WO2001007195A1
(en)
*
|
1999-07-23 |
2001-02-01 |
Heidelberg Instruments Mikrotechnik Gmbh |
Method of producing microbore holes
|
US7838794B2
(en)
|
1999-12-28 |
2010-11-23 |
Gsi Group Corporation |
Laser-based method and system for removing one or more target link structures
|
US7723642B2
(en)
|
1999-12-28 |
2010-05-25 |
Gsi Group Corporation |
Laser-based system for memory link processing with picosecond lasers
|
US7671295B2
(en)
*
|
2000-01-10 |
2010-03-02 |
Electro Scientific Industries, Inc. |
Processing a memory link with a set of at least two laser pulses
|
US20030222324A1
(en)
*
|
2000-01-10 |
2003-12-04 |
Yunlong Sun |
Laser systems for passivation or link processing with a set of laser pulses
|
US20060141681A1
(en)
*
|
2000-01-10 |
2006-06-29 |
Yunlong Sun |
Processing a memory link with a set of at least two laser pulses
|
US6483071B1
(en)
*
|
2000-05-16 |
2002-11-19 |
General Scanning Inc. |
Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|
US6696008B2
(en)
*
|
2000-05-25 |
2004-02-24 |
Westar Photonics Inc. |
Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation
|
JP4320926B2
(en)
*
|
2000-06-16 |
2009-08-26 |
パナソニック株式会社 |
Laser drilling method and apparatus
|
JP4659300B2
(en)
|
2000-09-13 |
2011-03-30 |
浜松ホトニクス株式会社 |
Laser processing method and semiconductor chip manufacturing method
|
TW503143B
(en)
*
|
2000-10-06 |
2002-09-21 |
Hitachi Via Mechanics Ltd |
Method and apparatus for drilling printed wiring boards
|
JP4134503B2
(en)
*
|
2000-10-11 |
2008-08-20 |
松下電器産業株式会社 |
Method for manufacturing circuit-formed substrate
|
US6864459B2
(en)
*
|
2001-02-08 |
2005-03-08 |
The Regents Of The University Of California |
High precision, rapid laser hole drilling
|
US6806440B2
(en)
*
|
2001-03-12 |
2004-10-19 |
Electro Scientific Industries, Inc. |
Quasi-CW diode pumped, solid-state UV laser system and method employing same
|
US6781090B2
(en)
*
|
2001-03-12 |
2004-08-24 |
Electro Scientific Industries, Inc. |
Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
|
US6777645B2
(en)
|
2001-03-29 |
2004-08-17 |
Gsi Lumonics Corporation |
High-speed, precision, laser-based method and system for processing material of one or more targets within a field
|
US20070173075A1
(en)
*
|
2001-03-29 |
2007-07-26 |
Joohan Lee |
Laser-based method and system for processing a multi-material device having conductive link structures
|
DE10125397B4
(en)
*
|
2001-05-23 |
2005-03-03 |
Siemens Ag |
Method for drilling microholes with a laser beam
|
US6804269B2
(en)
*
|
2001-06-19 |
2004-10-12 |
Hitachi Via Mechanics, Ltd. |
Laser beam delivery system with trepanning module
|
US20030099452A1
(en)
*
|
2001-11-28 |
2003-05-29 |
Borrelli Nicholas F. |
Manipulating the size of waveguides written into substrates using femtosecond laser pulses
|
US6627844B2
(en)
*
|
2001-11-30 |
2003-09-30 |
Matsushita Electric Industrial Co., Ltd. |
Method of laser milling
|
EP1769872A3
(en)
*
|
2001-12-20 |
2007-04-11 |
Hewlett-Packard Company |
Method of laser machining a fluid slot
|
US7357486B2
(en)
*
|
2001-12-20 |
2008-04-15 |
Hewlett-Packard Development Company, L.P. |
Method of laser machining a fluid slot
|
US6706998B2
(en)
|
2002-01-11 |
2004-03-16 |
Electro Scientific Industries, Inc. |
Simulated laser spot enlargement
|
TW564196B
(en)
*
|
2002-01-11 |
2003-12-01 |
Electro Scient Ind Inc |
Simulated laser spot enlargement
|
US20030155328A1
(en)
*
|
2002-02-15 |
2003-08-21 |
Huth Mark C. |
Laser micromachining and methods and systems of same
|
US6756563B2
(en)
*
|
2002-03-07 |
2004-06-29 |
Orbotech Ltd. |
System and method for forming holes in substrates containing glass
|
EP2216128B1
(en)
|
2002-03-12 |
2016-01-27 |
Hamamatsu Photonics K.K. |
Method of cutting object to be processed
|
TWI326626B
(en)
*
|
2002-03-12 |
2010-07-01 |
Hamamatsu Photonics Kk |
Laser processing method
|
CN100485902C
(en)
|
2002-03-12 |
2009-05-06 |
浜松光子学株式会社 |
Substrate dividing method
|
US6884962B2
(en)
*
|
2002-03-18 |
2005-04-26 |
Hitachi Via Mechanics, Ltd. |
Beam or wave front
|
US7563695B2
(en)
*
|
2002-03-27 |
2009-07-21 |
Gsi Group Corporation |
Method and system for high-speed precise laser trimming and scan lens for use therein
|
US6951995B2
(en)
*
|
2002-03-27 |
2005-10-04 |
Gsi Lumonics Corp. |
Method and system for high-speed, precise micromachining an array of devices
|
TWI223284B
(en)
*
|
2002-03-28 |
2004-11-01 |
Gsi Lumonics Corp |
Method and system for high-speed, precise micromachining an array of devices
|
US6842293B1
(en)
*
|
2002-04-13 |
2005-01-11 |
Yusong Yin |
Beam expander
|
DE10251480B4
(en)
|
2002-11-05 |
2008-01-24 |
Hitachi Via Mechanics, Ltd., Ebina |
A method of drilling holes by means of a laser beam in an electrical circuit substrate
|
US20040017430A1
(en)
*
|
2002-07-23 |
2004-01-29 |
Yosuke Mizuyama |
Laser processing method and laser processing apparatus
|
DE10262053A1
(en)
*
|
2002-09-05 |
2004-08-12 |
Daimlerchrysler Ag |
Process for the laser processing of coated metal sheets
|
TWI520269B
(en)
|
2002-12-03 |
2016-02-01 |
Hamamatsu Photonics Kk |
Cutting method of semiconductor substrate
|
GB0300105D0
(en)
*
|
2003-01-03 |
2003-02-05 |
Cambridge Display Tech Ltd |
Ablation methods & apparatus
|
US6706999B1
(en)
*
|
2003-02-24 |
2004-03-16 |
Electro Scientific Industries, Inc. |
Laser beam tertiary positioner apparatus and method
|
FR2852250B1
(en)
*
|
2003-03-11 |
2009-07-24 |
Jean Luc Jouvin |
PROTECTIVE SHEATH FOR CANNULA, AN INJECTION KIT COMPRISING SUCH ANKLE AND NEEDLE EQUIPPED WITH SUCH ANKLE
|
EP1609559B1
(en)
*
|
2003-03-12 |
2007-08-08 |
Hamamatsu Photonics K. K. |
Laser beam machining method
|
US6909735B2
(en)
*
|
2003-04-10 |
2005-06-21 |
Hitachi Via Mechanics, Ltd. |
System and method for generating and controlling multiple independently steerable laser beam for material processing
|
US20040251243A1
(en)
*
|
2003-04-10 |
2004-12-16 |
Lizotte Todd E. |
System and method for generating and controlling multiple independently steerable laser beams for material processing
|
DE10317363B3
(en)
*
|
2003-04-15 |
2004-08-26 |
Siemens Ag |
Laser-powered hole boring machine for manufacture of substrates for electrical switching circuits has scanning system with oscillating mirrors and focusing lens
|
US20060246279A1
(en)
*
|
2003-04-25 |
2006-11-02 |
Masakatsu Urairi |
Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
|
US7361171B2
(en)
|
2003-05-20 |
2008-04-22 |
Raydiance, Inc. |
Man-portable optical ablation system
|
DE10324439B4
(en)
*
|
2003-05-28 |
2008-01-31 |
Lasertec Gmbh |
Method and device for producing a die
|
US20050167405A1
(en)
*
|
2003-08-11 |
2005-08-04 |
Richard Stoltz |
Optical ablation using material composition analysis
|
US8921733B2
(en)
|
2003-08-11 |
2014-12-30 |
Raydiance, Inc. |
Methods and systems for trimming circuits
|
US8173929B1
(en)
|
2003-08-11 |
2012-05-08 |
Raydiance, Inc. |
Methods and systems for trimming circuits
|
US9022037B2
(en)
|
2003-08-11 |
2015-05-05 |
Raydiance, Inc. |
Laser ablation method and apparatus having a feedback loop and control unit
|
US20050087522A1
(en)
*
|
2003-10-24 |
2005-04-28 |
Yunlong Sun |
Laser processing of a locally heated target material
|
US20050263497A1
(en)
*
|
2004-03-26 |
2005-12-01 |
Lehane Christopher J |
System for laser drilling of shaped holes
|
US7302309B2
(en)
*
|
2004-04-26 |
2007-11-27 |
Hewlett-Packard Development Company, L.P. |
Laser micromachining methods and systems
|
US7020582B1
(en)
|
2004-04-28 |
2006-03-28 |
Altera Corporation |
Methods and apparatus for laser marking of integrated circuit faults
|
GB2428399B
(en)
*
|
2004-06-07 |
2010-05-05 |
Electro Scient Ind Inc |
AOM modulation techniques for improving laser system performance
|
US7133186B2
(en)
*
|
2004-06-07 |
2006-11-07 |
Electro Scientific Industries, Inc. |
AOM modulation techniques employing transducers to modulate different axes
|
US7935941B2
(en)
*
|
2004-06-18 |
2011-05-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
|
US7425471B2
(en)
*
|
2004-06-18 |
2008-09-16 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
|
US7687740B2
(en)
*
|
2004-06-18 |
2010-03-30 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
|
US8383982B2
(en)
*
|
2004-06-18 |
2013-02-26 |
Electro Scientific Industries, Inc. |
Methods and systems for semiconductor structure processing using multiple laser beam spots
|
US7629234B2
(en)
*
|
2004-06-18 |
2009-12-08 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
|
US7633034B2
(en)
*
|
2004-06-18 |
2009-12-15 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
|
US7435927B2
(en)
*
|
2004-06-18 |
2008-10-14 |
Electron Scientific Industries, Inc. |
Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
|
US8148211B2
(en)
*
|
2004-06-18 |
2012-04-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
|
US20060000816A1
(en)
*
|
2004-06-30 |
2006-01-05 |
Matsushita Electric Industrial Co., Ltd. |
System for and method of zoom processing
|
US7352784B2
(en)
*
|
2004-07-20 |
2008-04-01 |
Jds Uniphase Corporation |
Laser burst boosting method and apparatus
|
DE102004040068B4
(en)
*
|
2004-08-18 |
2018-01-04 |
Via Mechanics, Ltd. |
Method for laser drilling a multilayered workpiece
|
US7396706B2
(en)
*
|
2004-12-09 |
2008-07-08 |
Electro Scientific Industries, Inc. |
Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
|
DE112005002987T5
(en)
*
|
2004-12-09 |
2007-11-22 |
Electro Scientific Industries, Inc., Portland |
Laser micro-machining of semiconductor devices with multiple wavelengths
|
JP4854061B2
(en)
*
|
2005-01-14 |
2012-01-11 |
日東電工株式会社 |
Manufacturing method of laser processed product and protective sheet for laser processing
|
JP4873863B2
(en)
*
|
2005-01-14 |
2012-02-08 |
日東電工株式会社 |
Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing
|
US20060179722A1
(en)
*
|
2005-02-02 |
2006-08-17 |
Spindler Robert G |
Edge treatment for glass panes
|
JP4988160B2
(en)
*
|
2005-02-08 |
2012-08-01 |
日産自動車株式会社 |
Laser welding apparatus, laser welding system, and laser welding method
|
TWI382795B
(en)
*
|
2005-03-04 |
2013-01-11 |
Hitachi Via Mechanics Ltd |
A method of opening a printed circuit board and an opening device for a printed circuit board
|
TWI307613B
(en)
*
|
2005-03-29 |
2009-03-11 |
Phoenix Prec Technology Corp |
Circuit board formed conductor structure method for fabrication
|
ATE422983T1
(en)
*
|
2005-04-29 |
2009-03-15 |
Trumpf Werkzeugmaschinen Gmbh |
DEVICE WITH AN ADAPTIVE MIRROR FOR CHANGING THE FOCUS CHARACTERISTICS OF A LASER PROCESSING MACHINE
|
US20060261051A1
(en)
*
|
2005-05-19 |
2006-11-23 |
Mark Unrath |
Synthetic pulse repetition rate processing for dual-headed laser micromachining systems
|
US8135050B1
(en)
|
2005-07-19 |
2012-03-13 |
Raydiance, Inc. |
Automated polarization correction
|
JP2007036143A
(en)
*
|
2005-07-29 |
2007-02-08 |
Disco Abrasive Syst Ltd |
Machining method of semiconductor wafer
|
GB0518843D0
(en)
*
|
2005-09-15 |
2005-10-26 |
Plastic Logic Ltd |
A method of forming interconnects using a process of lower ablation
|
JP5030512B2
(en)
*
|
2005-09-30 |
2012-09-19 |
日立ビアメカニクス株式会社 |
Laser processing method
|
US7767930B2
(en)
*
|
2005-10-03 |
2010-08-03 |
Aradigm Corporation |
Method and system for LASER machining
|
US7444049B1
(en)
|
2006-01-23 |
2008-10-28 |
Raydiance, Inc. |
Pulse stretcher and compressor including a multi-pass Bragg grating
|
US8189971B1
(en)
|
2006-01-23 |
2012-05-29 |
Raydiance, Inc. |
Dispersion compensation in a chirped pulse amplification system
|
US8232687B2
(en)
|
2006-04-26 |
2012-07-31 |
Raydiance, Inc. |
Intelligent laser interlock system
|
US9130344B2
(en)
|
2006-01-23 |
2015-09-08 |
Raydiance, Inc. |
Automated laser tuning
|
US20070215575A1
(en)
*
|
2006-03-15 |
2007-09-20 |
Bo Gu |
Method and system for high-speed, precise, laser-based modification of one or more electrical elements
|
JP5203573B2
(en)
*
|
2006-03-23 |
2013-06-05 |
ミヤチテクノス株式会社 |
Laser processing equipment
|
US7822347B1
(en)
|
2006-03-28 |
2010-10-26 |
Raydiance, Inc. |
Active tuning of temporal dispersion in an ultrashort pulse laser system
|
WO2007118939A1
(en)
|
2006-04-19 |
2007-10-25 |
Arcelor France |
Method of producing a welded part having very high mechanical properties from a rolled and coated sheet
|
ATE515359T1
(en)
*
|
2006-04-28 |
2011-07-15 |
Trumpf Werkzeugmaschinen Gmbh |
LASER PROCESSING PROCESS
|
US7834293B2
(en)
|
2006-05-02 |
2010-11-16 |
Electro Scientific Industries, Inc. |
Method and apparatus for laser processing
|
TWI298613B
(en)
*
|
2006-05-19 |
2008-07-01 |
Foxconn Advanced Tech Inc |
Method for manufacturing via holes used in printed circuit boards
|
US7605343B2
(en)
*
|
2006-05-24 |
2009-10-20 |
Electro Scientific Industries, Inc. |
Micromachining with short-pulsed, solid-state UV laser
|
US8084706B2
(en)
*
|
2006-07-20 |
2011-12-27 |
Gsi Group Corporation |
System and method for laser processing at non-constant velocities
|
JP4960043B2
(en)
*
|
2006-08-31 |
2012-06-27 |
日立ビアメカニクス株式会社 |
Laser processing method and laser processing apparatus
|
US20080083706A1
(en)
*
|
2006-10-05 |
2008-04-10 |
Mu-Gahat Enterprises, Llc |
Reverse side film laser circuit etching
|
US7633035B2
(en)
*
|
2006-10-05 |
2009-12-15 |
Mu-Gahat Holdings Inc. |
Reverse side film laser circuit etching
|
JP2008159686A
(en)
*
|
2006-12-21 |
2008-07-10 |
Nippon Mektron Ltd |
Method for manufacturing printed wiring board incorporating capacitors
|
US20090061251A1
(en)
*
|
2007-08-27 |
2009-03-05 |
Mu-Gahat Enterprises, Llc |
Laser circuit etching by additive deposition
|
US20090061112A1
(en)
*
|
2007-08-27 |
2009-03-05 |
Mu-Gahat Enterprises, Llc |
Laser circuit etching by subtractive deposition
|
WO2009035421A1
(en)
*
|
2007-09-14 |
2009-03-19 |
Laserresearch (S) Pte Ltd |
Single laser system for manufacture of thin film solar cell
|
US7903326B2
(en)
|
2007-11-30 |
2011-03-08 |
Radiance, Inc. |
Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
|
EP2252426A4
(en)
*
|
2008-03-21 |
2014-08-06 |
Imra America Inc |
Laser-based material processing methods and systems
|
US8237080B2
(en)
*
|
2008-03-27 |
2012-08-07 |
Electro Scientific Industries, Inc |
Method and apparatus for laser drilling holes with Gaussian pulses
|
US8124911B2
(en)
*
|
2008-03-31 |
2012-02-28 |
Electro Scientific Industries, Inc. |
On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
|
US8093532B2
(en)
|
2008-03-31 |
2012-01-10 |
Electro Scientific Industries, Inc. |
Laser machining of fired ceramic and other hard and/or thick materials
|
WO2009148022A1
(en)
*
|
2008-06-04 |
2009-12-10 |
三菱電機株式会社 |
Laser processing device and laser processing system
|
US8173931B2
(en)
*
|
2008-06-13 |
2012-05-08 |
Electro Scientific Industries, Inc. |
Automatic recipe management for laser processing a work piece
|
JP5383342B2
(en)
*
|
2008-08-01 |
2014-01-08 |
キヤノン株式会社 |
Processing method
|
US8125704B2
(en)
|
2008-08-18 |
2012-02-28 |
Raydiance, Inc. |
Systems and methods for controlling a pulsed laser by combining laser signals
|
US8498538B2
(en)
|
2008-11-14 |
2013-07-30 |
Raydiance, Inc. |
Compact monolithic dispersion compensator
|
TWI460040B
(en)
*
|
2009-01-11 |
2014-11-11 |
Orbotech Ltd |
Method for laser drilling of holes in a substrate with varying simultaneity
|
TWI523720B
(en)
|
2009-05-28 |
2016-03-01 |
伊雷克托科學工業股份有限公司 |
Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
|
TWI417017B
(en)
*
|
2009-07-30 |
2013-11-21 |
Unimicron Technology Corp |
Base material of wiring board and method for drilling thereof
|
WO2011016176A1
(en)
*
|
2009-08-03 |
2011-02-10 |
東芝機械株式会社 |
Pulse laser machining apparatus and pulse laser machining method
|
CN102905839B
(en)
|
2010-03-30 |
2016-03-09 |
Imra美国公司 |
Based on the materials processing apparatus and method of laser
|
US8211731B2
(en)
*
|
2010-06-07 |
2012-07-03 |
Sunpower Corporation |
Ablation of film stacks in solar cell fabrication processes
|
US8642448B2
(en)
|
2010-06-22 |
2014-02-04 |
Applied Materials, Inc. |
Wafer dicing using femtosecond-based laser and plasma etch
|
US8884184B2
(en)
|
2010-08-12 |
2014-11-11 |
Raydiance, Inc. |
Polymer tubing laser micromachining
|
US9114482B2
(en)
|
2010-09-16 |
2015-08-25 |
Raydiance, Inc. |
Laser based processing of layered materials
|
US9023461B2
(en)
*
|
2010-10-21 |
2015-05-05 |
Electro Scientific Industries, Inc. |
Apparatus for optically laser marking articles
|
WO2012054927A2
(en)
*
|
2010-10-22 |
2012-04-26 |
Electro Scientific Industries, Inc. |
Laser processing systems and methods for beam dithering and skiving
|
US20120132629A1
(en)
*
|
2010-11-30 |
2012-05-31 |
Electro Scientific Industries, Inc. |
Method and apparatus for reducing taper of laser scribes
|
US8648277B2
(en)
*
|
2011-03-31 |
2014-02-11 |
Electro Scientific Industries, Inc. |
Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
|
US8557682B2
(en)
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-layer mask for substrate dicing by laser and plasma etch
|
US8557683B2
(en)
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US8759197B2
(en)
|
2011-06-15 |
2014-06-24 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US8703581B2
(en)
|
2011-06-15 |
2014-04-22 |
Applied Materials, Inc. |
Water soluble mask for substrate dicing by laser and plasma etch
|
US8598016B2
(en)
|
2011-06-15 |
2013-12-03 |
Applied Materials, Inc. |
In-situ deposited mask layer for device singulation by laser scribing and plasma etch
|
US9029242B2
(en)
|
2011-06-15 |
2015-05-12 |
Applied Materials, Inc. |
Damage isolation by shaped beam delivery in laser scribing process
|
US9126285B2
(en)
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using physically-removable mask
|
US9129904B2
(en)
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
|
US8912077B2
(en)
|
2011-06-15 |
2014-12-16 |
Applied Materials, Inc. |
Hybrid laser and plasma etch wafer dicing using substrate carrier
|
US8507363B2
(en)
|
2011-06-15 |
2013-08-13 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using water-soluble die attach film
|
US8951819B2
(en)
|
2011-07-11 |
2015-02-10 |
Applied Materials, Inc. |
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
|
US10239160B2
(en)
|
2011-09-21 |
2019-03-26 |
Coherent, Inc. |
Systems and processes that singulate materials
|
JPWO2013058169A1
(en)
*
|
2011-10-20 |
2015-04-02 |
旭硝子株式会社 |
Method for forming through hole in insulating substrate and method for manufacturing insulating substrate for interposer
|
US8716625B2
(en)
*
|
2012-02-03 |
2014-05-06 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Workpiece cutting
|
US8652940B2
(en)
|
2012-04-10 |
2014-02-18 |
Applied Materials, Inc. |
Wafer dicing used hybrid multi-step laser scribing process with plasma etch
|
US8946057B2
(en)
|
2012-04-24 |
2015-02-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using UV-curable adhesive film
|
JP5950674B2
(en)
*
|
2012-04-25 |
2016-07-13 |
株式会社ディスコ |
Optical axis checking jig
|
EP2855070B1
(en)
|
2012-05-25 |
2019-12-11 |
Shiloh Industries, Inc. |
Sheet metal piece having weld notch and method of forming the same
|
US8969177B2
(en)
|
2012-06-29 |
2015-03-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
|
KR101728769B1
(en)
|
2012-06-29 |
2017-04-20 |
쉴로 인더스트리즈 인코포레이티드 |
Welded blank assembly and method
|
US9048309B2
(en)
|
2012-07-10 |
2015-06-02 |
Applied Materials, Inc. |
Uniform masking for wafer dicing using laser and plasma etch
|
US8845854B2
(en)
|
2012-07-13 |
2014-09-30 |
Applied Materials, Inc. |
Laser, plasma etch, and backside grind process for wafer dicing
|
US8940619B2
(en)
|
2012-07-13 |
2015-01-27 |
Applied Materials, Inc. |
Method of diced wafer transportation
|
US8993414B2
(en)
|
2012-07-13 |
2015-03-31 |
Applied Materials, Inc. |
Laser scribing and plasma etch for high die break strength and clean sidewall
|
US8859397B2
(en)
|
2012-07-13 |
2014-10-14 |
Applied Materials, Inc. |
Method of coating water soluble mask for laser scribing and plasma etch
|
CN103582329B
(en)
*
|
2012-07-24 |
2016-08-03 |
富泰华工业(深圳)有限公司 |
Housing and manufacture method thereof
|
US8842358B2
(en)
|
2012-08-01 |
2014-09-23 |
Gentex Corporation |
Apparatus, method, and process with laser induced channel edge
|
US10149390B2
(en)
*
|
2012-08-27 |
2018-12-04 |
Mycronic AB |
Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
|
US9159574B2
(en)
|
2012-08-27 |
2015-10-13 |
Applied Materials, Inc. |
Method of silicon etch for trench sidewall smoothing
|
US9252057B2
(en)
|
2012-10-17 |
2016-02-02 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
|
US10211175B2
(en)
*
|
2012-11-30 |
2019-02-19 |
International Business Machines Corporation |
Stress-resilient chip structure and dicing process
|
MX2015006795A
(en)
*
|
2012-11-30 |
2015-08-14 |
Shiloh Ind Inc |
Method of forming a weld notch in a sheet metal piece.
|
DE102012111771B4
(en)
|
2012-12-04 |
2020-12-03 |
Ewag Ag |
Method for machining a workpiece using a laser machining device for manufacturing a cutting tool
|
US8975162B2
(en)
|
2012-12-20 |
2015-03-10 |
Applied Materials, Inc. |
Wafer dicing from wafer backside
|
US9236305B2
(en)
|
2013-01-25 |
2016-01-12 |
Applied Materials, Inc. |
Wafer dicing with etch chamber shield ring for film frame wafer applications
|
US8980726B2
(en)
|
2013-01-25 |
2015-03-17 |
Applied Materials, Inc. |
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
|
WO2014159464A1
(en)
|
2013-03-14 |
2014-10-02 |
Applied Materials, Inc. |
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch
|
WO2014153096A1
(en)
|
2013-03-14 |
2014-09-25 |
Shiloh Industries, Inc. |
Welded blank assembly and method
|
KR102166134B1
(en)
*
|
2013-03-15 |
2020-10-16 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
Laser emission-based control of beam positioner
|
CN103264227B
(en)
*
|
2013-04-11 |
2015-05-13 |
温州大学 |
Method of removing metal film covering surface of polymer substrate by direct laser etching
|
US8883614B1
(en)
|
2013-05-22 |
2014-11-11 |
Applied Materials, Inc. |
Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach
|
US9105710B2
(en)
|
2013-08-30 |
2015-08-11 |
Applied Materials, Inc. |
Wafer dicing method for improving die packaging quality
|
US9224650B2
(en)
|
2013-09-19 |
2015-12-29 |
Applied Materials, Inc. |
Wafer dicing from wafer backside and front side
|
JP5760060B2
(en)
*
|
2013-09-27 |
2015-08-05 |
株式会社茨城技研 |
Metal film forming method, metal film forming product manufacturing method and manufacturing apparatus
|
US9460966B2
(en)
|
2013-10-10 |
2016-10-04 |
Applied Materials, Inc. |
Method and apparatus for dicing wafers having thick passivation polymer layer
|
US9041198B2
(en)
|
2013-10-22 |
2015-05-26 |
Applied Materials, Inc. |
Maskless hybrid laser scribing and plasma etching wafer dicing process
|
US9312177B2
(en)
|
2013-12-06 |
2016-04-12 |
Applied Materials, Inc. |
Screen print mask for laser scribe and plasma etch wafer dicing process
|
US9299614B2
(en)
|
2013-12-10 |
2016-03-29 |
Applied Materials, Inc. |
Method and carrier for dicing a wafer
|
US9293304B2
(en)
|
2013-12-17 |
2016-03-22 |
Applied Materials, Inc. |
Plasma thermal shield for heat dissipation in plasma chamber
|
US9012305B1
(en)
|
2014-01-29 |
2015-04-21 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
|
US8927393B1
(en)
|
2014-01-29 |
2015-01-06 |
Applied Materials, Inc. |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
|
US9299611B2
(en)
|
2014-01-29 |
2016-03-29 |
Applied Materials, Inc. |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
|
US9018079B1
(en)
|
2014-01-29 |
2015-04-28 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
|
US9236284B2
(en)
|
2014-01-31 |
2016-01-12 |
Applied Materials, Inc. |
Cooled tape frame lift and low contact shadow ring for plasma heat isolation
|
US8991329B1
(en)
|
2014-01-31 |
2015-03-31 |
Applied Materials, Inc. |
Wafer coating
|
US9130030B1
(en)
|
2014-03-07 |
2015-09-08 |
Applied Materials, Inc. |
Baking tool for improved wafer coating process
|
US20150255349A1
(en)
|
2014-03-07 |
2015-09-10 |
JAMES Matthew HOLDEN |
Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes
|
US9275902B2
(en)
|
2014-03-26 |
2016-03-01 |
Applied Materials, Inc. |
Dicing processes for thin wafers with bumps on wafer backside
|
US9076860B1
(en)
|
2014-04-04 |
2015-07-07 |
Applied Materials, Inc. |
Residue removal from singulated die sidewall
|
US8975163B1
(en)
|
2014-04-10 |
2015-03-10 |
Applied Materials, Inc. |
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
|
US8932939B1
(en)
|
2014-04-14 |
2015-01-13 |
Applied Materials, Inc. |
Water soluble mask formation by dry film lamination
|
US8912078B1
(en)
|
2014-04-16 |
2014-12-16 |
Applied Materials, Inc. |
Dicing wafers having solder bumps on wafer backside
|
US8999816B1
(en)
|
2014-04-18 |
2015-04-07 |
Applied Materials, Inc. |
Pre-patterned dry laminate mask for wafer dicing processes
|
US9159621B1
(en)
|
2014-04-29 |
2015-10-13 |
Applied Materials, Inc. |
Dicing tape protection for wafer dicing using laser scribe process
|
US8912075B1
(en)
|
2014-04-29 |
2014-12-16 |
Applied Materials, Inc. |
Wafer edge warp supression for thin wafer supported by tape frame
|
US8980727B1
(en)
|
2014-05-07 |
2015-03-17 |
Applied Materials, Inc. |
Substrate patterning using hybrid laser scribing and plasma etching processing schemes
|
US9112050B1
(en)
|
2014-05-13 |
2015-08-18 |
Applied Materials, Inc. |
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
|
US9034771B1
(en)
|
2014-05-23 |
2015-05-19 |
Applied Materials, Inc. |
Cooling pedestal for dicing tape thermal management during plasma dicing
|
US10618131B2
(en)
|
2014-06-05 |
2020-04-14 |
Nlight, Inc. |
Laser patterning skew correction
|
US9130057B1
(en)
|
2014-06-30 |
2015-09-08 |
Applied Materials, Inc. |
Hybrid dicing process using a blade and laser
|
US9093518B1
(en)
|
2014-06-30 |
2015-07-28 |
Applied Materials, Inc. |
Singulation of wafers having wafer-level underfill
|
US9142459B1
(en)
|
2014-06-30 |
2015-09-22 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
|
US9165832B1
(en)
|
2014-06-30 |
2015-10-20 |
Applied Materials, Inc. |
Method of die singulation using laser ablation and induction of internal defects with a laser
|
US9349648B2
(en)
|
2014-07-22 |
2016-05-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
|
US9117868B1
(en)
|
2014-08-12 |
2015-08-25 |
Applied Materials, Inc. |
Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing
|
US9196498B1
(en)
|
2014-08-12 |
2015-11-24 |
Applied Materials, Inc. |
Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
|
CN114147346B
(en)
*
|
2014-08-13 |
2024-04-30 |
Ipg光子公司 |
Multi-beam fiber laser system
|
US10433413B2
(en)
*
|
2014-08-15 |
2019-10-01 |
Unimicron Technology Corp. |
Manufacturing method of circuit structure embedded with heat-dissipation block
|
US9281244B1
(en)
|
2014-09-18 |
2016-03-08 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
|
US9177861B1
(en)
|
2014-09-19 |
2015-11-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
|
US11195756B2
(en)
|
2014-09-19 |
2021-12-07 |
Applied Materials, Inc. |
Proximity contact cover ring for plasma dicing
|
US9196536B1
(en)
|
2014-09-25 |
2015-11-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
|
US9130056B1
(en)
|
2014-10-03 |
2015-09-08 |
Applied Materials, Inc. |
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
|
US9245803B1
(en)
|
2014-10-17 |
2016-01-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
|
US10692765B2
(en)
|
2014-11-07 |
2020-06-23 |
Applied Materials, Inc. |
Transfer arm for film frame substrate handling during plasma singulation of wafers
|
US9159624B1
(en)
|
2015-01-05 |
2015-10-13 |
Applied Materials, Inc. |
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
|
US9355907B1
(en)
|
2015-01-05 |
2016-05-31 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
|
US9330977B1
(en)
|
2015-01-05 |
2016-05-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
|
US9601375B2
(en)
|
2015-04-27 |
2017-03-21 |
Applied Materials, Inc. |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
|
DE102015212444A1
(en)
*
|
2015-06-12 |
2016-12-15 |
Schuler Automation Gmbh & Co. Kg |
Method and device for producing a sheet metal blank
|
US9478455B1
(en)
|
2015-06-12 |
2016-10-25 |
Applied Materials, Inc. |
Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber
|
US9721839B2
(en)
|
2015-06-12 |
2017-08-01 |
Applied Materials, Inc. |
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
|
GB201603991D0
(en)
|
2016-03-08 |
2016-04-20 |
Univ Dundee |
Processing method and apparatus
|
US11033985B2
(en)
*
|
2015-06-24 |
2021-06-15 |
University Of Dundee |
Method of, and apparatus for, reducing photoelectron yield and/or secondary electron yield
|
JP6921057B2
(en)
|
2015-09-09 |
2021-08-18 |
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド |
Laser processing equipment, method of laser processing workpieces and related configurations
|
JP6671145B2
(en)
*
|
2015-10-30 |
2020-03-25 |
株式会社レーザーシステム |
Method for manufacturing processed resin substrate and laser processing apparatus
|
EP3978184A1
(en)
|
2015-11-23 |
2022-04-06 |
NLIGHT, Inc. |
Method and apparatus for fine-scale temporal control for laser beam material processing
|
US11179807B2
(en)
|
2015-11-23 |
2021-11-23 |
Nlight, Inc. |
Fine-scale temporal control for laser material processing
|
US10518358B1
(en)
|
2016-01-28 |
2019-12-31 |
AdlOptica Optical Systems GmbH |
Multi-focus optics
|
GB2556313B
(en)
*
|
2016-02-10 |
2020-12-23 |
Flexenable Ltd |
Semiconductor patterning
|
US9972575B2
(en)
|
2016-03-03 |
2018-05-15 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
|
US9852997B2
(en)
|
2016-03-25 |
2017-12-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
|
US9793132B1
(en)
|
2016-05-13 |
2017-10-17 |
Applied Materials, Inc. |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
|
IT201600070259A1
(en)
*
|
2016-07-06 |
2018-01-06 |
Adige Spa |
Process of laser processing of a metal material with control of the position of the optical axis of the laser with respect to a flow of assistance gas, as well as a machine and computer program for carrying out such a process.
|
IT201600070441A1
(en)
*
|
2016-07-06 |
2018-01-06 |
Adige Spa |
Process for laser processing of a metal material with high-dynamic control of the axes of movement of the laser beam along a predetermined processing path, as well as a machine and computer program for carrying out such a process.
|
CN109689278B
(en)
*
|
2016-09-09 |
2021-01-12 |
三菱电机株式会社 |
Laser processing device and laser processing method
|
US10423015B2
(en)
|
2016-09-29 |
2019-09-24 |
Nlight, Inc. |
Adjustable beam characteristics
|
US10730785B2
(en)
|
2016-09-29 |
2020-08-04 |
Nlight, Inc. |
Optical fiber bending mechanisms
|
US11173548B2
(en)
|
2017-04-04 |
2021-11-16 |
Nlight, Inc. |
Optical fiducial generation for galvanometric scanner calibration
|
US11158540B2
(en)
|
2017-05-26 |
2021-10-26 |
Applied Materials, Inc. |
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
|
US10363629B2
(en)
|
2017-06-01 |
2019-07-30 |
Applied Materials, Inc. |
Mitigation of particle contamination for wafer dicing processes
|
WO2019065084A1
(en)
*
|
2017-09-29 |
2019-04-04 |
株式会社カネカ |
Processed graphite laminated body, method for manufacturing same, and laser cutting device for processed graphite laminated body
|
KR102596305B1
(en)
*
|
2017-11-20 |
2023-10-30 |
아이피지 포토닉스 코포레이션 |
Laser systems and methods for processing materials
|
WO2019111382A1
(en)
*
|
2017-12-07 |
2019-06-13 |
ギガフォトン株式会社 |
Laser emission system and manufacturing method for electronic device
|
US10535561B2
(en)
|
2018-03-12 |
2020-01-14 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
|
US11355394B2
(en)
|
2018-09-13 |
2022-06-07 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment
|
JP2020066015A
(en)
*
|
2018-10-23 |
2020-04-30 |
株式会社ディスコ |
Laser processing method
|
US10624213B1
(en)
*
|
2018-12-20 |
2020-04-14 |
Intel Corporation |
Asymmetric electronic substrate and method of manufacture
|
US11011424B2
(en)
|
2019-08-06 |
2021-05-18 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
|
US11342226B2
(en)
|
2019-08-13 |
2022-05-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process
|
US10903121B1
(en)
|
2019-08-14 |
2021-01-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
|
US11600492B2
(en)
|
2019-12-10 |
2023-03-07 |
Applied Materials, Inc. |
Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process
|
JP7386073B2
(en)
|
2019-12-24 |
2023-11-24 |
ビアメカニクス株式会社 |
Laser processing equipment and laser processing method
|
US11211247B2
(en)
|
2020-01-30 |
2021-12-28 |
Applied Materials, Inc. |
Water soluble organic-inorganic hybrid mask formulations and their applications
|
JP7471861B2
(en)
*
|
2020-02-27 |
2024-04-22 |
Tdk株式会社 |
Thin film capacitor and circuit board incorporating the same
|
US11804416B2
(en)
*
|
2020-09-08 |
2023-10-31 |
UTAC Headquarters Pte. Ltd. |
Semiconductor device and method of forming protective layer around cavity of semiconductor die
|
CN114888430B
(en)
*
|
2022-06-29 |
2024-05-17 |
中国航发动力股份有限公司 |
Method and system for processing temperature-measuring blind hole of blade
|
DE102022117909A1
(en)
|
2022-07-18 |
2024-01-18 |
Trumpf Laser- Und Systemtechnik Gmbh |
Beam guiding device for guiding an energy beam and manufacturing device for the additive manufacturing of components from a powder material with such a beam guiding device
|