AU1646500A - Method for producing a multilayer printed circuit board - Google Patents
Method for producing a multilayer printed circuit boardInfo
- Publication number
- AU1646500A AU1646500A AU16465/00A AU1646500A AU1646500A AU 1646500 A AU1646500 A AU 1646500A AU 16465/00 A AU16465/00 A AU 16465/00A AU 1646500 A AU1646500 A AU 1646500A AU 1646500 A AU1646500 A AU 1646500A
- Authority
- AU
- Australia
- Prior art keywords
- producing
- circuit board
- printed circuit
- multilayer printed
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH7/99 | 1999-01-05 | ||
CH799 | 1999-01-05 | ||
PCT/CH1999/000625 WO2000041447A1 (en) | 1999-01-05 | 1999-12-24 | Method for producing a multilayer printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1646500A true AU1646500A (en) | 2000-07-24 |
Family
ID=4177302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU16465/00A Abandoned AU1646500A (en) | 1999-01-05 | 1999-12-24 | Method for producing a multilayer printed circuit board |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1142457A1 (en) |
AU (1) | AU1646500A (en) |
WO (1) | WO2000041447A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030188889A1 (en) * | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
US11999014B2 (en) * | 2019-11-22 | 2024-06-04 | Medtronic, Inc. | Laser cutting system |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1220370A (en) * | 1968-08-13 | 1971-01-27 | Litton Industries Inc | Electrical circuit boards |
US4258468A (en) * | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
EP0342669B1 (en) * | 1988-05-20 | 1995-08-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
US5063280A (en) * | 1989-07-24 | 1991-11-05 | Canon Kabushiki Kaisha | Method and apparatus for forming holes into printed circuit board |
JP3290041B2 (en) * | 1995-02-17 | 2002-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Multilayer printed circuit board, method for manufacturing multilayer printed circuit board |
JP2778569B2 (en) * | 1996-01-22 | 1998-07-23 | 日立エーアイシー株式会社 | Multilayer printed wiring board and method of manufacturing the same |
JP2720865B2 (en) * | 1996-01-22 | 1998-03-04 | 日立エーアイシー株式会社 | Multilayer printed wiring board and method of manufacturing the same |
KR100222752B1 (en) * | 1996-06-27 | 1999-10-01 | 이형도 | Fabrication method of laminate pcb using laser |
JPH10224040A (en) * | 1997-01-31 | 1998-08-21 | Nippon Carbide Ind Co Inc | Method for manufacturing multilayer wiring board |
JPH10335829A (en) * | 1997-05-28 | 1998-12-18 | Nippon Carbide Ind Co Inc | Multilayered wiring board and its manufacture |
JPH10335828A (en) * | 1997-05-28 | 1998-12-18 | Nippon Carbide Ind Co Inc | Multilayered wiring board and its manufacture |
JPH10335824A (en) * | 1997-05-28 | 1998-12-18 | Nippon Carbide Ind Co Inc | Multilayered wiring board and its manufacture |
-
1999
- 1999-12-24 EP EP99959169A patent/EP1142457A1/en not_active Withdrawn
- 1999-12-24 AU AU16465/00A patent/AU1646500A/en not_active Abandoned
- 1999-12-24 WO PCT/CH1999/000625 patent/WO2000041447A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2000041447A1 (en) | 2000-07-13 |
EP1142457A1 (en) | 2001-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |