AU2001234851A1 - Matrix heat sink with extending fibers - Google Patents
Matrix heat sink with extending fibersInfo
- Publication number
- AU2001234851A1 AU2001234851A1 AU2001234851A AU3485101A AU2001234851A1 AU 2001234851 A1 AU2001234851 A1 AU 2001234851A1 AU 2001234851 A AU2001234851 A AU 2001234851A AU 3485101 A AU3485101 A AU 3485101A AU 2001234851 A1 AU2001234851 A1 AU 2001234851A1
- Authority
- AU
- Australia
- Prior art keywords
- heat sink
- extending fibers
- matrix heat
- matrix
- fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
- F28F1/44—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element and being formed of wire mesh
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52051800A | 2000-03-08 | 2000-03-08 | |
US09520518 | 2000-03-08 | ||
PCT/US2001/003789 WO2001067019A1 (en) | 2000-03-08 | 2001-02-07 | Matrix heat sink with extending fibers |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001234851A1 true AU2001234851A1 (en) | 2001-09-17 |
Family
ID=24072949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001234851A Abandoned AU2001234851A1 (en) | 2000-03-08 | 2001-02-07 | Matrix heat sink with extending fibers |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001234851A1 (en) |
WO (1) | WO2001067019A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10305249A1 (en) | 2003-02-08 | 2004-10-07 | Audi Ag | disc brake |
WO2006041325A1 (en) * | 2004-10-08 | 2006-04-20 | Verteletsky, Pavel Vasilievich | Multi-filament heat sink |
CN100367492C (en) * | 2005-02-23 | 2008-02-06 | 朋程科技股份有限公司 | Method for making radiating structure of rectifier |
GB2437769B (en) * | 2006-05-04 | 2008-12-17 | Han-Ming Lee | Heatsink device having fiber-like fins |
DE202006012094U1 (en) * | 2006-08-04 | 2007-12-20 | Schnura, Axel | Radiator for cooling a carbon fiber composite fluid |
EP3648157A1 (en) * | 2018-11-02 | 2020-05-06 | Siemens Aktiengesellschaft | Cooling device |
SE543441C2 (en) * | 2019-03-26 | 2021-02-16 | Centropy Ab | Heat transfer device |
WO2022256629A1 (en) * | 2021-06-04 | 2022-12-08 | Kuprion, Inc. | Heat pipes featuring coefficient of thermal expansion matching and heat dissipation using same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5253720A (en) * | 1975-10-29 | 1977-04-30 | Hitachi Ltd | Non-orientated cu-carbon fiber compoite and its manufacturing method |
US4603731A (en) * | 1984-11-21 | 1986-08-05 | Ga Technologies Inc. | Graphite fiber thermal radiator |
US5077637A (en) * | 1989-09-25 | 1991-12-31 | The Charles Stark Draper Lab., Inc. | Solid state directional thermal cable |
US5224030A (en) * | 1990-03-30 | 1993-06-29 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Semiconductor cooling apparatus |
US5150748A (en) * | 1990-06-18 | 1992-09-29 | Mcdonnell Douglas Corporation | Advanced survivable radiator |
US5255738A (en) * | 1992-07-16 | 1993-10-26 | E-Systems, Inc. | Tapered thermal substrate for heat transfer applications and method for making same |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
KR100321810B1 (en) * | 1994-09-16 | 2002-06-20 | 타나카 시게노부 | Personal computer cooler with hinged heat pipe |
US6052280A (en) * | 1999-01-19 | 2000-04-18 | Alliedsignal Inc. | Carbon/carbon heat spreader |
-
2001
- 2001-02-07 WO PCT/US2001/003789 patent/WO2001067019A1/en active Application Filing
- 2001-02-07 AU AU2001234851A patent/AU2001234851A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001067019A1 (en) | 2001-09-13 |
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