AU1834795A - Autoclave bonding of sputtering target assembly - Google Patents
Autoclave bonding of sputtering target assemblyInfo
- Publication number
- AU1834795A AU1834795A AU18347/95A AU1834795A AU1834795A AU 1834795 A AU1834795 A AU 1834795A AU 18347/95 A AU18347/95 A AU 18347/95A AU 1834795 A AU1834795 A AU 1834795A AU 1834795 A AU1834795 A AU 1834795A
- Authority
- AU
- Australia
- Prior art keywords
- sputtering target
- target assembly
- autoclave bonding
- autoclave
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1995/001089 WO1996023085A1 (en) | 1995-01-25 | 1995-01-25 | Autoclave bonding of sputtering target assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1834795A true AU1834795A (en) | 1996-08-14 |
Family
ID=22248573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU18347/95A Abandoned AU1834795A (en) | 1995-01-25 | 1995-01-25 | Autoclave bonding of sputtering target assembly |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0752017A1 (en) |
JP (1) | JP3804974B2 (en) |
AU (1) | AU1834795A (en) |
TW (1) | TW317518B (en) |
WO (1) | WO1996023085A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3983862B2 (en) * | 1997-10-24 | 2007-09-26 | Dowaホールディングス株式会社 | Sputtering target and its joining method and joining apparatus |
US6506289B2 (en) * | 2000-08-07 | 2003-01-14 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
US6884327B2 (en) | 2002-03-16 | 2005-04-26 | Tao Pan | Mode size converter for a planar waveguide |
US9793523B2 (en) | 2002-08-09 | 2017-10-17 | Sapurast Research Llc | Electrochemical apparatus with barrier layer protected substrate |
US20070264564A1 (en) | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
WO2004021532A1 (en) | 2002-08-27 | 2004-03-11 | Symmorphix, Inc. | Optically coupling into highly uniform waveguides |
US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
US8636876B2 (en) | 2004-12-08 | 2014-01-28 | R. Ernest Demaray | Deposition of LiCoO2 |
US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
US8342383B2 (en) | 2006-07-06 | 2013-01-01 | Praxair Technology, Inc. | Method for forming sputter target assemblies having a controlled solder thickness |
US8197781B2 (en) | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
CN101903560B (en) | 2007-12-21 | 2014-08-06 | 无穷动力解决方案股份有限公司 | Method for sputter targets for electrolyte films |
WO2009089417A1 (en) | 2008-01-11 | 2009-07-16 | Infinite Power Solutions, Inc. | Thin film encapsulation for thin film batteries and other devices |
US20100012488A1 (en) * | 2008-07-15 | 2010-01-21 | Koenigsmann Holger J | Sputter target assembly having a low-temperature high-strength bond |
CN102119454B (en) | 2008-08-11 | 2014-07-30 | 无穷动力解决方案股份有限公司 | Energy device with integral collector surface for electromagnetic energy harvesting and method thereof |
JP5492998B2 (en) | 2009-09-01 | 2014-05-14 | インフィニット パワー ソリューションズ, インコーポレイテッド | Printed circuit board with built-in thin film battery |
US20110300432A1 (en) | 2010-06-07 | 2011-12-08 | Snyder Shawn W | Rechargeable, High-Density Electrochemical Device |
KR101240204B1 (en) * | 2011-12-19 | 2013-03-07 | 주식회사 나노신소재 | Method for manufacturing a cylindrical sputtering target |
CN107914075A (en) * | 2017-11-14 | 2018-04-17 | 宁波江丰电子材料股份有限公司 | Target material welding method |
JP7311290B2 (en) * | 2019-03-27 | 2023-07-19 | Jx金属株式会社 | Segmented sputtering target and manufacturing method thereof |
JP7250723B2 (en) | 2020-03-31 | 2023-04-03 | Jx金属株式会社 | Sputtering target and sputtering target manufacturing method |
CN113070685B (en) * | 2021-03-26 | 2022-05-03 | 安徽江淮汽车集团股份有限公司 | Edge covering and spot welding integrated die |
CN113458523A (en) * | 2021-07-05 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Welding method of tantalum target material assembly |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63270459A (en) * | 1987-04-24 | 1988-11-08 | Matsushita Electric Ind Co Ltd | Bonding method for sputtering target |
JP2731152B2 (en) * | 1987-11-17 | 1998-03-25 | 日立金属株式会社 | Sputtering target with cooling member |
JPH03140464A (en) * | 1989-10-26 | 1991-06-14 | Kobe Steel Ltd | Backing device for target |
GB9108553D0 (en) * | 1991-04-22 | 1991-06-05 | Ion Coat Ltd | Ionised vapour source |
-
1995
- 1995-01-25 EP EP95910130A patent/EP0752017A1/en not_active Withdrawn
- 1995-01-25 WO PCT/US1995/001089 patent/WO1996023085A1/en not_active Application Discontinuation
- 1995-01-25 JP JP52282796A patent/JP3804974B2/en not_active Expired - Lifetime
- 1995-01-25 AU AU18347/95A patent/AU1834795A/en not_active Abandoned
- 1995-05-22 TW TW084105089A patent/TW317518B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH10502707A (en) | 1998-03-10 |
JP3804974B2 (en) | 2006-08-02 |
TW317518B (en) | 1997-10-11 |
EP0752017A1 (en) | 1997-01-08 |
WO1996023085A1 (en) | 1996-08-01 |
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