AU1362501A - Heat conductive sheet and method of producing the sheet - Google Patents

Heat conductive sheet and method of producing the sheet

Info

Publication number
AU1362501A
AU1362501A AU13625/01A AU1362501A AU1362501A AU 1362501 A AU1362501 A AU 1362501A AU 13625/01 A AU13625/01 A AU 13625/01A AU 1362501 A AU1362501 A AU 1362501A AU 1362501 A AU1362501 A AU 1362501A
Authority
AU
Australia
Prior art keywords
sheet
producing
heat conductive
conductive sheet
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13625/01A
Inventor
Mitsuhiko Okada
Tomoaki Uchiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU1362501A publication Critical patent/AU1362501A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU13625/01A 1999-11-30 2000-11-07 Heat conductive sheet and method of producing the sheet Abandoned AU1362501A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34013899A JP2001168246A (en) 1999-11-30 1999-11-30 Heat conductive sheet and manufacturing method thereof
JP11/340138 1999-11-30
PCT/US2000/030614 WO2001041213A1 (en) 1999-11-30 2000-11-07 Heat conductive sheet and method of producing the sheet

Publications (1)

Publication Number Publication Date
AU1362501A true AU1362501A (en) 2001-06-12

Family

ID=18334100

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13625/01A Abandoned AU1362501A (en) 1999-11-30 2000-11-07 Heat conductive sheet and method of producing the sheet

Country Status (5)

Country Link
EP (1) EP1238425A1 (en)
JP (1) JP2001168246A (en)
KR (1) KR20020070449A (en)
AU (1) AU1362501A (en)
WO (1) WO2001041213A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610635B2 (en) * 2000-09-14 2003-08-26 Aos Thermal Compounds Dry thermal interface material
KR100450229B1 (en) * 2001-06-19 2004-09-24 주식회사 엘지화학 Thermally conductive thermoplastic resin composition and process for manufacturing the same
JP4614593B2 (en) * 2001-08-06 2011-01-19 電気化学工業株式会社 Heat conduction sheet
KR100528435B1 (en) * 2002-07-05 2005-11-15 엘에스전선 주식회사 A conductive tape
AT412265B (en) * 2002-11-12 2004-12-27 Electrovac HEAT EXTRACTION COMPONENT
KR101013702B1 (en) * 2003-09-24 2011-02-10 엘지전자 주식회사 Mobile phone
KR100721487B1 (en) * 2004-09-22 2007-05-23 주식회사 엘지화학 Adhesive radiation sheet having high thermal conduction property
JP2007123524A (en) * 2005-10-27 2007-05-17 Shinko Electric Ind Co Ltd Substrate with built-in electronic part
JP4798629B2 (en) * 2006-11-13 2011-10-19 北川工業株式会社 Thermally conductive electromagnetic shielding sheet and electromagnetic shielding structure
KR100853711B1 (en) * 2007-02-14 2008-08-25 최훈석 Flexible heat sink and manufacturing method thereof
JP5042899B2 (en) * 2008-03-31 2012-10-03 ポリマテック株式会社 Thermally conductive sheet and method for producing the same
JP5442491B2 (en) * 2010-02-26 2014-03-12 新日鉄住金化学株式会社 Thermally conductive metal-insulating resin substrate and manufacturing method thereof
JP5912337B2 (en) 2011-04-09 2016-04-27 日東電工株式会社 Flame retardant thermal conductive adhesive sheet
JP5941287B2 (en) * 2012-01-19 2016-06-29 富士高分子工業株式会社 Heat dissipation sheet and manufacturing method thereof
EP3522689B1 (en) * 2016-09-30 2021-09-22 Denka Company Limited Heat dissipation sheet having high load carrying capacity and high thermal conductivity
JP2019010773A (en) * 2017-06-29 2019-01-24 日立化成株式会社 Composite thermoconductive sheet and heat radiation system
JP7317007B2 (en) 2017-11-16 2023-07-28 スリーエム イノベイティブ プロパティズ カンパニー Method for producing polymer matrix composite
US11732104B2 (en) 2017-11-16 2023-08-22 3M Innovative Properties Company Polymer matrix composites comprising dielectric particles and methods of making the same
CN111344339A (en) 2017-11-16 2020-06-26 3M创新有限公司 Polymer matrix composite comprising thermally conductive particles and method of making the same
US10913834B2 (en) 2017-11-16 2021-02-09 3M Innovative Properties Company Polymer matrix composites comprising indicator particles and methods of making the same
US10836873B2 (en) 2017-11-16 2020-11-17 3M Innovative Properties Company Polymer matrix composites comprising thermally insulating particles and methods of making the same
US10927228B2 (en) 2017-11-16 2021-02-23 3M Innovative Properties Company Polymer matrix composites comprising intumescent particles and methods of making the same
EP3710156A1 (en) 2017-11-16 2020-09-23 3M Innovative Properties Company Polymer matrix composites comprising functional particles and methods of making the same
JP7131142B2 (en) * 2018-07-09 2022-09-06 日本ゼオン株式会社 thermal conductive sheet
KR20220011648A (en) 2019-05-21 2022-01-28 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 thermal interface material
KR20220012259A (en) 2019-05-21 2022-02-03 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 Two-Part Interface Material, System Including Interface Material, and Method Thereof
CN112778562A (en) * 2020-12-31 2021-05-11 深圳市奕韬科技有限公司 Efficient heat-conducting interface material and preparation method and application thereof
CN113115557B (en) * 2021-02-05 2022-07-26 中山市鼎兴有机硅科技有限公司 Heat dissipation silica gel piece of embedded heat conduction group
TWI836320B (en) * 2022-01-13 2024-03-21 宸寰科技有限公司 Thermal interface sheet materials for the interior, middle and exterior of electronic components

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5847341B2 (en) * 1981-04-02 1983-10-21 電気化学工業株式会社 Manufacturing method of heat dissipation sheet
JP2536120B2 (en) * 1989-01-25 1996-09-18 日本電気株式会社 Electronic component cooling structure
TW197458B (en) * 1991-02-14 1993-01-01 Ciba Geigy Ag
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2728607B2 (en) * 1992-11-17 1998-03-18 信越化学工業株式会社 Manufacturing method of heat conductive composite sheet
JP2882972B2 (en) * 1993-06-15 1999-04-19 電気化学工業株式会社 Heat dissipation sheet
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet
DE69630278T2 (en) * 1996-01-30 2004-08-26 Parker-Hannifin Corp., Cleveland Cooling by heat dissipation for a heat generating electronic part
JP3434186B2 (en) * 1996-11-06 2003-08-04 富士高分子工業株式会社 Heat conductive silicone gel molded sheet and method for producing the same
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP4086946B2 (en) * 1998-01-05 2008-05-14 日東電工株式会社 Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same
US6162663A (en) * 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon

Also Published As

Publication number Publication date
KR20020070449A (en) 2002-09-09
JP2001168246A (en) 2001-06-22
WO2001041213A1 (en) 2001-06-07
EP1238425A1 (en) 2002-09-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase