AU1646500A - Method for producing a multilayer printed circuit board - Google Patents

Method for producing a multilayer printed circuit board

Info

Publication number
AU1646500A
AU1646500A AU16465/00A AU1646500A AU1646500A AU 1646500 A AU1646500 A AU 1646500A AU 16465/00 A AU16465/00 A AU 16465/00A AU 1646500 A AU1646500 A AU 1646500A AU 1646500 A AU1646500 A AU 1646500A
Authority
AU
Australia
Prior art keywords
producing
circuit board
printed circuit
multilayer printed
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU16465/00A
Inventor
Thomas Widmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPC Electronic AG
Original Assignee
PPC Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPC Electronic AG filed Critical PPC Electronic AG
Publication of AU1646500A publication Critical patent/AU1646500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU16465/00A 1999-01-05 1999-12-24 Method for producing a multilayer printed circuit board Abandoned AU1646500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH7/99 1999-01-05
CH799 1999-01-05
PCT/CH1999/000625 WO2000041447A1 (en) 1999-01-05 1999-12-24 Method for producing a multilayer printed circuit board

Publications (1)

Publication Number Publication Date
AU1646500A true AU1646500A (en) 2000-07-24

Family

ID=4177302

Family Applications (1)

Application Number Title Priority Date Filing Date
AU16465/00A Abandoned AU1646500A (en) 1999-01-05 1999-12-24 Method for producing a multilayer printed circuit board

Country Status (3)

Country Link
EP (1) EP1142457A1 (en)
AU (1) AU1646500A (en)
WO (1) WO2000041447A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030188889A1 (en) * 2002-04-09 2003-10-09 Ppc Electronic Ag Printed circuit board and method for producing it
US11999014B2 (en) * 2019-11-22 2024-06-04 Medtronic, Inc. Laser cutting system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1220370A (en) * 1968-08-13 1971-01-27 Litton Industries Inc Electrical circuit boards
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
US5063280A (en) * 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
JP3290041B2 (en) * 1995-02-17 2002-06-10 インターナショナル・ビジネス・マシーンズ・コーポレーション Multilayer printed circuit board, method for manufacturing multilayer printed circuit board
JP2778569B2 (en) * 1996-01-22 1998-07-23 日立エーアイシー株式会社 Multilayer printed wiring board and method of manufacturing the same
JP2720865B2 (en) * 1996-01-22 1998-03-04 日立エーアイシー株式会社 Multilayer printed wiring board and method of manufacturing the same
KR100222752B1 (en) * 1996-06-27 1999-10-01 이형도 Fabrication method of laminate pcb using laser
JPH10224040A (en) * 1997-01-31 1998-08-21 Nippon Carbide Ind Co Inc Method for manufacturing multilayer wiring board
JPH10335829A (en) * 1997-05-28 1998-12-18 Nippon Carbide Ind Co Inc Multilayered wiring board and its manufacture
JPH10335828A (en) * 1997-05-28 1998-12-18 Nippon Carbide Ind Co Inc Multilayered wiring board and its manufacture
JPH10335824A (en) * 1997-05-28 1998-12-18 Nippon Carbide Ind Co Inc Multilayered wiring board and its manufacture

Also Published As

Publication number Publication date
WO2000041447A1 (en) 2000-07-13
EP1142457A1 (en) 2001-10-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase