AU2001277930A1 - Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer - Google Patents

Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer

Info

Publication number
AU2001277930A1
AU2001277930A1 AU2001277930A AU7793001A AU2001277930A1 AU 2001277930 A1 AU2001277930 A1 AU 2001277930A1 AU 2001277930 A AU2001277930 A AU 2001277930A AU 7793001 A AU7793001 A AU 7793001A AU 2001277930 A1 AU2001277930 A1 AU 2001277930A1
Authority
AU
Australia
Prior art keywords
wafer
opposite direction
polishing pad
cmp apparatus
pad rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001277930A
Inventor
John M. Boyd
Yehiel Gotkis
Aleksander A. Owczarz
Miguel A. Saldana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001277930A1 publication Critical patent/AU2001277930A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001277930A 2000-08-22 2001-07-19 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer Abandoned AU2001277930A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/644,135 2000-08-22
US09/644,135 US6585572B1 (en) 2000-08-22 2000-08-22 Subaperture chemical mechanical polishing system
PCT/US2001/022846 WO2002016075A2 (en) 2000-08-22 2001-07-19 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer

Publications (1)

Publication Number Publication Date
AU2001277930A1 true AU2001277930A1 (en) 2002-03-04

Family

ID=24583589

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001277930A Abandoned AU2001277930A1 (en) 2000-08-22 2001-07-19 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer

Country Status (8)

Country Link
US (1) US6585572B1 (en)
EP (1) EP1311366A2 (en)
JP (1) JP2004507097A (en)
KR (1) KR20030024867A (en)
CN (1) CN1182940C (en)
AU (1) AU2001277930A1 (en)
TW (1) TW491748B (en)
WO (1) WO2002016075A2 (en)

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US9751189B2 (en) * 2014-07-03 2017-09-05 Applied Materials, Inc. Compliant polishing pad and polishing module
US9987724B2 (en) * 2014-07-18 2018-06-05 Applied Materials, Inc. Polishing system with pad carrier and conditioning station
CN112091809B (en) * 2014-10-03 2022-11-29 株式会社荏原制作所 Processing assembly and processing method
JP6585445B2 (en) 2015-09-28 2019-10-02 株式会社荏原製作所 Polishing method
CN105598827B (en) * 2016-01-05 2018-05-22 天津华海清科机电科技有限公司 Chemical-mechanical polishing mathing
JP6938262B2 (en) * 2017-07-24 2021-09-22 株式会社ディスコ Wafer processing method
CN109732472A (en) * 2017-10-31 2019-05-10 上海新昇半导体科技有限公司 Polissoir and method

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Also Published As

Publication number Publication date
EP1311366A2 (en) 2003-05-21
CN1182940C (en) 2005-01-05
WO2002016075A2 (en) 2002-02-28
CN1447734A (en) 2003-10-08
JP2004507097A (en) 2004-03-04
KR20030024867A (en) 2003-03-26
WO2002016075A3 (en) 2002-08-15
TW491748B (en) 2002-06-21
US6585572B1 (en) 2003-07-01

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