AU2001288119A1 - Epoxy resin molding material for sealing - Google Patents
Epoxy resin molding material for sealingInfo
- Publication number
- AU2001288119A1 AU2001288119A1 AU2001288119A AU8811901A AU2001288119A1 AU 2001288119 A1 AU2001288119 A1 AU 2001288119A1 AU 2001288119 A AU2001288119 A AU 2001288119A AU 8811901 A AU8811901 A AU 8811901A AU 2001288119 A1 AU2001288119 A1 AU 2001288119A1
- Authority
- AU
- Australia
- Prior art keywords
- sealing
- epoxy resin
- molding material
- resin molding
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Applications Claiming Priority (17)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000291067 | 2000-09-25 | ||
JP2000-291067 | 2000-09-25 | ||
JP2000402359 | 2000-12-28 | ||
JP2000402361 | 2000-12-28 | ||
JP2000402360 | 2000-12-28 | ||
JP2000402358 | 2000-12-28 | ||
JP2000402363 | 2000-12-28 | ||
JP2000402362 | 2000-12-28 | ||
JP2000-402361 | 2001-03-22 | ||
JP2001-82741 | 2001-03-22 | ||
JP2000-402360 | 2001-03-22 | ||
JP2001082741 | 2001-03-22 | ||
JP2000-402359 | 2001-03-22 | ||
JP2000-402362 | 2001-03-22 | ||
JP2000-402358 | 2001-03-22 | ||
JP2000-402363 | 2001-03-22 | ||
PCT/JP2001/008303 WO2002024808A1 (en) | 2000-09-25 | 2001-09-25 | Epoxy resin molding material for sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001288119A1 true AU2001288119A1 (en) | 2002-04-02 |
Family
ID=27573722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001288119A Abandoned AU2001288119A1 (en) | 2000-09-25 | 2001-09-25 | Epoxy resin molding material for sealing |
Country Status (6)
Country | Link |
---|---|
US (2) | US20030201548A1 (en) |
JP (1) | JP3511136B2 (en) |
KR (1) | KR100524032B1 (en) |
CN (1) | CN100462401C (en) |
AU (1) | AU2001288119A1 (en) |
WO (1) | WO2002024808A1 (en) |
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CN1246246C (en) * | 2000-10-04 | 2006-03-22 | 詹姆斯哈迪国际财金公司 | Fiber cement composition materials using cellulose fibers loaded with inorganic and/or organic substances |
JP4568985B2 (en) * | 2000-10-31 | 2010-10-27 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
TW544882B (en) | 2001-12-31 | 2003-08-01 | Megic Corp | Chip package structure and process thereof |
TW584950B (en) | 2001-12-31 | 2004-04-21 | Megic Corp | Chip packaging structure and process thereof |
TW503496B (en) | 2001-12-31 | 2002-09-21 | Megic Corp | Chip packaging structure and manufacturing process of the same |
US6673698B1 (en) | 2002-01-19 | 2004-01-06 | Megic Corporation | Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
US20050222300A1 (en) * | 2002-02-27 | 2005-10-06 | Ryoichi Ikezawa | Encapsulating epoxy resin composition, and electronic parts device using the same |
TWI230724B (en) * | 2002-02-27 | 2005-04-11 | Hitachi Chemical Co Ltd | Encapsulating epoxy resin composition, and electronic parts device using the same |
US7157313B2 (en) * | 2003-01-17 | 2007-01-02 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition and semiconductor device using thereof |
US6856009B2 (en) * | 2003-03-11 | 2005-02-15 | Micron Technology, Inc. | Techniques for packaging multiple device components |
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US20090143511A1 (en) * | 2004-07-13 | 2009-06-04 | Hitachi Chemical Co., Ltd. | Encapsulated epoxy-resin molding compound, and electronic component device |
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JP5045985B2 (en) * | 2006-09-27 | 2012-10-10 | 日立化成工業株式会社 | Epoxy resin composition and electronic component device |
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US8941962B2 (en) * | 2011-09-13 | 2015-01-27 | Fsp Technology Inc. | Snubber circuit and method of using bipolar junction transistor in snubber circuit |
JP5769674B2 (en) * | 2012-08-08 | 2015-08-26 | 日東電工株式会社 | Resin sheet for encapsulating electronic components, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device |
RU2618704C2 (en) | 2012-08-09 | 2017-05-11 | Вэлспар Сорсинг, Инк. | Compositions for containers and other products and their application methods |
EP2882658B1 (en) | 2012-08-09 | 2021-09-08 | Swimc Llc | Container coating system |
CN106536624B (en) | 2014-04-14 | 2019-11-19 | 宣伟投资管理有限公司 | Preparation is used for the method for the composition of container and other products and the method using the composition |
US20160093851A1 (en) * | 2014-09-30 | 2016-03-31 | Johnson Controls Technology Company | Battery module with individually restrained battery cells |
TWI614275B (en) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | Liquid epoxy resin composition for preparing a polymer |
EP3835366B1 (en) * | 2018-08-06 | 2023-05-03 | Daihachi Chemical Industry Co., Ltd. | Thermosetting resin composition comprising flame retardant including aromatic phosphoric acid ester and cured material |
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JP2606714B2 (en) * | 1988-01-25 | 1997-05-07 | ファナック株式会社 | Numerical control unit |
JPH0714744B2 (en) * | 1988-12-15 | 1995-02-22 | 旭有機材工業株式会社 | Tray for integrated circuits |
KR960012452B1 (en) * | 1989-02-20 | 1996-09-20 | 토레이 가부시키가이샤 | Semiconductor device-encapsulating epoxy resin composition |
US5919844A (en) * | 1995-12-28 | 1999-07-06 | Toray Industries, Inc. | Epoxy resin composition |
JP3267144B2 (en) | 1996-03-22 | 2002-03-18 | 松下電工株式会社 | Epoxy resin composition for sealing material and semiconductor device using the same |
JP3257426B2 (en) * | 1996-12-27 | 2002-02-18 | 日立化成工業株式会社 | Epoxy resin molding material for sealing electronic parts and electronic parts |
JPH10195179A (en) | 1997-01-08 | 1998-07-28 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith |
JPH10237161A (en) | 1997-02-24 | 1998-09-08 | Toray Ind Inc | Epoxy resin composition |
JPH10237160A (en) | 1997-02-24 | 1998-09-08 | Toray Ind Inc | Epoxy resin composition, and semiconductor device |
JPH10279665A (en) * | 1997-04-01 | 1998-10-20 | Toray Ind Inc | Epoxy resin composition for semiconductor sealing |
JP3890681B2 (en) * | 1997-06-30 | 2007-03-07 | 日立化成工業株式会社 | Epoxy resin molding material for electronic component sealing and electronic component |
JP3295630B2 (en) * | 1997-10-24 | 2002-06-24 | 日立化成工業株式会社 | Epoxy resin molding material for sealing electronic parts and electronic parts |
JP3295629B2 (en) * | 1997-10-24 | 2002-06-24 | 日立化成工業株式会社 | Epoxy resin molding material for sealing electronic parts and electronic parts |
US6139978A (en) * | 1998-01-12 | 2000-10-31 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith |
JP3295643B2 (en) * | 1998-03-19 | 2002-06-24 | 日立化成工業株式会社 | Epoxy resin molding compound for sealing and electronic component device |
KR100562454B1 (en) * | 1998-07-21 | 2006-03-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Epoxy Resin Compositions for Sealing Semiconductor and Semiconductor Devices |
JP2000129093A (en) | 1998-10-26 | 2000-05-09 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic component device |
-
2001
- 2001-09-25 US US10/381,052 patent/US20030201548A1/en not_active Abandoned
- 2001-09-25 JP JP2002529210A patent/JP3511136B2/en not_active Expired - Fee Related
- 2001-09-25 AU AU2001288119A patent/AU2001288119A1/en not_active Abandoned
- 2001-09-25 WO PCT/JP2001/008303 patent/WO2002024808A1/en active IP Right Grant
- 2001-09-25 KR KR10-2003-7004296A patent/KR100524032B1/en active IP Right Grant
- 2001-09-25 CN CNB018161766A patent/CN100462401C/en not_active Expired - Lifetime
-
2005
- 2005-10-28 US US11/260,463 patent/US7544727B2/en not_active Expired - Fee Related
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KR20030040492A (en) | 2003-05-22 |
CN1466610A (en) | 2004-01-07 |
KR100524032B1 (en) | 2005-10-26 |
US20030201548A1 (en) | 2003-10-30 |
JPWO2002024808A1 (en) | 2004-01-29 |
CN100462401C (en) | 2009-02-18 |
WO2002024808A1 (en) | 2002-03-28 |
US7544727B2 (en) | 2009-06-09 |
US20060074150A1 (en) | 2006-04-06 |
JP3511136B2 (en) | 2004-03-29 |
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