apparatus, electroless plating method, and computer-readable storage medium
KR100723664B1 (en) * 2006-02-09 2007-05-30 김원영 A basket device for electrless of printed circuit board
JP2009016782A (en) 2007-06-04 2009-01-22 Tokyo Electron Ltd Film forming method, and film forming apparatus
JP2009076881A (en) * 2007-08-30 2009-04-09 Tokyo Electron Ltd Treatment gas supply system and processing device
JP5417754B2 (en) 2008-07-11 2014-02-19 東京エレクトロン株式会社 Film forming method and processing system
JP5522979B2 (en) 2009-06-16 2014-06-18 国立大学法人東北大学 Film forming method and processing system
JP5487748B2 (en) 2009-06-16 2014-05-07 東京エレクトロン株式会社 Barrier layer, film forming method and processing system
JP5359642B2 (en) 2009-07-22 2013-12-04 東京エレクトロン株式会社 Deposition method
JP5429078B2 (en) 2010-06-28 2014-02-26 東京エレクトロン株式会社 Film forming method and processing system
JP2013052361A (en) * 2011-09-05 2013-03-21 Fujifilm Corp Chemical bath deposition apparatus
JP6736386B2 (en) 2016-07-01 2020-08-05 東京エレクトロン株式会社 Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US11441225B2 (en) 2017-12-01 2022-09-13 Tokyo Electron Limited Substrate liquid processing apparatus
WO2020031679A1 (en) * 2018-08-06 2020-02-13 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN110055521B (en) * 2019-06-11 2024-01-26 绵阳皓华光电科技有限公司 CdS film chemical water bath deposition device and preparation method thereof
JP7221414B2 (en) * 2019-10-30 2023-02-13 東京エレクトロン株式会社 SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS
CN110983304A (en) * 2019-12-31 2020-04-10 广州兴森快捷电路科技有限公司 Chemical plating equipment and surface treatment system
CN115595566A (en) * 2022-11-17 2023-01-13 西华大学（Cn） Environment-friendly, energy-saving, efficient and flexible chemical plating device and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017585A (en) * 1998-02-24 2000-01-25 National Semiconductor Corporation High efficiency semiconductor wafer coating apparatus and method
WO2000010200A1 (en) * 1998-08-11 2000-02-24 Ebara Corporation Wafer plating method and apparatus
JP2000064087A (en) * 1998-08-17 2000-02-29 Dainippon Screen Mfg Co Ltd Substrate plating and substrate plating device
KR100773165B1 (en) * 1999-12-24 2007-11-02 가부시키가이샤 에바라 세이사꾸쇼 Semiconductor wafer processing apparatus and processing method
US6843852B2 (en) * 2002-01-16 2005-01-18 Intel Corporation Apparatus and method for electroless spray deposition

Also Published As

Publication number Publication date
WO2004027114A1 (en) 2004-04-01
JP3495033B1 (en) 2004-02-09
KR20050057334A (en) 2005-06-16
CN1681965A (en) 2005-10-12
US20060037858A1 (en) 2006-02-23
JP2004107747A (en) 2004-04-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase