AU2002245560A1 - System and method of providing mask defect printability analysis - Google Patents
System and method of providing mask defect printability analysisInfo
- Publication number
- AU2002245560A1 AU2002245560A1 AU2002245560A AU2002245560A AU2002245560A1 AU 2002245560 A1 AU2002245560 A1 AU 2002245560A1 AU 2002245560 A AU2002245560 A AU 2002245560A AU 2002245560 A AU2002245560 A AU 2002245560A AU 2002245560 A1 AU2002245560 A1 AU 2002245560A1
- Authority
- AU
- Australia
- Prior art keywords
- mask defect
- providing mask
- defect printability
- printability analysis
- analysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/814,023 | 2001-03-20 | ||
US09/814,025 | 2001-03-20 | ||
US09/814,023 US6873720B2 (en) | 2001-03-20 | 2001-03-20 | System and method of providing mask defect printability analysis |
US09/814,025 US6925202B2 (en) | 2001-03-20 | 2001-03-20 | System and method of providing mask quality control |
PCT/US2002/006491 WO2002075793A2 (en) | 2001-03-20 | 2002-02-28 | System and method of providing mask defect printability analysis |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002245560A1 true AU2002245560A1 (en) | 2002-10-03 |
Family
ID=27123806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002245560A Abandoned AU2002245560A1 (en) | 2001-03-20 | 2002-02-28 | System and method of providing mask defect printability analysis |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4663214B2 (en) |
KR (1) | KR100610441B1 (en) |
CN (1) | CN1290168C (en) |
AU (1) | AU2002245560A1 (en) |
WO (1) | WO2002075793A2 (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
DE10360536B4 (en) * | 2003-09-30 | 2006-12-21 | Infineon Technologies Ag | Method for inspecting masks of a mask set for a multiple exposure |
US8151220B2 (en) * | 2003-12-04 | 2012-04-03 | Kla-Tencor Technologies Corp. | Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data |
KR101056142B1 (en) * | 2004-01-29 | 2011-08-10 | 케이엘에이-텐코 코포레이션 | Computerized method for detecting defects in reticle design data |
CN100428401C (en) * | 2004-06-14 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | Method and system for treating similarity of semiconductor device finished product ratio |
CN100413018C (en) * | 2004-06-14 | 2008-08-20 | 中芯国际集成电路制造(上海)有限公司 | Method and system for treating identity of semiconductor device |
KR100841729B1 (en) | 2004-09-14 | 2008-06-27 | 에이에스엠엘 마스크툴즈 비.브이. | A method for performing full-chip manufacturing reliability checking and correction and a computer-readable recording medium for recording computer program which accomplishes thereof |
JP4904034B2 (en) * | 2004-09-14 | 2012-03-28 | ケーエルエー−テンカー コーポレイション | Method, system and carrier medium for evaluating reticle layout data |
US7729529B2 (en) * | 2004-12-07 | 2010-06-01 | Kla-Tencor Technologies Corp. | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle |
JP2006337668A (en) * | 2005-06-01 | 2006-12-14 | Toshiba Corp | Method for manufacturing semiconductor device, and production program of layout pattern |
US7617477B2 (en) * | 2005-09-09 | 2009-11-10 | Brion Technologies, Inc. | Method for selecting and optimizing exposure tool using an individual mask error model |
JP4774917B2 (en) * | 2005-10-27 | 2011-09-21 | 凸版印刷株式会社 | Mask pattern inspection apparatus and inspection method |
US20070177788A1 (en) * | 2006-01-31 | 2007-08-02 | David Liu | System and method for detecting wafer failure in wet bench applications |
US7596736B2 (en) * | 2006-03-24 | 2009-09-29 | International Business Machines Corporation | Iterative process for identifying systematics in data |
US7794903B2 (en) * | 2006-08-15 | 2010-09-14 | Infineon Technologies Ag | Metrology systems and methods for lithography processes |
CN101512746B (en) * | 2006-09-29 | 2010-08-11 | 佳能机械株式会社 | Pick-up method and pick-up device |
US8038897B2 (en) * | 2007-02-06 | 2011-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for wafer inspection |
JP2009092954A (en) * | 2007-10-09 | 2009-04-30 | Toshiba Corp | Pattern evaluation method |
DE102007054994A1 (en) * | 2007-11-17 | 2009-05-20 | Carl Zeiss Sms Gmbh | Method of repairing phase shift masks |
NL1036189A1 (en) | 2007-12-05 | 2009-06-08 | Brion Tech Inc | Methods and System for Lithography Process Window Simulation. |
JP4942800B2 (en) | 2009-08-18 | 2012-05-30 | 株式会社ニューフレアテクノロジー | Inspection device |
JP4918598B2 (en) * | 2010-01-18 | 2012-04-18 | 株式会社ニューフレアテクノロジー | Inspection apparatus and inspection method |
US8196072B2 (en) * | 2010-03-31 | 2012-06-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus of patterning semiconductor device |
US8234603B2 (en) * | 2010-07-14 | 2012-07-31 | International Business Machines Corporation | Method for fast estimation of lithographic binding patterns in an integrated circuit layout |
CN102053093A (en) * | 2010-11-08 | 2011-05-11 | 北京大学深圳研究生院 | Method for detecting surface defects of chip cut from wafer surface |
CN102789133B (en) * | 2011-05-16 | 2014-09-03 | 中芯国际集成电路制造(上海)有限公司 | After develop inspection method |
CN102902154A (en) * | 2011-07-29 | 2013-01-30 | 上海华虹Nec电子有限公司 | Modeling method for optical proximity correction process model |
JP6386569B2 (en) | 2014-02-12 | 2018-09-05 | エーエスエムエル ネザーランズ ビー.ブイ. | How to optimize the process window |
CN112530828A (en) | 2014-06-10 | 2021-03-19 | Asml荷兰有限公司 | Computer readable medium |
WO2017171890A1 (en) * | 2016-04-02 | 2017-10-05 | Intel Corporation | Systems, methods, and apparatuses for reducing opc model error via a machine learning algorithm |
US10451563B2 (en) * | 2017-02-21 | 2019-10-22 | Kla-Tencor Corporation | Inspection of photomasks by comparing two photomasks |
DE102017203879B4 (en) * | 2017-03-09 | 2023-06-07 | Carl Zeiss Smt Gmbh | Method for analyzing a defect site of a photolithographic mask |
US10503078B2 (en) * | 2017-09-01 | 2019-12-10 | Kla-Tencor Corporation | Criticality analysis augmented process window qualification sampling |
CN108932922B (en) * | 2018-07-03 | 2021-05-14 | 京东方科技集团股份有限公司 | Device and method for testing repair capability |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4809341A (en) * | 1986-07-18 | 1989-02-28 | Fujitsu Limited | Test method and apparatus for a reticle or mask pattern used in semiconductor device fabrication |
US5029222A (en) * | 1987-09-02 | 1991-07-02 | Fujitsu Limited | Photoelectron image projection apparatus |
JPH04165353A (en) * | 1990-10-30 | 1992-06-11 | Oki Electric Ind Co Ltd | Correction method of photo-mask |
JPH0728226A (en) * | 1993-04-30 | 1995-01-31 | Internatl Business Mach Corp <Ibm> | Equipment and method for measuring regional image |
JP2776416B2 (en) * | 1996-05-07 | 1998-07-16 | 日本電気株式会社 | Reticle visual inspection device |
US5795688A (en) * | 1996-08-14 | 1998-08-18 | Micron Technology, Inc. | Process for detecting defects in photomasks through aerial image comparisons |
JP3750270B2 (en) * | 1997-04-21 | 2006-03-01 | 凸版印刷株式会社 | Photomask defect analysis apparatus and defect analysis method |
JP3750272B2 (en) * | 1997-04-30 | 2006-03-01 | 凸版印刷株式会社 | Photomask defect analysis apparatus, defect analysis method, and recording medium recording the defect analysis program |
US6757645B2 (en) * | 1997-09-17 | 2004-06-29 | Numerical Technologies, Inc. | Visual inspection and verification system |
US5965306A (en) * | 1997-10-15 | 1999-10-12 | International Business Machines Corporation | Method of determining the printability of photomask defects |
US6614924B1 (en) * | 1999-08-02 | 2003-09-02 | Applied Materials, Inc. | Adaptive mask technique for defect inspection |
JP2001056306A (en) * | 1999-08-19 | 2001-02-27 | Jeol Ltd | Sample surface inspecting device |
-
2002
- 2002-02-28 JP JP2002574111A patent/JP4663214B2/en not_active Expired - Lifetime
- 2002-02-28 WO PCT/US2002/006491 patent/WO2002075793A2/en active Application Filing
- 2002-02-28 CN CNB028069951A patent/CN1290168C/en not_active Expired - Lifetime
- 2002-02-28 KR KR1020037012260A patent/KR100610441B1/en active IP Right Grant
- 2002-02-28 AU AU2002245560A patent/AU2002245560A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1498418A (en) | 2004-05-19 |
KR20040021591A (en) | 2004-03-10 |
WO2002075793A3 (en) | 2003-05-01 |
KR100610441B1 (en) | 2006-08-08 |
JP2005500671A (en) | 2005-01-06 |
WO2002075793A2 (en) | 2002-09-26 |
CN1290168C (en) | 2006-12-13 |
WO2002075793B1 (en) | 2004-05-21 |
JP4663214B2 (en) | 2011-04-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2002245560A1 (en) | System and method of providing mask defect printability analysis | |
AU2001294946A1 (en) | Method and apparatus for analysis of variables | |
AU2002362289A1 (en) | Apparatus for making composite structures and method of making same | |
WO2002077813A8 (en) | Development and testing system and method | |
AU2002365224A1 (en) | Physiomagnetometric inspection and surveillance system and method | |
AU2002310341A1 (en) | Method and system for providing context awareness | |
AU3754100A (en) | System and method for performing assertion-based analysis of circuit designs | |
EP1579274A3 (en) | Method and system for context-specific mask inspection | |
AU2002237424A1 (en) | Sport analysis system and method | |
AU2003287598A1 (en) | Method and system for nondestructive inspection of components | |
AU2002353612A1 (en) | System and method of international patent application | |
AU2002359734A1 (en) | System and method for identification of false statements | |
AU2002311132A1 (en) | Method and apparatus for spectrom analysis | |
WO2002077885A8 (en) | Distribution system and method of operation thereof | |
IL158670A0 (en) | Securities analysis method and system | |
AU2002345621A1 (en) | Method and system for providing enhanced forms of financial instruments | |
AU2002305092A1 (en) | Method and system for high-throughput screening | |
AU2003224297A1 (en) | System and method for multiparameter analysis of analytes | |
AU2002306430A1 (en) | Systems and methods for inspection of specimen surfaces | |
AU2002242763A1 (en) | Method and apparatus for identifying sounds | |
WO2002057987A8 (en) | System and method for association of object sets | |
AU2002341851A1 (en) | System and method for inspecting components | |
AUPQ669200A0 (en) | Method of and system for providing an on-line leader-board | |
AU2002255522A1 (en) | Method of and system for providing metacognitive processing for simulating cognitive tasks | |
AU2002250475A1 (en) | Securities analysis method and system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |