AU2001275027A1 - Slip resistant horizontal semiconductor wafer boat - Google Patents

Slip resistant horizontal semiconductor wafer boat

Info

Publication number
AU2001275027A1
AU2001275027A1 AU2001275027A AU7502701A AU2001275027A1 AU 2001275027 A1 AU2001275027 A1 AU 2001275027A1 AU 2001275027 A AU2001275027 A AU 2001275027A AU 7502701 A AU7502701 A AU 7502701A AU 2001275027 A1 AU2001275027 A1 AU 2001275027A1
Authority
AU
Australia
Prior art keywords
semiconductor wafer
wafer boat
slip resistant
horizontal semiconductor
resistant horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275027A
Inventor
Richard F. Buckley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of AU2001275027A1 publication Critical patent/AU2001275027A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001275027A 2000-06-06 2001-05-30 Slip resistant horizontal semiconductor wafer boat Abandoned AU2001275027A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09588396 2000-06-06
US09/588,396 US7055702B1 (en) 2000-06-06 2000-06-06 Slip resistant horizontal semiconductor wafer boat
PCT/US2001/017444 WO2001095374A2 (en) 2000-06-06 2001-05-30 Slip resistant horizontal semiconductor wafer boat

Publications (1)

Publication Number Publication Date
AU2001275027A1 true AU2001275027A1 (en) 2001-12-17

Family

ID=24353674

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001275027A Abandoned AU2001275027A1 (en) 2000-06-06 2001-05-30 Slip resistant horizontal semiconductor wafer boat

Country Status (7)

Country Link
US (1) US7055702B1 (en)
JP (1) JP3831337B2 (en)
KR (1) KR100561804B1 (en)
CN (1) CN1177350C (en)
AU (1) AU2001275027A1 (en)
TW (1) TW548772B (en)
WO (1) WO2001095374A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040188319A1 (en) * 2003-03-28 2004-09-30 Saint-Gobain Ceramics & Plastics, Inc. Wafer carrier having improved processing characteristics
JP5205738B2 (en) * 2006-10-16 2013-06-05 株式会社Ｓｕｍｃｏ Silicon wafer support method, heat treatment jig and heat treatment wafer
US20080157455A1 (en) * 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
WO2010054130A1 (en) * 2008-11-05 2010-05-14 Tosoh Quartz, Inc. High strength camfer on quartzware
WO2011008753A1 (en) * 2009-07-13 2011-01-20 Greene, Tweed Of Delaware, Inc. Chimerized wafer boats for use in semiconductor chip processing and related methods
CN102560683B (en) * 2010-12-29 2015-09-30 有研半导体材料有限公司 A kind of prevent silicon chip from heat treatment process, collapsing limit method and quartz boat
CN107750282B (en) * 2015-04-13 2019-11-08 科恩迈尔特种石墨集团有限责任公司 PECVD boat
CN109887873B (en) * 2019-02-14 2021-02-23 扬州美和光电科技有限公司 Production and processing method of high-quality quartz boat
CN111892419A (en) * 2020-08-03 2020-11-06 福赛特(唐山)新材料有限公司 High-shock-resistance silicon carbide boat and preparation method thereof

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2917179A (en) * 1955-07-08 1959-12-15 Robert T Casey Record holder
US3623615A (en) * 1968-07-09 1971-11-30 Albert A Kawachi Tape reel storage apparatus
US3527353A (en) * 1968-08-13 1970-09-08 Paul L Farren Storage device
DE2133877A1 (en) * 1971-07-07 1973-01-18 Siemens Ag ARRANGEMENT FOR DIFFUSING DOCTANTS INTO SEMICONDUCTOR DISCS
US4023691A (en) 1975-09-15 1977-05-17 United States Fused Quartz Company, Inc. Method of transferring semi-conductor discs by a hinged transfer carrier
US4318749A (en) * 1980-06-23 1982-03-09 Rca Corporation Wettable carrier in gas drying system for wafers
US4653636A (en) 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
JPH0824140B2 (en) 1986-12-26 1996-03-06 東芝セラミックス株式会社 Silicon wafer processing jig
JP2568209B2 (en) 1987-07-16 1996-12-25 東芝セラミックス株式会社 Cantilever for semiconductor processing
JPH01130522A (en) 1987-11-17 1989-05-23 Toshiba Ceramics Co Ltd Manufacture of wafer boat
JPH0752720B2 (en) 1988-05-31 1995-06-05 信越半導体株式会社 Method for forming holding groove of semiconductor wafer holding device
JPH04287915A (en) 1991-02-07 1992-10-13 Mitsubishi Electric Corp Wafer boat
JPH04300262A (en) 1991-03-28 1992-10-23 Shin Etsu Chem Co Ltd Siliceous carbide jig
JPH05144756A (en) 1991-11-20 1993-06-11 Fujitsu Ltd Boat for housing substrates
US5318190A (en) * 1992-09-24 1994-06-07 New Dimensions Research Corporation Adjustable display tray
JPH06124911A (en) 1992-10-09 1994-05-06 Toshiba Ceramics Co Ltd Horizontal boat
JPH06333865A (en) 1993-05-19 1994-12-02 Toshiba Ceramics Co Ltd Water boat
JP3166142B2 (en) 1994-03-29 2001-05-14 信越半導体株式会社 Heat treatment method for semiconductor wafer
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5443649A (en) * 1994-11-22 1995-08-22 Sibley; Thomas Silicon carbide carrier for wafer processing in vertical furnaces
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
KR19980016043A (en) 1996-08-26 1998-05-25 김광호 Loading duct for wafer boat mounting of semiconductor equipment
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
EP0901152B1 (en) * 1997-09-03 2003-04-02 Nippon Pillar Packing Co., Ltd. Semiconductor wafer holder with CVD silicon carbide film coating
JPH11238728A (en) 1997-12-16 1999-08-31 Fujitsu Ltd Heat treatment jig for use in production of semiconductor devices and manufacture of the same
US5931666A (en) * 1998-02-27 1999-08-03 Saint-Gobain Industrial Ceramics, Inc. Slip free vertical rack design having rounded horizontal arms

Also Published As

Publication number Publication date
JP2003536254A (en) 2003-12-02
CN1401133A (en) 2003-03-05
US7055702B1 (en) 2006-06-06
JP3831337B2 (en) 2006-10-11
TW548772B (en) 2003-08-21
WO2001095374A3 (en) 2002-06-20
KR20020027527A (en) 2002-04-13
WO2001095374A2 (en) 2001-12-13
CN1177350C (en) 2004-11-24
KR100561804B1 (en) 2006-03-21

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