AU2001239401A1 - Method of joining surfaces - Google Patents

Method of joining surfaces

Info

Publication number
AU2001239401A1
AU2001239401A1 AU2001239401A AU3940101A AU2001239401A1 AU 2001239401 A1 AU2001239401 A1 AU 2001239401A1 AU 2001239401 A AU2001239401 A AU 2001239401A AU 3940101 A AU3940101 A AU 3940101A AU 2001239401 A1 AU2001239401 A1 AU 2001239401A1
Authority
AU
Australia
Prior art keywords
joining surfaces
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001239401A
Inventor
David Jacobson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CRYOSYSTEMS Ltd
Original Assignee
CRYOSYSTEMS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CRYOSYSTEMS Ltd filed Critical CRYOSYSTEMS Ltd
Publication of AU2001239401A1 publication Critical patent/AU2001239401A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
AU2001239401A 2000-09-26 2001-03-16 Method of joining surfaces Abandoned AU2001239401A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0023559.8A GB0023559D0 (en) 2000-09-26 2000-09-26 Method of joining surfaces
GB0023559 2000-09-26
PCT/GB2001/001193 WO2002034458A1 (en) 2000-09-26 2001-03-16 Method of joining surfaces

Publications (1)

Publication Number Publication Date
AU2001239401A1 true AU2001239401A1 (en) 2002-05-06

Family

ID=9900146

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001239401A Abandoned AU2001239401A1 (en) 2000-09-26 2001-03-16 Method of joining surfaces

Country Status (5)

Country Link
US (1) US20040060962A1 (en)
EP (1) EP1333958A1 (en)
AU (1) AU2001239401A1 (en)
GB (1) GB0023559D0 (en)
WO (1) WO2002034458A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1321214A1 (en) * 2001-12-21 2003-06-25 Siemens Aktiengesellschaft Workpiece comprising a cavity covered by a soldering foil and method for covering a cavity using a soldering foil
US7168608B2 (en) * 2002-12-24 2007-01-30 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for hermetic seal formation
US7461772B2 (en) * 2005-10-28 2008-12-09 General Electric Company Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys
US7293688B2 (en) * 2005-11-14 2007-11-13 General Electric Company Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys
US20080035707A1 (en) * 2006-08-14 2008-02-14 The Regents Of The University Of California Transient-liquid-phase joining of ceramics at low temperatures
US8348139B2 (en) 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
US8944309B2 (en) * 2012-10-25 2015-02-03 The Regents Of The University Of Michigan Organic vapor jet print head with solder joint
US9056443B2 (en) * 2013-02-04 2015-06-16 General Electric Company Brazing process, braze arrangement, and brazed article
CN110860817A (en) * 2019-09-29 2020-03-06 北京时代民芯科技有限公司 Solder sheet and power device chip packaging method using same
DE102019135171A1 (en) * 2019-12-19 2021-06-24 Rogers Germany Gmbh Solder material, method for producing such a solder material and use of such a solder material for connecting a metal layer to a ceramic layer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1052958A (en) * 1952-03-18 1954-01-29 Csf Metal-to-metal brazing process, in particular for closing electronic tubes
US3078562A (en) * 1959-11-04 1963-02-26 Gibson Electric Company Method for attaching silver-cadmium oxide bodies to a supporting member
US3686746A (en) * 1969-11-03 1972-08-29 Contacts Inc Closing wire terminals
DE3345219C1 (en) * 1983-12-14 1985-03-21 Daimler-Benz Ag, 7000 Stuttgart Soldering foil for the tension-free connection of ceramic bodies with metal
JP2563292B2 (en) * 1986-12-29 1996-12-11 株式会社 徳力本店 Brazing method for composite brazing material
GB8920101D0 (en) * 1989-09-06 1989-10-18 Marconi Electronic Devices Methods of joining components
DE4241439A1 (en) * 1992-12-10 1994-06-16 Daimler Benz Ag Keyed bonding between connectors and contacts on a semiconductor surface - uses an intermediate layer with structured melting point to fuse connector to solar cell contact under heat and pressure
US6027957A (en) * 1996-06-27 2000-02-22 University Of Maryland Controlled solder interdiffusion for high power semiconductor laser diode die bonding
US6281573B1 (en) * 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6087021A (en) * 1998-05-28 2000-07-11 International Business Machines Corporation Polymer with transient liquid phase bondable particles

Also Published As

Publication number Publication date
GB0023559D0 (en) 2000-11-08
WO2002034458A1 (en) 2002-05-02
US20040060962A1 (en) 2004-04-01
EP1333958A1 (en) 2003-08-13

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