AU2001251756A1 - Soldering flux with cationic surfactant - Google Patents
Soldering flux with cationic surfactantInfo
- Publication number
- AU2001251756A1 AU2001251756A1 AU2001251756A AU5175601A AU2001251756A1 AU 2001251756 A1 AU2001251756 A1 AU 2001251756A1 AU 2001251756 A AU2001251756 A AU 2001251756A AU 5175601 A AU5175601 A AU 5175601A AU 2001251756 A1 AU2001251756 A1 AU 2001251756A1
- Authority
- AU
- Australia
- Prior art keywords
- cationic surfactant
- soldering flux
- soldering
- flux
- cationic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19708200P | 2000-04-13 | 2000-04-13 | |
| US60197082 | 2000-04-13 | ||
| US09/834,196 US6524398B2 (en) | 2000-04-13 | 2001-04-12 | Low-residue, low-solder-ball flux |
| US09834196 | 2001-04-12 | ||
| PCT/US2001/040518 WO2001087535A2 (en) | 2000-04-13 | 2001-04-13 | Soldering flux with cationic surfactant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001251756A1 true AU2001251756A1 (en) | 2001-11-26 |
Family
ID=26892528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001251756A Abandoned AU2001251756A1 (en) | 2000-04-13 | 2001-04-13 | Soldering flux with cationic surfactant |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6524398B2 (en) |
| JP (2) | JP4854164B2 (en) |
| KR (1) | KR100786593B1 (en) |
| CN (1) | CN1235719C (en) |
| AU (1) | AU2001251756A1 (en) |
| BR (1) | BR0110075A (en) |
| CA (1) | CA2405957C (en) |
| MX (1) | MXPA02010148A (en) |
| WO (1) | WO2001087535A2 (en) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020061556A (en) * | 2002-05-29 | 2002-07-24 | (주)케이트론 | Manufacturing processes of water-soluble flux and oil used soldering by horizontal hot air leveler |
| US7108755B2 (en) * | 2002-07-30 | 2006-09-19 | Motorola, Inc. | Simplification of ball attach method using super-saturated fine crystal flux |
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
| US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
| US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
| US9566668B2 (en) * | 2007-01-04 | 2017-02-14 | Alpha Metals, Inc. | Flux formulations |
| US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
| US8591399B2 (en) * | 2007-04-25 | 2013-11-26 | Karl Storz Endovision, Inc. | Surgical method utilizing transluminal endoscope and instruments |
| US9596980B2 (en) * | 2007-04-25 | 2017-03-21 | Karl Storz Endovision, Inc. | Endoscope system with pivotable arms |
| CN100528462C (en) * | 2007-07-17 | 2009-08-19 | 西安理工大学 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
| WO2011049091A1 (en) * | 2009-10-22 | 2011-04-28 | 三菱瓦斯化学株式会社 | Treatment solution for preventing pattern collapse in metal fine structure body, and process for production of metal fine structure body using same |
| TWI500467B (en) * | 2010-01-08 | 2015-09-21 | Arakawa Chem Ind | Flux composition for lead-free solder, and lead-free solder paste |
| CN102059477B (en) * | 2010-11-29 | 2012-10-03 | 广州有色金属研究院 | Halogen-free soldering flux applicable to silver-free and lead-free solder |
| US9815149B2 (en) | 2011-02-25 | 2017-11-14 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| US9579738B2 (en) | 2011-02-25 | 2017-02-28 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| US8434666B2 (en) * | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| CN102357746A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Low-content modified rosin halogen-free soldering flux for lead-free solder wires |
| CN102581522A (en) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | Rosin-based flux for ZnSn-based lead free solder and preparation method thereof |
| JP5531188B2 (en) * | 2012-03-12 | 2014-06-25 | 株式会社弘輝 | Flux, solder composition and method for manufacturing electronic circuit mounting board |
| CN103358053A (en) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | Preparation method of environmental-friendly halogen-free smokeless soldering flux |
| CN103350291A (en) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | Soldering flux |
| JP6253371B2 (en) * | 2013-11-28 | 2017-12-27 | 株式会社日本スペリア社 | Soldering flux |
| EP2886244A1 (en) * | 2013-12-17 | 2015-06-24 | Heraeus Deutschland GmbH & Co. KG | Method for fixing a component on a substrate |
| CN103817461A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Resin-core soldering flux |
| CN103862198B (en) * | 2014-03-24 | 2016-08-17 | 吉安谊盛电子材料有限公司 | A kind of special scaling powder of solar energy automatic welding |
| CN103862200A (en) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | Scaling powder special for welding of solar assemblies |
| CN103862199A (en) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | Scaling powder special for photovoltaic solder strip |
| CN104985354A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Lead-free solder soldering flux and preparation method thereof |
| JP6383768B2 (en) * | 2015-09-30 | 2018-08-29 | 株式会社タムラ製作所 | Solder composition and method for producing electronic substrate |
| WO2017141404A1 (en) * | 2016-02-18 | 2017-08-24 | 千住金属工業株式会社 | Flux |
| JP6274344B1 (en) | 2017-05-25 | 2018-02-07 | 千住金属工業株式会社 | flux |
| CN108356445A (en) * | 2018-01-30 | 2018-08-03 | 深圳市合明科技有限公司 | Environment protection soldering fluid and its preparation method and application |
| JP6861688B2 (en) * | 2018-11-19 | 2021-04-21 | 株式会社タムラ製作所 | Residual-free flux composition and solder paste |
| CN110076479B (en) * | 2019-03-25 | 2021-04-27 | 武汉谊盛新材料科技有限公司 | Neutral flux for cast welding of lead-acid storage battery plate group and preparation method thereof |
| KR20220162139A (en) * | 2020-03-31 | 2022-12-07 | 닛산 가가쿠 가부시키가이샤 | Method for manufacturing detergent composition and processed semiconductor substrate |
| JP6892620B1 (en) * | 2020-09-01 | 2021-06-23 | 千住金属工業株式会社 | Flux and solder paste |
| CN114535864A (en) * | 2020-11-25 | 2022-05-27 | 海太半导体（无锡）有限公司 | Catalyst for prolonging activity of soldering flux |
| CN113582862B (en) * | 2021-08-31 | 2023-11-10 | 广州安赛化工有限公司 | Rosin-based quaternary ammonium salt for preparing multifunctional cooling water biocide, preparation method and application thereof |
| CN114248042B (en) * | 2022-01-07 | 2023-04-07 | 苏州唯特偶电子材料科技有限公司 | Special soldering flux for non-crystallization photovoltaic module series welding machine |
| CN116252014B (en) * | 2023-02-11 | 2024-04-19 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2880125A (en) | 1956-07-30 | 1959-03-31 | Jordan | Flux compositions and processes for soldering and metal coating |
| US3158120A (en) | 1960-10-17 | 1964-11-24 | Fairmount Chem | Core solder |
| US3734791A (en) | 1970-10-23 | 1973-05-22 | Ibm | Surfactant-containing soldering fluxes |
| US4089804A (en) | 1976-12-30 | 1978-05-16 | Ciba-Geigy Corporation | Method of improving fluorinated surfactants |
| US4460414A (en) | 1983-10-31 | 1984-07-17 | Scm Corporation | Solder paste and vehicle therefor |
| JPS62199289A (en) * | 1986-02-26 | 1987-09-02 | Senjiyu Kinzoku Kogyo Kk | Cream solder |
| US5297721A (en) | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| TW282427B (en) * | 1993-02-05 | 1996-08-01 | Litton Systems Inc | |
| US5571340A (en) | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
-
2001
- 2001-04-12 US US09/834,196 patent/US6524398B2/en not_active Expired - Lifetime
- 2001-04-13 CN CNB018093698A patent/CN1235719C/en not_active Expired - Fee Related
- 2001-04-13 CA CA002405957A patent/CA2405957C/en not_active Expired - Fee Related
- 2001-04-13 WO PCT/US2001/040518 patent/WO2001087535A2/en active Application Filing
- 2001-04-13 AU AU2001251756A patent/AU2001251756A1/en not_active Abandoned
- 2001-04-13 MX MXPA02010148A patent/MXPA02010148A/en active IP Right Grant
- 2001-04-13 JP JP2001583977A patent/JP4854164B2/en not_active Expired - Fee Related
- 2001-04-13 KR KR1020027013729A patent/KR100786593B1/en not_active IP Right Cessation
- 2001-04-13 BR BR0110075-0A patent/BR0110075A/en active Search and Examination
-
2011
- 2011-09-05 JP JP2011193376A patent/JP2011252171A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2405957A1 (en) | 2001-11-22 |
| WO2001087535A2 (en) | 2001-11-22 |
| KR20020089455A (en) | 2002-11-29 |
| JP2004501765A (en) | 2004-01-22 |
| KR100786593B1 (en) | 2007-12-21 |
| WO2001087535A3 (en) | 2002-04-04 |
| JP2011252171A (en) | 2011-12-15 |
| CN1235719C (en) | 2006-01-11 |
| CN1429143A (en) | 2003-07-09 |
| BR0110075A (en) | 2003-06-24 |
| US20020017337A1 (en) | 2002-02-14 |
| US6524398B2 (en) | 2003-02-25 |
| JP4854164B2 (en) | 2012-01-18 |
| CA2405957C (en) | 2009-01-06 |
| MXPA02010148A (en) | 2003-10-15 |
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