AU2002245560A1 - System and method of providing mask defect printability analysis - Google Patents

System and method of providing mask defect printability analysis

Info

Publication number
AU2002245560A1
AU2002245560A1 AU2002245560A AU2002245560A AU2002245560A1 AU 2002245560 A1 AU2002245560 A1 AU 2002245560A1 AU 2002245560 A AU2002245560 A AU 2002245560A AU 2002245560 A AU2002245560 A AU 2002245560A AU 2002245560 A1 AU2002245560 A1 AU 2002245560A1
Authority
AU
Australia
Prior art keywords
mask defect
providing mask
defect printability
printability analysis
analysis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002245560A
Inventor
Lynn Cai
Linard Karklin
Linyong Pang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Numerical Technologies Inc
Original Assignee
Numerical Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/814,023 external-priority patent/US6873720B2/en
Priority claimed from US09/814,025 external-priority patent/US6925202B2/en
Application filed by Numerical Technologies Inc filed Critical Numerical Technologies Inc
Publication of AU2002245560A1 publication Critical patent/AU2002245560A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2002245560A 2001-03-20 2002-02-28 System and method of providing mask defect printability analysis Abandoned AU2002245560A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/814,023 2001-03-20
US09/814,025 2001-03-20
US09/814,023 US6873720B2 (en) 2001-03-20 2001-03-20 System and method of providing mask defect printability analysis
US09/814,025 US6925202B2 (en) 2001-03-20 2001-03-20 System and method of providing mask quality control
PCT/US2002/006491 WO2002075793A2 (en) 2001-03-20 2002-02-28 System and method of providing mask defect printability analysis

Publications (1)

Publication Number Publication Date
AU2002245560A1 true AU2002245560A1 (en) 2002-10-03

Family

ID=27123806

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002245560A Abandoned AU2002245560A1 (en) 2001-03-20 2002-02-28 System and method of providing mask defect printability analysis

Country Status (5)

Country Link
JP (1) JP4663214B2 (en)
KR (1) KR100610441B1 (en)
CN (1) CN1290168C (en)
AU (1) AU2002245560A1 (en)
WO (1) WO2002075793A2 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
DE10360536B4 (en) * 2003-09-30 2006-12-21 Infineon Technologies Ag Method for inspecting masks of a mask set for a multiple exposure
US8151220B2 (en) * 2003-12-04 2012-04-03 Kla-Tencor Technologies Corp. Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data
KR101056142B1 (en) * 2004-01-29 2011-08-10 케이엘에이-텐코 코포레이션 Computerized method for detecting defects in reticle design data
CN100428401C (en) * 2004-06-14 2008-10-22 中芯国际集成电路制造(上海)有限公司 Method and system for treating similarity of semiconductor device finished product ratio
CN100413018C (en) * 2004-06-14 2008-08-20 中芯国际集成电路制造(上海)有限公司 Method and system for treating identity of semiconductor device
KR100841729B1 (en) 2004-09-14 2008-06-27 에이에스엠엘 마스크툴즈 비.브이. A method for performing full-chip manufacturing reliability checking and correction and a computer-readable recording medium for recording computer program which accomplishes thereof
JP4904034B2 (en) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション Method, system and carrier medium for evaluating reticle layout data
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
JP2006337668A (en) * 2005-06-01 2006-12-14 Toshiba Corp Method for manufacturing semiconductor device, and production program of layout pattern
US7617477B2 (en) * 2005-09-09 2009-11-10 Brion Technologies, Inc. Method for selecting and optimizing exposure tool using an individual mask error model
JP4774917B2 (en) * 2005-10-27 2011-09-21 凸版印刷株式会社 Mask pattern inspection apparatus and inspection method
US20070177788A1 (en) * 2006-01-31 2007-08-02 David Liu System and method for detecting wafer failure in wet bench applications
US7596736B2 (en) * 2006-03-24 2009-09-29 International Business Machines Corporation Iterative process for identifying systematics in data
US7794903B2 (en) * 2006-08-15 2010-09-14 Infineon Technologies Ag Metrology systems and methods for lithography processes
CN101512746B (en) * 2006-09-29 2010-08-11 佳能机械株式会社 Pick-up method and pick-up device
US8038897B2 (en) * 2007-02-06 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for wafer inspection
JP2009092954A (en) * 2007-10-09 2009-04-30 Toshiba Corp Pattern evaluation method
DE102007054994A1 (en) * 2007-11-17 2009-05-20 Carl Zeiss Sms Gmbh Method of repairing phase shift masks
NL1036189A1 (en) 2007-12-05 2009-06-08 Brion Tech Inc Methods and System for Lithography Process Window Simulation.
JP4942800B2 (en) 2009-08-18 2012-05-30 株式会社ニューフレアテクノロジー Inspection device
JP4918598B2 (en) * 2010-01-18 2012-04-18 株式会社ニューフレアテクノロジー Inspection apparatus and inspection method
US8196072B2 (en) * 2010-03-31 2012-06-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus of patterning semiconductor device
US8234603B2 (en) * 2010-07-14 2012-07-31 International Business Machines Corporation Method for fast estimation of lithographic binding patterns in an integrated circuit layout
CN102053093A (en) * 2010-11-08 2011-05-11 北京大学深圳研究生院 Method for detecting surface defects of chip cut from wafer surface
CN102789133B (en) * 2011-05-16 2014-09-03 中芯国际集成电路制造(上海)有限公司 After develop inspection method
CN102902154A (en) * 2011-07-29 2013-01-30 上海华虹Nec电子有限公司 Modeling method for optical proximity correction process model
JP6386569B2 (en) 2014-02-12 2018-09-05 エーエスエムエル ネザーランズ ビー.ブイ. How to optimize the process window
CN112530828A (en) 2014-06-10 2021-03-19 Asml荷兰有限公司 Computer readable medium
WO2017171890A1 (en) * 2016-04-02 2017-10-05 Intel Corporation Systems, methods, and apparatuses for reducing opc model error via a machine learning algorithm
US10451563B2 (en) * 2017-02-21 2019-10-22 Kla-Tencor Corporation Inspection of photomasks by comparing two photomasks
DE102017203879B4 (en) * 2017-03-09 2023-06-07 Carl Zeiss Smt Gmbh Method for analyzing a defect site of a photolithographic mask
US10503078B2 (en) * 2017-09-01 2019-12-10 Kla-Tencor Corporation Criticality analysis augmented process window qualification sampling
CN108932922B (en) * 2018-07-03 2021-05-14 京东方科技集团股份有限公司 Device and method for testing repair capability

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809341A (en) * 1986-07-18 1989-02-28 Fujitsu Limited Test method and apparatus for a reticle or mask pattern used in semiconductor device fabrication
US5029222A (en) * 1987-09-02 1991-07-02 Fujitsu Limited Photoelectron image projection apparatus
JPH04165353A (en) * 1990-10-30 1992-06-11 Oki Electric Ind Co Ltd Correction method of photo-mask
JPH0728226A (en) * 1993-04-30 1995-01-31 Internatl Business Mach Corp <Ibm> Equipment and method for measuring regional image
JP2776416B2 (en) * 1996-05-07 1998-07-16 日本電気株式会社 Reticle visual inspection device
US5795688A (en) * 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
JP3750270B2 (en) * 1997-04-21 2006-03-01 凸版印刷株式会社 Photomask defect analysis apparatus and defect analysis method
JP3750272B2 (en) * 1997-04-30 2006-03-01 凸版印刷株式会社 Photomask defect analysis apparatus, defect analysis method, and recording medium recording the defect analysis program
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US5965306A (en) * 1997-10-15 1999-10-12 International Business Machines Corporation Method of determining the printability of photomask defects
US6614924B1 (en) * 1999-08-02 2003-09-02 Applied Materials, Inc. Adaptive mask technique for defect inspection
JP2001056306A (en) * 1999-08-19 2001-02-27 Jeol Ltd Sample surface inspecting device

Also Published As

Publication number Publication date
CN1498418A (en) 2004-05-19
KR20040021591A (en) 2004-03-10
WO2002075793A3 (en) 2003-05-01
KR100610441B1 (en) 2006-08-08
JP2005500671A (en) 2005-01-06
WO2002075793A2 (en) 2002-09-26
CN1290168C (en) 2006-12-13
WO2002075793B1 (en) 2004-05-21
JP4663214B2 (en) 2011-04-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase