AU2001234176A1 - Conductive resin composition and process for producing the same - Google Patents

Conductive resin composition and process for producing the same

Info

Publication number
AU2001234176A1
AU2001234176A1 AU2001234176A AU3417601A AU2001234176A1 AU 2001234176 A1 AU2001234176 A1 AU 2001234176A1 AU 2001234176 A AU2001234176 A AU 2001234176A AU 3417601 A AU3417601 A AU 3417601A AU 2001234176 A1 AU2001234176 A1 AU 2001234176A1
Authority
AU
Australia
Prior art keywords
producing
same
resin composition
conductive resin
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234176A
Other languages
English (en)
Inventor
Kazuhiko Hashimoto
Takaaki Miyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp, Asahi Chemical Industry Co Ltd filed Critical Asahi Kasei Corp
Publication of AU2001234176A1 publication Critical patent/AU2001234176A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
AU2001234176A 2000-04-26 2001-02-26 Conductive resin composition and process for producing the same Abandoned AU2001234176A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-125081 2000-04-26
JP2000125081 2000-04-26
PCT/JP2001/001416 WO2001081473A1 (fr) 2000-04-26 2001-02-26 Composition de resine conductrice et procede de production correspondant

Publications (1)

Publication Number Publication Date
AU2001234176A1 true AU2001234176A1 (en) 2001-11-07

Family

ID=18635097

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234176A Abandoned AU2001234176A1 (en) 2000-04-26 2001-02-26 Conductive resin composition and process for producing the same

Country Status (5)

Country Link
US (2) US7220795B2 (fr)
JP (1) JP3844436B2 (fr)
AU (1) AU2001234176A1 (fr)
DE (1) DE10196110T1 (fr)
WO (1) WO2001081473A1 (fr)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064255A (ja) * 2001-08-23 2003-03-05 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物
US20060108567A1 (en) * 2002-07-23 2006-05-25 Charati Sanjay G Conductive poly (arylene ether) compositions and methods of making the same
FR2847902B1 (fr) * 2002-11-29 2007-02-16 Rhodia Eng Plastics Srl Composition a base de matrice thermoplastique
DE60320859D1 (de) * 2002-12-26 2008-06-19 Asahi Kasei Chemicals Corp Verfahren zur Herstellung eines leitenden Konzentrats
JP4214780B2 (ja) * 2003-01-14 2009-01-28 三菱エンジニアリングプラスチックス株式会社 難燃性樹脂組成物の製造方法
US20070025652A1 (en) * 2003-03-31 2007-02-01 Ntn Corporation Fluid bearing device
US7132062B1 (en) 2003-04-15 2006-11-07 Plasticolors, Inc. Electrically conductive additive system and method of making same
US7935275B2 (en) 2003-04-18 2011-05-03 Asahi Kasei Chemicals Corporation Resin moldings and conductive resin composition
JP4951196B2 (ja) * 2003-05-06 2012-06-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物
DE10328652B4 (de) * 2003-06-26 2019-11-28 Volkswagen Ag Verfahren zur Verbindung mindestens zweier Kraftfahrzeugkarosserieteile sowie Betriebsmittel für ein derartiges Verfahren
EP1666532B1 (fr) * 2003-09-12 2014-11-05 Asahi Kasei Chemicals Corporation Composition de resine conductrice et objet moule
KR100535175B1 (ko) * 2004-03-29 2005-12-09 주식회사 센테크 카본유연성 발열구조체 제조용 전도성 조성물과 이를 이용한 카본유연성 발열구조체 및 이의 제조방법
WO2006004282A1 (fr) * 2004-03-29 2006-01-12 Centech Co., Ltd. Composition conductrice permettant de produire une structure de carbone chauffante souple, structure de carbone chauffante souple faisant appel audit procede, et procede de fabrication associe
WO2005095518A1 (fr) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Composition de résine de polyamide/éther de polyphénylène
CN1942523B (zh) * 2004-04-14 2010-12-08 旭化成化学株式会社 导电树脂组合物
CN1969000A (zh) * 2004-06-18 2007-05-23 纳幕尔杜邦公司 含炭黑的导电聚醚酯组合物及其制品
US7413684B2 (en) * 2005-04-15 2008-08-19 Sabic Innovative Plastics Ip B.V. Poly(arylene ether)/polyamide composition
US7887901B2 (en) * 2005-06-29 2011-02-15 Sabic Innovative Plastics Ip B.V. Article made from a poly(arylene ether)/polyamide composition
US20070003755A1 (en) * 2005-06-29 2007-01-04 Korzen Andrew P Poly(arylene ether)/polyamide composition
CN101258186B (zh) * 2005-09-05 2012-01-18 旭化成化学株式会社 导电性母炼胶的制备方法
WO2008048238A2 (fr) * 2005-09-16 2008-04-24 University Of Massachusetts Nanostructures comprenant des polymères greffés
ES2379807T3 (es) * 2005-10-11 2012-05-03 Dsm Ip Assets B.V. Poliamida eléctricamente conductora
US8263697B2 (en) 2005-11-15 2012-09-11 Asahi Kasei Chemicals Corporation Heat-resistant resin composition
EP2123717B1 (fr) * 2006-05-12 2013-07-03 Asahi Kasei Chemicals Corporation Procédé de production de composition de résine conductrice
KR100706651B1 (ko) * 2006-12-22 2007-04-13 제일모직주식회사 전기 전도성 열가소성 수지 조성물 및 플라스틱 성형품
CN101679744B (zh) 2007-06-04 2013-09-25 旭化成化学株式会社 聚酰胺-聚苯醚树脂组合物和膜
KR100856137B1 (ko) * 2007-08-08 2008-09-02 제일모직주식회사 전기전도성 열가소성 수지 조성물 및 그 성형품
JP5259332B2 (ja) * 2007-10-25 2013-08-07 東洋ゴム工業株式会社 空気入りタイヤ
JP5295711B2 (ja) * 2007-11-01 2013-09-18 東洋ゴム工業株式会社 空気入りタイヤ
JP5259337B2 (ja) * 2007-11-19 2013-08-07 東洋ゴム工業株式会社 空気入りタイヤ
KR20100137496A (ko) * 2008-03-07 2010-12-30 레이덴 에너지 인코오포레이티드 탭을 갖는 전기화학 전지
KR20110025661A (ko) * 2008-05-29 2011-03-10 레이덴 에너지 인코오포레이티드 이온 용액 전해질을 포함하는 전기화학 전지
GB2468714B (en) 2009-03-20 2012-11-28 Schlumberger Holdings Derivatisation of carbon
JP4803765B2 (ja) * 2009-08-04 2011-10-26 旭化成ケミカルズ株式会社 ポリフェニレンエーテル系樹脂押出成形体の製造方法
JP4570682B2 (ja) * 2009-09-07 2010-10-27 三菱エンジニアリングプラスチックス株式会社 導電性熱可塑性樹脂組成物
KR101269422B1 (ko) * 2009-12-30 2013-06-04 제일모직주식회사 내마모성 및 전기전도성이 우수한 폴리카보네이트계 수지 조성물 및 그 제조방법
US8653167B2 (en) 2011-05-26 2014-02-18 Sabic Innovative Plastics Ip Molding composition for photovoltaic junction boxes and connectors
JP5806885B2 (ja) * 2011-09-02 2015-11-10 旭化成ケミカルズ株式会社 樹脂組成物
KR101457016B1 (ko) 2011-12-30 2014-11-03 제일모직주식회사 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품
US9650084B2 (en) * 2013-07-03 2017-05-16 Sabic Global Technologies B.V. Conductive polyamide composition and article
WO2015011935A1 (fr) 2013-07-26 2015-01-29 三井化学株式会社 Composition de résine polyamide semi-aromatique et article moulé formé à partir de celle-ci
KR101637785B1 (ko) * 2014-12-22 2016-07-08 현대자동차주식회사 자동차용 하이브리드 도어
KR20170106493A (ko) 2015-04-27 2017-09-20 사빅 글로벌 테크놀러지스 비.브이. 폴리(페닐렌 에테르) 조성물 및 물품
JP7010666B2 (ja) * 2016-11-22 2022-02-10 旭化成株式会社 樹脂組成物
KR102020606B1 (ko) * 2017-12-27 2019-09-10 주식회사 삼양사 내후성이 우수한 장섬유 강화 열가소성 수지 조성물 및 이를 포함하는 성형품
EP3808796A1 (fr) * 2019-10-16 2021-04-21 Daw Se Mélange-maître contenant de la suie, polymère comprenant le mélange-maître, corps moulé formé à partir du mélange-maître ou du matériau polymère et procédé de fabrication de mélange-maître
EP3808797A1 (fr) * 2019-10-16 2021-04-21 Daw Se Mélange maître contenant des pigments, des charges et / ou des additifs fonctionnels, matériau polymère comprenant le mélange maître, corps moulé formé à partir du mélange maître ou du matériau polymère et procédé de fabrication de mélange maître
JP2022178259A (ja) * 2021-05-19 2022-12-02 旭化成株式会社 樹脂組成物及び成形品

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120063B2 (fr) * 1973-01-24 1976-06-22
JPS57186959A (en) * 1981-05-11 1982-11-17 Fuji Electric Co Ltd Winding device of coil for electric machine
JPS61207465A (ja) 1985-03-11 1986-09-13 Otsuka Chem Co Ltd 導電性熱可塑性樹脂組成物
JPH069820B2 (ja) * 1988-11-22 1994-02-09 日本ジーイープラスチックス株式会社 ポリフェニレンエーテル及びポリアミドを含む樹脂組成物の製造方法
JPH0798899B2 (ja) 1989-03-31 1995-10-25 日本ジーイープラスチックス株式会社 耐衝撃性樹脂組成物の製造方法
JPH0314867A (ja) 1989-06-13 1991-01-23 Mitsubishi Petrochem Co Ltd 耐衝撃熱可塑性樹脂組成物の製造方法
DE3922739A1 (de) * 1989-07-11 1991-01-24 Basf Ag Verstaerkte farbige thermoplastische formmassen auf der basis von polyphenylenethern und polyamiden
JPH04300956A (ja) 1991-03-29 1992-10-23 Sumitomo Chem Co Ltd 帯電防止性樹脂組成物
KR950014523B1 (ko) * 1991-04-29 1995-12-05 주식회사 코오롱 방향족 폴리아미드 펄프 및 그의 제조방법
JPH0525383A (ja) * 1991-07-22 1993-02-02 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物の製造法
US5591382A (en) 1993-03-31 1997-01-07 Hyperion Catalysis International Inc. High strength conductive polymers
JPH06287446A (ja) 1993-03-31 1994-10-11 Nippon G Ii Plast Kk 熱可塑性樹脂組成物
JP3329005B2 (ja) 1993-07-07 2002-09-30 住友化学工業株式会社 熱可塑性樹脂組成物
US5876647A (en) 1994-04-21 1999-03-02 Lion Corporation Method for preparing conductive thermoplastic resin compositions
DE69401919C5 (de) * 1994-06-01 2010-08-26 Sabic Innovative Plastics Ip B.V. Thermoplastische Zusammensetzung aus kompatibilisiertem Polyphenylenether-Polyamidharz und elektrisch leitender Russ
JPH08217972A (ja) * 1995-02-10 1996-08-27 Asahi Chem Ind Co Ltd 樹脂組成物
JP3556007B2 (ja) 1995-03-10 2004-08-18 日本ジーイープラスチックス株式会社 ポリアミド系樹脂組成物
NL1007534C2 (nl) * 1996-12-03 1999-05-12 Japan Elastomer Co Rubberachtig polymeer alsmede werkwijze voor de bereiding daarvan.
US5843340A (en) * 1997-03-17 1998-12-01 General Electric Company Method for the preparation of conductive polyphenylene ether-polyamide compositions
US6191207B1 (en) * 1997-06-19 2001-02-20 Asahi Kasei Kogyo Kabushiki Kaisha Polyamide resin composition and molded articles
US6107415A (en) * 1998-09-08 2000-08-22 General Electric Company Uncompatibilized polyphenylene ether-polyamide compositions
JP2002544308A (ja) 1999-05-07 2002-12-24 ゼネラル・エレクトリック・カンパニイ 組成により体積抵抗率を制御した導電性組成物
US6469093B1 (en) 1999-11-12 2002-10-22 General Electric Company Conductive polyphenylene ether-polyamide blend
US6894100B2 (en) * 2000-04-26 2005-05-17 Asahi Kasei Kabushiki Kaisha Electrically conductive resin composition and production process thereof
US6919394B2 (en) * 2000-04-26 2005-07-19 Asahi Kasei Kabushiki Kaisha Electrically conductive resin composition and production process thereof
DE60320859D1 (de) * 2002-12-26 2008-06-19 Asahi Kasei Chemicals Corp Verfahren zur Herstellung eines leitenden Konzentrats

Also Published As

Publication number Publication date
US20030116757A1 (en) 2003-06-26
US20060020077A1 (en) 2006-01-26
JP3844436B2 (ja) 2006-11-15
WO2001081473A1 (fr) 2001-11-01
DE10196110T1 (de) 2003-03-27
US7220795B2 (en) 2007-05-22

Similar Documents

Publication Publication Date Title
AU2001234176A1 (en) Conductive resin composition and process for producing the same
AU4467801A (en) Chlamydospores and process for producing the same
AU2002224082A1 (en) Dimethyl terephthalate composition and process for producing the same
AU6731400A (en) Wiring-connecting material and process for producing circuit board with the same
EP1114836A4 (fr) Composition a base de resine et procede de production de cette composition
AU2408202A (en) Dimethyl terephthalate composition and process for producing the same
AU2002301311A1 (en) Polyacetal resin composition and process for producing the same
AU2001276295A1 (en) Electric component, method for the production thereof, and its use
AU2001242817A1 (en) Photocurable composition, cured object, and process for producing the same
AU2001294186A1 (en) Apatite-reinforced resin composition
AU2002234875A1 (en) Process for producing colored resin composition and utilization thereof
SG92831A1 (en) Polypropylene resin composition and process for producing the same
AU2003275594A1 (en) Molded resin for electrical part and process for producing the same
AU2001275473A1 (en) Epoxy resing and process for making the same
AU2002226010A1 (en) Epoxy resins and process for making the same
AU2001282557A1 (en) Thermosetting resin and process for producing the same
SG102009A1 (en) Epoxy resin composition and process for producing the same
AU2003220967A1 (en) Conductive member and process for producing the same
EP1253168A4 (fr) Composition d'additif pour resines et son procede de production
AU3730899A (en) Resin composition and process for producing cured article using the same
AU2001274060A1 (en) Electric component and method for producing the same
EP1142954A4 (fr) Compositions de resines et leurs procedes de fabrication
AU2002218494A1 (en) Medicinal compositions and process for producing the same
AU4645401A (en) Flat composite component and method for the production thereof
AU2001292256A1 (en) Plastic lens composition, plastic lens, and process for producing the plastic lens