AU2002315418A1 - Optical inspection of electronic circuit boards, wafers and the like, using skeletal reference images and separately programmable alignment tolerance and detection parameters - Google Patents

Optical inspection of electronic circuit boards, wafers and the like, using skeletal reference images and separately programmable alignment tolerance and detection parameters

Info

Publication number
AU2002315418A1
AU2002315418A1 AU2002315418A AU2002315418A AU2002315418A1 AU 2002315418 A1 AU2002315418 A1 AU 2002315418A1 AU 2002315418 A AU2002315418 A AU 2002315418A AU 2002315418 A AU2002315418 A AU 2002315418A AU 2002315418 A1 AU2002315418 A1 AU 2002315418A1
Authority
AU
Australia
Prior art keywords
wafers
electronic circuit
circuit boards
reference images
optical inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002315418A
Inventor
Robert P. Bishop
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beltronics Inc
Original Assignee
Beltronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beltronics Inc filed Critical Beltronics Inc
Publication of AU2002315418A1 publication Critical patent/AU2002315418A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
AU2002315418A 2002-06-21 2002-06-21 Optical inspection of electronic circuit boards, wafers and the like, using skeletal reference images and separately programmable alignment tolerance and detection parameters Abandoned AU2002315418A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/019900 WO2004001674A1 (en) 2002-06-21 2002-06-21 Optical inspection of electronic circuit boards, wafers and the like, using skeletal reference images and separately programmable alignment tolerance and detection parameters

Publications (1)

Publication Number Publication Date
AU2002315418A1 true AU2002315418A1 (en) 2004-01-06

Family

ID=29998725

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002315418A Abandoned AU2002315418A1 (en) 2002-06-21 2002-06-21 Optical inspection of electronic circuit boards, wafers and the like, using skeletal reference images and separately programmable alignment tolerance and detection parameters

Country Status (2)

Country Link
AU (1) AU2002315418A1 (en)
WO (1) WO2004001674A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103514604A (en) * 2013-10-08 2014-01-15 天津工业大学 Method for extracting skeleton line of electronic speckle interference fringe image

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105335954A (en) * 2014-07-15 2016-02-17 周国烛 Visual inspection method of thick film circuit and system
CN110346704B (en) * 2019-07-02 2022-05-20 广州视源电子科技股份有限公司 Method, device and equipment for determining test file in board test and storage medium

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115343A (en) * 1984-06-29 1986-01-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Method of optically inspecting and analyzing integrated circuit
US4853967A (en) * 1984-06-29 1989-08-01 International Business Machines Corporation Method for automatic optical inspection analysis of integrated circuits
US5119434A (en) * 1990-12-31 1992-06-02 Beltronics, Inc. Method of and apparatus for geometric pattern inspection employing intelligent imaged-pattern shrinking, expanding and processing to identify predetermined features and tolerances
US5459795A (en) * 1991-02-26 1995-10-17 Matsushita Electric Industrial Co., Ltd. Wiring pattern inspection apparatus for printed circuit board
JP3265595B2 (en) * 1991-09-27 2002-03-11 オムロン株式会社 Image processing method and apparatus
JPH07117498B2 (en) * 1991-12-11 1995-12-18 インターナショナル・ビジネス・マシーンズ・コーポレイション Inspection system
US5452368A (en) * 1993-08-02 1995-09-19 Motorola, Inc. Method of detecting defects in semiconductor package leads
US6427024B1 (en) * 1999-04-02 2002-07-30 Beltronics, Inc. Apparatus for and method of automatic optical inspection of electronic circuit boards, wafers and the like for defects, using skeletal reference inspection and separately programmable alignment tolerance and detection parameters

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103514604A (en) * 2013-10-08 2014-01-15 天津工业大学 Method for extracting skeleton line of electronic speckle interference fringe image
CN103514604B (en) * 2013-10-08 2017-01-25 天津工业大学 Method for extracting skeleton line of electronic speckle interference fringe image

Also Published As

Publication number Publication date
WO2004001674A1 (en) 2003-12-31

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase