AU2001270277A1 - Apparatus and methods for semiconductor wafer processing equipment - Google Patents

Apparatus and methods for semiconductor wafer processing equipment

Info

Publication number
AU2001270277A1
AU2001270277A1 AU2001270277A AU7027701A AU2001270277A1 AU 2001270277 A1 AU2001270277 A1 AU 2001270277A1 AU 2001270277 A AU2001270277 A AU 2001270277A AU 7027701 A AU7027701 A AU 7027701A AU 2001270277 A1 AU2001270277 A1 AU 2001270277A1
Authority
AU
Australia
Prior art keywords
methods
semiconductor wafer
processing equipment
wafer processing
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001270277A
Other languages
English (en)
Inventor
James S. Castantini
Kevin Hoyt
Alan J. Soucy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AJS Automation Inc
Original Assignee
AJS Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AJS Automation Inc filed Critical AJS Automation Inc
Publication of AU2001270277A1 publication Critical patent/AU2001270277A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001270277A 2000-06-30 2001-06-29 Apparatus and methods for semiconductor wafer processing equipment Abandoned AU2001270277A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21558400P 2000-06-30 2000-06-30
US60/215,584 2000-06-30
US24212700P 2000-10-20 2000-10-20
US60/242,127 2000-10-20
PCT/US2001/020954 WO2002003431A2 (en) 2000-06-30 2001-06-29 Apparatus and methods for semiconductor wafer processing equipment

Publications (1)

Publication Number Publication Date
AU2001270277A1 true AU2001270277A1 (en) 2002-01-14

Family

ID=26910183

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001270277A Abandoned AU2001270277A1 (en) 2000-06-30 2001-06-29 Apparatus and methods for semiconductor wafer processing equipment

Country Status (5)

Country Link
US (1) US20040013498A1 (ja)
EP (1) EP1297557A2 (ja)
JP (1) JP2004503080A (ja)
AU (1) AU2001270277A1 (ja)
WO (1) WO2002003431A2 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7204669B2 (en) * 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US7360985B2 (en) * 2002-12-30 2008-04-22 Tdk Corporation Wafer processing apparatus including clean box stopping mechanism
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
JP4597708B2 (ja) * 2005-02-25 2010-12-15 平田機工株式会社 Ｆｏｕｐオープナ
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US20070062561A1 (en) * 2005-09-19 2007-03-22 International Business Machines Corporation Method And Apparatus For Testing Particulate Contamination In Wafer Carriers
WO2008147379A1 (en) * 2006-09-14 2008-12-04 Brooks Automation Inc. Carrier gas system and coupling substrate carrier to a loadport
EP2122014A4 (en) * 2007-02-28 2014-09-17 Entegris Inc CLEANING SYSTEM FOR A SUBSTRATE CONTAINER
US20080240892A1 (en) * 2007-03-28 2008-10-02 International Business Machines Corporation Storage buffer device for automated material handling systems
TWI475627B (zh) * 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
JP6510423B2 (ja) 2013-01-22 2019-05-08 ブルックス オートメーション インコーポレイテッド 基板搬送部
EP2959460A4 (en) * 2013-02-25 2017-02-15 Crane Payment Innovations, Inc. System to accept an item of value
CN105900226A (zh) * 2014-02-27 2016-08-24 村田机械株式会社 净化装置及净化方法
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6918770B2 (ja) * 2015-07-13 2021-08-11 ブルックス オートメーション インコーポレイテッド オンザフライ方式の自動ウェハセンタリング方法および装置
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
JP6367857B2 (ja) * 2016-04-05 2018-08-01 ファナック株式会社 工作機械システム
US10453726B2 (en) * 2016-11-10 2019-10-22 Applied Materials, Inc. Electronic device manufacturing load port apparatus, systems, and methods
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
US10453727B2 (en) 2016-11-10 2019-10-22 Applied Materials, Inc. Electronic device manufacturing load port apparatus, systems, and methods
CN115440644B (zh) * 2022-10-27 2023-03-24 上海果纳半导体技术有限公司 晶圆传输接口及晶圆传输设备
CN118099044B (zh) * 2024-04-22 2024-06-25 南轩（天津）科技有限公司 一种硅片腐蚀清洗机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
US6082951A (en) * 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station

Also Published As

Publication number Publication date
JP2004503080A (ja) 2004-01-29
WO2002003431A2 (en) 2002-01-10
US20040013498A1 (en) 2004-01-22
WO2002003431A3 (en) 2002-09-26
EP1297557A2 (en) 2003-04-02

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