AU2003275655A1 - Polishing slurry and polished substrate - Google Patents
Polishing slurry and polished substrateInfo
- Publication number
- AU2003275655A1 AU2003275655A1 AU2003275655A AU2003275655A AU2003275655A1 AU 2003275655 A1 AU2003275655 A1 AU 2003275655A1 AU 2003275655 A AU2003275655 A AU 2003275655A AU 2003275655 A AU2003275655 A AU 2003275655A AU 2003275655 A1 AU2003275655 A1 AU 2003275655A1
- Authority
- AU
- Australia
- Prior art keywords
- polishing slurry
- polished substrate
- polished
- substrate
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002311212 | 2002-10-25 | ||
JP2002-311212 | 2002-10-25 | ||
US42337602P | 2002-11-04 | 2002-11-04 | |
US60/423,376 | 2002-11-04 | ||
PCT/JP2003/013641 WO2004037943A1 (en) | 2002-10-25 | 2003-10-24 | Polishing slurry and polished substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003275655A1 true AU2003275655A1 (en) | 2004-05-13 |
Family
ID=34611350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003275655A Abandoned AU2003275655A1 (en) | 2002-10-25 | 2003-10-24 | Polishing slurry and polished substrate |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050287931A1 (en) |
EP (1) | EP1554357A1 (en) |
AU (1) | AU2003275655A1 (en) |
WO (1) | WO2004037943A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004349426A (en) * | 2003-05-21 | 2004-12-09 | Jsr Corp | Chemical mechanical polishing method for sti |
JP2006089363A (en) * | 2004-08-27 | 2006-04-06 | Showa Denko Kk | Process for manufacturing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium obtained by the process, and magnetic recording medium obtained using the substrate |
TWI323741B (en) * | 2004-12-16 | 2010-04-21 | K C Tech Co Ltd | Abrasive particles, polishing slurry, and producing method thereof |
JP2007214205A (en) * | 2006-02-07 | 2007-08-23 | Fujimi Inc | Polishing composition |
JP5448824B2 (en) * | 2006-10-16 | 2014-03-19 | キャボット マイクロエレクトロニクス コーポレイション | Glass polishing composition and method |
DE102006061891A1 (en) * | 2006-12-28 | 2008-07-03 | Basf Se | Composition for polishing surfaces, especially of semiconductors, comprises a lanthanide oxide abrasive, a polymeric dispersant, a polysaccharide gelling agent and water |
SG188090A1 (en) * | 2008-02-01 | 2013-03-28 | Fujimi Inc | Polishing composition and polishing method using the same |
JP2009280410A (en) * | 2008-04-21 | 2009-12-03 | Konica Minolta Opto Inc | Mold for forming glass substrate, method of manufacturing glass substrate, method of manufacturing glass substrate for information recording medium, method of manufacturing information recording medium, glass substrate for information recording medium, and information recording medium |
JP5326638B2 (en) * | 2009-02-18 | 2013-10-30 | 富士電機株式会社 | Method of manufacturing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium in which it is used, and perpendicular magnetic recording medium |
RU2607214C2 (en) * | 2010-09-08 | 2017-01-10 | Басф Се | Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices |
JP5695068B2 (en) * | 2010-09-30 | 2015-04-01 | Hoya株式会社 | Method for manufacturing glass substrate for information recording medium and method for manufacturing information recording medium |
CN102751187B (en) * | 2011-04-20 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | The formation method of finishing method and grid |
CN102911605A (en) * | 2011-08-05 | 2013-02-06 | 安集微电子(上海)有限公司 | Chemical mechanical polishing solution |
US8859428B2 (en) * | 2012-10-19 | 2014-10-14 | Air Products And Chemicals, Inc. | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof |
WO2014070461A1 (en) * | 2012-11-02 | 2014-05-08 | Lawrence Livermore National Security, Llc | Method for preventing agglomeration of charged colloids without loss of surface activity |
JP6393231B2 (en) * | 2015-05-08 | 2018-09-19 | 信越化学工業株式会社 | Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate |
KR20180095846A (en) * | 2015-12-16 | 2018-08-28 | 로디아 오퍼레이션스 | Method for polishing a phosphate glass or fluorophosphate glass substrate |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000248263A (en) * | 1999-03-01 | 2000-09-12 | Hitachi Chem Co Ltd | Cmp grinding liquid |
US7037352B2 (en) * | 2000-12-12 | 2006-05-02 | Showa Denko Kabushiki Kaisha | Polishing particle and method for producing polishing particle |
TWI292780B (en) * | 2000-12-12 | 2008-01-21 | Showa Denko Kk |
-
2003
- 2003-10-24 WO PCT/JP2003/013641 patent/WO2004037943A1/en not_active Application Discontinuation
- 2003-10-24 AU AU2003275655A patent/AU2003275655A1/en not_active Abandoned
- 2003-10-24 US US10/532,802 patent/US20050287931A1/en not_active Abandoned
- 2003-10-24 EP EP03758887A patent/EP1554357A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20050287931A1 (en) | 2005-12-29 |
WO2004037943A1 (en) | 2004-05-06 |
EP1554357A1 (en) | 2005-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |