AU2001270315A1 - Evaporator employing a liquid superheat tolerant wick - Google Patents

Evaporator employing a liquid superheat tolerant wick

Info

Publication number
AU2001270315A1
AU2001270315A1 AU2001270315A AU7031501A AU2001270315A1 AU 2001270315 A1 AU2001270315 A1 AU 2001270315A1 AU 2001270315 A AU2001270315 A AU 2001270315A AU 7031501 A AU7031501 A AU 7031501A AU 2001270315 A1 AU2001270315 A1 AU 2001270315A1
Authority
AU
Australia
Prior art keywords
liquid
vapor
wick
outlet
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001270315A
Inventor
Edward J. Kroliczek
David A. Wolf
Kimberly R. Wrenn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swales Aerospace
Original Assignee
Swales Aerospace
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swales Aerospace filed Critical Swales Aerospace
Publication of AU2001270315A1 publication Critical patent/AU2001270315A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Central Heating Systems (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Engine Equipment That Uses Special Cycles (AREA)

Abstract

A two-phase heat transfer system includes an evaporator, a condenser, a vapor line, and a liquid return line. The evaporator includes a liquid inlet, a vapor outlet, and a capillary wick having a first surface adjacent the liquid inlet and a second surface adjacent the vapor outlet. The condenser includes a vapor inlet and a liquid outlet. The vapor line provides fluid communication between the vapor outlet and the vapor inlet. The liquid return line provides fluid communication between the liquid outlet and the liquid inlet. The wick is substantially free of back-conduction of energy from the second surface to the first surface due to an increase in a conduction path from the second surface to the first surface and due to suppression of nucleation of a working fluid from the second surface to the first surface to promote liquid superheat tolerance in the wick.
AU2001270315A 2000-05-16 2001-05-15 Evaporator employing a liquid superheat tolerant wick Abandoned AU2001270315A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/571,779 US6382309B1 (en) 2000-05-16 2000-05-16 Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US09/571,779 2000-05-16
PCT/US2001/040734 WO2001088456A2 (en) 2000-05-16 2001-05-15 Evaporator employing a liquid superheat tolerant wick

Publications (1)

Publication Number Publication Date
AU2001270315A1 true AU2001270315A1 (en) 2001-11-26

Family

ID=24285012

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001270315A Abandoned AU2001270315A1 (en) 2000-05-16 2001-05-15 Evaporator employing a liquid superheat tolerant wick

Country Status (6)

Country Link
US (5) US6382309B1 (en)
EP (1) EP1283977B1 (en)
AT (1) ATE374915T1 (en)
AU (1) AU2001270315A1 (en)
DE (1) DE60130756T2 (en)
WO (1) WO2001088456A2 (en)

Families Citing this family (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6382309B1 (en) 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US7549461B2 (en) * 2000-06-30 2009-06-23 Alliant Techsystems Inc. Thermal management system
US8136580B2 (en) 2000-06-30 2012-03-20 Alliant Techsystems Inc. Evaporator for a heat transfer system
US7004240B1 (en) 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
US7251889B2 (en) * 2000-06-30 2007-08-07 Swales & Associates, Inc. Manufacture of a heat transfer system
DE60117797D1 (en) * 2000-06-30 2006-05-04 Swales Aerospace Bentsville PHASE CONTROL IN A CAPILLARY EVAPORATOR
US8109325B2 (en) * 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US7708053B2 (en) * 2000-06-30 2010-05-04 Alliant Techsystems Inc. Heat transfer system
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US6601643B2 (en) * 2001-04-27 2003-08-05 Samsung Electronics Co., Ltd Flat evaporator
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
JP3680040B2 (en) * 2002-04-22 2005-08-10 三菱電機株式会社 heat pipe
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
US7117930B2 (en) 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US6830098B1 (en) 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US7161802B2 (en) * 2002-08-02 2007-01-09 Raytheon Company Thermal management system having porous fluid transfer element
US6880626B2 (en) * 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
DE60325749D1 (en) 2002-10-02 2009-02-26 Swales Aerospace Inc
US20040118553A1 (en) * 2002-12-23 2004-06-24 Graftech, Inc. Flexible graphite thermal management devices
JP2004245550A (en) * 2003-02-17 2004-09-02 Fujikura Ltd Heat pipe superior in circulating characteristic
US7823629B2 (en) * 2003-03-20 2010-11-02 Thermal Corp. Capillary assisted loop thermosiphon apparatus
US6945317B2 (en) * 2003-04-24 2005-09-20 Thermal Corp. Sintered grooved wick with particle web
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US20050022976A1 (en) * 2003-06-26 2005-02-03 Rosenfeld John H. Heat transfer device and method of making same
EP1639628A4 (en) * 2003-06-26 2007-12-26 Thermal Corp Heat transfer device and method of making same
US6938680B2 (en) * 2003-07-14 2005-09-06 Thermal Corp. Tower heat sink with sintered grooved wick
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
TW592033B (en) * 2003-10-20 2004-06-11 Konglin Construction & Mfg Co Heat transfer device and manufacturing method thereof
US6926072B2 (en) * 2003-10-22 2005-08-09 Thermal Corp. Hybrid loop heat pipe
US7025124B2 (en) * 2003-10-24 2006-04-11 Chin Wen Wang Supporting structure for planar heat pipe
CN1303494C (en) * 2003-10-27 2007-03-07 江陵机电股份有限公司 Hot shift out device and its manufacturing method
US6948556B1 (en) 2003-11-12 2005-09-27 Anderson William G Hybrid loop cooling of high powered devices
US20050126761A1 (en) * 2003-12-10 2005-06-16 Je-Young Chang Heat pipe including enhanced nucleate boiling surface
US20050145373A1 (en) * 2004-01-05 2005-07-07 Hul Chun Hsu Heat pipe structure
US6889756B1 (en) * 2004-04-06 2005-05-10 Epos Inc. High efficiency isothermal heat sink
US6966359B1 (en) * 2004-04-30 2005-11-22 I-Ming Liu Radiator plate rapid cooling apparatus
US7134485B2 (en) * 2004-07-16 2006-11-14 Hsu Hul-Chun Wick structure of heat pipe
CN100364083C (en) * 2004-07-20 2008-01-23 鸿富锦精密工业(深圳)有限公司 Heat pipe
DE102004035735A1 (en) * 2004-07-23 2006-03-16 BSH Bosch und Siemens Hausgeräte GmbH thermosiphon
US6957692B1 (en) * 2004-08-31 2005-10-25 Inventec Corporation Heat-dissipating device
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7616452B2 (en) * 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7168152B1 (en) 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
US7848624B1 (en) * 2004-10-25 2010-12-07 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
TWI284190B (en) * 2004-11-11 2007-07-21 Taiwan Microloops Corp Bendable heat spreader with metallic screens based micro-structure and method for fabricating same
US7882888B1 (en) 2005-02-23 2011-02-08 Swales & Associates, Inc. Two-phase heat transfer system including a thermal capacitance device
TW200632266A (en) * 2005-03-03 2006-09-16 Mitac Technology Corp Dissipation heat pipe structure and manufacturing method thereof (II)
TWI275766B (en) * 2005-03-18 2007-03-11 Foxconn Tech Co Ltd Heat pipe
US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
TWI285251B (en) * 2005-09-15 2007-08-11 Univ Tsinghua Flat-plate heat pipe containing channels
US7661464B2 (en) * 2005-12-09 2010-02-16 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
US7347250B2 (en) * 2006-01-30 2008-03-25 Jaffe Limited Loop heat pipe
TWI285252B (en) * 2006-02-14 2007-08-11 Yeh Chiang Technology Corp Loop type heat conduction device
CN100480612C (en) * 2006-04-28 2009-04-22 富准精密工业(深圳)有限公司 Heat pipe
US7748436B1 (en) * 2006-05-03 2010-07-06 Advanced Cooling Technologies, Inc Evaporator for capillary loop
US8720530B2 (en) * 2006-05-17 2014-05-13 The Boeing Company Multi-layer wick in loop heat pipe
CN101093151B (en) * 2006-06-21 2010-04-14 富准精密工业(深圳)有限公司 Heat pipe
TWM302874U (en) * 2006-07-06 2006-12-11 Cooler Master Co Ltd Combinative structure of heat radiator
US8042606B2 (en) * 2006-08-09 2011-10-25 Utah State University Research Foundation Minimal-temperature-differential, omni-directional-reflux, heat exchanger
US20080062652A1 (en) * 2006-09-07 2008-03-13 Wayne Lieberman Vapor heat spreader
US7420810B2 (en) * 2006-09-12 2008-09-02 Graftech International Holdings, Inc. Base heat spreader with fins
TW200829852A (en) * 2007-01-09 2008-07-16 Univ Tamkang Loop heat pipe with a flat plate evaporator structure
US20080289801A1 (en) * 2007-05-02 2008-11-27 Batty J Clair Modular Thermal Management System for Spacecraft
JP5117101B2 (en) * 2007-05-08 2013-01-09 株式会社東芝 Evaporator and circulating cooling device using the same
US8123174B2 (en) * 2007-06-20 2012-02-28 The Boeing Company Methods and apparatus for an integrated instrumentation module for a thermal protection system
US20090008063A1 (en) * 2007-07-03 2009-01-08 Raytheon Company System and Method for Passive Cooling Using a Non-Metallic Wick
FR2919923B1 (en) * 2007-08-08 2009-10-30 Astrium Sas Soc Par Actions Si PASSIVE DEVICE WITH MICRO BUCKLE FLUID WITH CAPILLARY PUMPING
JP4399013B2 (en) * 2008-02-28 2010-01-13 株式会社東芝 Electronic equipment and heat pipe
US8919427B2 (en) * 2008-04-21 2014-12-30 Chaun-Choung Technology Corp. Long-acting heat pipe and corresponding manufacturing method
KR100982957B1 (en) * 2008-06-23 2010-09-17 성균관대학교산학협력단 Method for manufacturing Evaporator for loop heat pipe system
US8033017B2 (en) * 2008-06-23 2011-10-11 Zalman Tech Co., Ltd. Method for manufacturing evaporator for loop heat pipe system
TWI333539B (en) * 2008-06-26 2010-11-21 Inventec Corp Loop heat pipe
KR101555365B1 (en) * 2008-06-27 2015-09-23 엘지전자 주식회사 A cooling apparatus for electronic device
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
CN101762194B (en) * 2008-12-24 2012-09-19 富准精密工业(深圳)有限公司 Evaporator and loop type heat pipe applying same
US8438847B2 (en) * 2008-12-25 2013-05-14 Industrial Technology Research Institute Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same
TWI409382B (en) * 2008-12-25 2013-09-21 Ind Tech Res Inst Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same
CN101813429B (en) * 2009-02-20 2013-01-23 富瑞精密组件(昆山)有限公司 Manufacturing method of heat pipe
WO2010145074A1 (en) * 2009-06-17 2010-12-23 华为技术有限公司 Heat dissipation device and radio frequency module with same
TW201100736A (en) * 2009-06-17 2011-01-01 Yeh Chiang Technology Corp Superthin heat pipe
KR101054092B1 (en) * 2009-09-25 2011-08-03 잘만테크 주식회사 Evaporator for Loop Heat Pipe System
CN102374807A (en) * 2010-08-20 2012-03-14 富准精密工业(深圳)有限公司 Loop heat pipe
US11073340B2 (en) 2010-10-25 2021-07-27 Rochester Institute Of Technology Passive two phase heat transfer systems
CN103189708B (en) * 2010-11-01 2015-04-01 富士通株式会社 Loop-shaped heat pipe and electronic device equipped with same
CN102121801A (en) * 2011-03-04 2011-07-13 东莞汉旭五金塑胶科技有限公司 Limiting assembling structure for heat pipe and heat conduction seat
CN102760709B (en) * 2011-04-29 2015-05-13 北京奇宏科技研发中心有限公司 Loop heat pipe structure
US9746248B2 (en) 2011-10-18 2017-08-29 Thermal Corp. Heat pipe having a wick with a hybrid profile
US9120190B2 (en) 2011-11-30 2015-09-01 Palo Alto Research Center Incorporated Co-extruded microchannel heat pipes
US10371468B2 (en) * 2011-11-30 2019-08-06 Palo Alto Research Center Incorporated Co-extruded microchannel heat pipes
TWI582364B (en) * 2012-04-16 2017-05-11 鴻準精密工業股份有限公司 Manufacturing method of casing of heat pipe
US9618275B1 (en) 2012-05-03 2017-04-11 Advanced Cooling Technologies, Inc. Hybrid heat pipe
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
DE102012016442A1 (en) * 2012-08-18 2014-02-20 Audi Ag heat exchangers
US8809679B1 (en) * 2012-09-06 2014-08-19 The Florida State University Research Foundation, Inc. Cryogenic heat sink for gas cooled superconducting power devices
US9404392B2 (en) 2012-12-21 2016-08-02 Elwha Llc Heat engine system
US9752832B2 (en) * 2012-12-21 2017-09-05 Elwha Llc Heat pipe
CN103344143B (en) * 2013-06-08 2015-05-20 北京航空航天大学 Evaporator and liquid reservoir used for loop heat pipe and application thereof
US11026343B1 (en) 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US20150041103A1 (en) * 2013-08-06 2015-02-12 Aall Power Heatsinks, Inc. Vapor chamber with improved wicking structure
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US10330392B2 (en) * 2016-02-05 2019-06-25 Cooler Master Co., Ltd. Three-dimensional heat transfer device
TWI639806B (en) * 2016-02-05 2018-11-01 業強科技股份有限公司 Heat conduction device and manufacturing method thereof
US10746475B2 (en) * 2016-08-01 2020-08-18 California Institute Of Technology Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
CN106288901B (en) * 2016-08-12 2018-07-27 上海极率热能科技有限公司 Loop circuit heat pipe system and its with stainless steel capillary without collapsing welding technique
US10458665B2 (en) 2016-09-12 2019-10-29 Hamilton Sundstrand Corporation Passive liquid collecting device
CN106839844A (en) * 2017-01-16 2017-06-13 奇鋐科技股份有限公司 Capillary structure and the loop circuit heat pipe with the capillary structure
US10330361B2 (en) 2017-01-26 2019-06-25 Hamilton Sundstrand Corporation Passive liquid collecting device
US20180209746A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Wick structure and loop heat pipe using same
CN107767753A (en) * 2017-06-08 2018-03-06 北京航空航天大学 A kind of spherical evaporator loop heat pipe experimental provision of built-on reservoir
DE102017122700A1 (en) 2017-09-29 2019-04-04 Man Truck & Bus Ag Technology for cooling an internal combustion engine
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
US10584923B2 (en) * 2017-12-07 2020-03-10 General Electric Company Systems and methods for heat exchanger tubes having internal flow features
US10746479B2 (en) 2018-02-09 2020-08-18 General Electric Company Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
JP7267625B2 (en) * 2018-06-08 2023-05-02 国立大学法人東海国立大学機構 Apparatuses, heat exchangers and evaporator containers
US11114713B2 (en) 2018-06-21 2021-09-07 California Institute Of Technology Thermal management systems for battery cells and methods of their manufacture
JP6904321B2 (en) * 2018-10-25 2021-07-14 セイコーエプソン株式会社 Cooling device and projector
JP6560425B1 (en) * 2018-11-09 2019-08-14 古河電気工業株式会社 heat pipe
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
AT522326B1 (en) * 2019-06-13 2020-10-15 Miba Emobility Gmbh Cooling device
CA3168686A1 (en) * 2020-02-21 2021-08-26 David M. Gross Metal wick crimping method for heat pipe internals
RU2755365C1 (en) * 2020-10-27 2021-09-15 Акционерное общество "Военно-промышленная корпорация "Научно-производственное объединение машиностроения" Vaporizer
CN113251839B (en) * 2021-05-20 2022-07-22 北京空间飞行器总体设计部 Evaporator, liquid storage device and loop heat pipe
CN113375353A (en) * 2021-07-05 2021-09-10 天津凯普林光电科技有限公司 Integrated initiative refrigerated no water cooling high power laser
CN115355744A (en) * 2022-07-05 2022-11-18 上海格熵航天科技有限公司 Saddle shell integration loop heat pipe evaporimeter

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US502729A (en) * 1893-08-08 kreusleb
US3490718A (en) 1967-02-01 1970-01-20 Nasa Capillary radiator
GB1275946A (en) * 1969-01-28 1972-06-01 Messerschmitt Boelkow Blohm Apparatus for the conduction or exchange of heat
US3613778A (en) 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
NL153326B (en) * 1970-07-04 1977-05-16 Philips Nv HEAT TRANSPORT DEVICE.
US3661202A (en) * 1970-07-06 1972-05-09 Robert David Moore Jr Heat transfer apparatus with improved heat transfer surface
US3598180A (en) * 1970-07-06 1971-08-10 Robert David Moore Jr Heat transfer surface structure
JPS506609B1 (en) * 1970-12-02 1975-03-15
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US3734178A (en) * 1971-05-26 1973-05-22 Defawes Ets Thomas Heat exchanger
US3743173A (en) * 1971-10-26 1973-07-03 Corrugated Paper Mfg Pty Ltd Improved envelope
NL7206063A (en) * 1972-05-04 1973-11-06 N.V. Philips Gloeilampenfabrieken HEATING DEVICE
US3875926A (en) * 1974-02-21 1975-04-08 Matthew William Frank Solar thermal energy collection system
US4116266A (en) * 1974-08-02 1978-09-26 Agency Of Industrial Science & Technology Apparatus for heat transfer
US4087893A (en) * 1974-11-08 1978-05-09 Nippon Gakki Seizo Kabushiki Kaisha Process for producing a heat pipe
US4046190A (en) 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4170262A (en) * 1975-05-27 1979-10-09 Trw Inc. Graded pore size heat pipe wick
US4064409A (en) * 1976-07-28 1977-12-20 Redman Charles M Ferrofluidic electrical generator
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US4322737A (en) * 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
US4474231A (en) * 1981-08-05 1984-10-02 General Electric Company Means for increasing the critical heat flux of an immersed surface
US4470450A (en) * 1981-10-22 1984-09-11 Lockheed Missiles & Space Co. Pump-assisted heat pipe
US4685512A (en) * 1982-03-22 1987-08-11 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4602679A (en) * 1982-03-22 1986-07-29 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS5918387A (en) * 1982-07-22 1984-01-30 Masahiro Morita Heat pipe
US4467861A (en) * 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
US4494595A (en) * 1983-11-30 1985-01-22 Schmid Lawrence A Temperature-controllable heat valve
US4515209A (en) * 1984-04-03 1985-05-07 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademi Nauk Ssr Heat transfer apparatus
US5002122A (en) * 1984-09-25 1991-03-26 Thermacore, Inc. Tunnel artery wick for high power density surfaces
US4830718A (en) 1985-10-21 1989-05-16 John Stauffer Removal of sulfur dioxide (SO2) from waste gases and recovery as sulfuric acid
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4770238A (en) * 1987-06-30 1988-09-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary heat transport and fluid management device
US4830097A (en) * 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
DE3810128C1 (en) * 1988-03-25 1989-09-07 Erno Raumfahrttechnik Gmbh, 2800 Bremen, De
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US4941527A (en) * 1989-04-26 1990-07-17 Thermacore, Inc. Heat pipe with temperature gradient
JP3036811B2 (en) * 1990-09-19 2000-04-24 日本電気株式会社 Evaporator for capillary pump loop
JPH05118780A (en) * 1991-08-09 1993-05-14 Mitsubishi Electric Corp Heat pipe
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5303768A (en) * 1993-02-17 1994-04-19 Grumman Aerospace Corporation Capillary pump evaporator
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
TW307837B (en) * 1995-05-30 1997-06-11 Fujikura Kk
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
US5761037A (en) 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
JP3552395B2 (en) * 1996-03-27 2004-08-11 三菱電機株式会社 Loop heat pipe
GB2312734B (en) * 1996-05-03 2000-05-03 Matra Marconi Space Capillary evaporator
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6064572A (en) * 1996-11-27 2000-05-16 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5839290A (en) * 1997-01-24 1998-11-24 United States Of America As Represented By The Secretary Of The Navy Organic/inorganic composite wicks for caillary pumped loops
JP3450148B2 (en) * 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
TW378267B (en) * 1997-12-25 2000-01-01 Furukawa Electric Co Ltd Heat sink
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
JP4177487B2 (en) * 1998-08-14 2008-11-05 株式会社フジクラ Heat pipe manufacturing method
JP3591339B2 (en) * 1998-11-16 2004-11-17 三菱電機株式会社 Loop type heat pipe
KR100338810B1 (en) * 1999-11-08 2002-05-31 윤종용 cooling device
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US6257320B1 (en) * 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction

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US6915843B2 (en) 2005-07-12
DE60130756T2 (en) 2008-07-17
ATE374915T1 (en) 2007-10-15
EP1283977A2 (en) 2003-02-19
US8397798B2 (en) 2013-03-19
EP1283977B1 (en) 2007-10-03
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US20050252643A1 (en) 2005-11-17
US20030178184A1 (en) 2003-09-25
US6382309B1 (en) 2002-05-07
US6564860B1 (en) 2003-05-20
WO2001088456A2 (en) 2001-11-22
US20130220580A1 (en) 2013-08-29
WO2001088456A3 (en) 2002-08-15
US9103602B2 (en) 2015-08-11

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