AU1362501A - Heat conductive sheet and method of producing the sheet - Google Patents
Heat conductive sheet and method of producing the sheetInfo
- Publication number
- AU1362501A AU1362501A AU13625/01A AU1362501A AU1362501A AU 1362501 A AU1362501 A AU 1362501A AU 13625/01 A AU13625/01 A AU 13625/01A AU 1362501 A AU1362501 A AU 1362501A AU 1362501 A AU1362501 A AU 1362501A
- Authority
- AU
- Australia
- Prior art keywords
- sheet
- producing
- heat conductive
- conductive sheet
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34013899A JP2001168246A (en) | 1999-11-30 | 1999-11-30 | Heat conductive sheet and manufacturing method thereof |
JP11/340138 | 1999-11-30 | ||
PCT/US2000/030614 WO2001041213A1 (en) | 1999-11-30 | 2000-11-07 | Heat conductive sheet and method of producing the sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1362501A true AU1362501A (en) | 2001-06-12 |
Family
ID=18334100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU13625/01A Abandoned AU1362501A (en) | 1999-11-30 | 2000-11-07 | Heat conductive sheet and method of producing the sheet |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1238425A1 (en) |
JP (1) | JP2001168246A (en) |
KR (1) | KR20020070449A (en) |
AU (1) | AU1362501A (en) |
WO (1) | WO2001041213A1 (en) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6610635B2 (en) * | 2000-09-14 | 2003-08-26 | Aos Thermal Compounds | Dry thermal interface material |
KR100450229B1 (en) * | 2001-06-19 | 2004-09-24 | 주식회사 엘지화학 | Thermally conductive thermoplastic resin composition and process for manufacturing the same |
JP4614593B2 (en) * | 2001-08-06 | 2011-01-19 | 電気化学工業株式会社 | Heat conduction sheet |
KR100528435B1 (en) * | 2002-07-05 | 2005-11-15 | 엘에스전선 주식회사 | A conductive tape |
AT412265B (en) * | 2002-11-12 | 2004-12-27 | Electrovac | HEAT EXTRACTION COMPONENT |
KR101013702B1 (en) * | 2003-09-24 | 2011-02-10 | 엘지전자 주식회사 | Mobile phone |
KR100721487B1 (en) * | 2004-09-22 | 2007-05-23 | 주식회사 엘지화학 | Adhesive radiation sheet having high thermal conduction property |
JP2007123524A (en) * | 2005-10-27 | 2007-05-17 | Shinko Electric Ind Co Ltd | Substrate with built-in electronic part |
JP4798629B2 (en) * | 2006-11-13 | 2011-10-19 | 北川工業株式会社 | Thermally conductive electromagnetic shielding sheet and electromagnetic shielding structure |
KR100853711B1 (en) * | 2007-02-14 | 2008-08-25 | 최훈석 | Flexible heat sink and manufacturing method thereof |
JP5042899B2 (en) * | 2008-03-31 | 2012-10-03 | ポリマテック株式会社 | Thermally conductive sheet and method for producing the same |
JP5442491B2 (en) * | 2010-02-26 | 2014-03-12 | 新日鉄住金化学株式会社 | Thermally conductive metal-insulating resin substrate and manufacturing method thereof |
JP5912337B2 (en) | 2011-04-09 | 2016-04-27 | 日東電工株式会社 | Flame retardant thermal conductive adhesive sheet |
JP5941287B2 (en) * | 2012-01-19 | 2016-06-29 | 富士高分子工業株式会社 | Heat dissipation sheet and manufacturing method thereof |
EP3522689B1 (en) * | 2016-09-30 | 2021-09-22 | Denka Company Limited | Heat dissipation sheet having high load carrying capacity and high thermal conductivity |
JP2019010773A (en) * | 2017-06-29 | 2019-01-24 | 日立化成株式会社 | Composite thermoconductive sheet and heat radiation system |
JP7317007B2 (en) | 2017-11-16 | 2023-07-28 | スリーエム イノベイティブ プロパティズ カンパニー | Method for producing polymer matrix composite |
US11732104B2 (en) | 2017-11-16 | 2023-08-22 | 3M Innovative Properties Company | Polymer matrix composites comprising dielectric particles and methods of making the same |
CN111344339A (en) | 2017-11-16 | 2020-06-26 | 3M创新有限公司 | Polymer matrix composite comprising thermally conductive particles and method of making the same |
US10913834B2 (en) | 2017-11-16 | 2021-02-09 | 3M Innovative Properties Company | Polymer matrix composites comprising indicator particles and methods of making the same |
US10836873B2 (en) | 2017-11-16 | 2020-11-17 | 3M Innovative Properties Company | Polymer matrix composites comprising thermally insulating particles and methods of making the same |
US10927228B2 (en) | 2017-11-16 | 2021-02-23 | 3M Innovative Properties Company | Polymer matrix composites comprising intumescent particles and methods of making the same |
EP3710156A1 (en) | 2017-11-16 | 2020-09-23 | 3M Innovative Properties Company | Polymer matrix composites comprising functional particles and methods of making the same |
JP7131142B2 (en) * | 2018-07-09 | 2022-09-06 | 日本ゼオン株式会社 | thermal conductive sheet |
KR20220011648A (en) | 2019-05-21 | 2022-01-28 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | thermal interface material |
KR20220012259A (en) | 2019-05-21 | 2022-02-03 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | Two-Part Interface Material, System Including Interface Material, and Method Thereof |
CN112778562A (en) * | 2020-12-31 | 2021-05-11 | 深圳市奕韬科技有限公司 | Efficient heat-conducting interface material and preparation method and application thereof |
CN113115557B (en) * | 2021-02-05 | 2022-07-26 | 中山市鼎兴有机硅科技有限公司 | Heat dissipation silica gel piece of embedded heat conduction group |
TWI836320B (en) * | 2022-01-13 | 2024-03-21 | 宸寰科技有限公司 | Thermal interface sheet materials for the interior, middle and exterior of electronic components |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5847341B2 (en) * | 1981-04-02 | 1983-10-21 | 電気化学工業株式会社 | Manufacturing method of heat dissipation sheet |
JP2536120B2 (en) * | 1989-01-25 | 1996-09-18 | 日本電気株式会社 | Electronic component cooling structure |
TW197458B (en) * | 1991-02-14 | 1993-01-01 | Ciba Geigy Ag | |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
JP2728607B2 (en) * | 1992-11-17 | 1998-03-18 | 信越化学工業株式会社 | Manufacturing method of heat conductive composite sheet |
JP2882972B2 (en) * | 1993-06-15 | 1999-04-19 | 電気化学工業株式会社 | Heat dissipation sheet |
US5741579A (en) * | 1995-04-28 | 1998-04-21 | Shin-Etsu Polymer Co., Ltd. | Heat-conductive sheet |
DE69630278T2 (en) * | 1996-01-30 | 2004-08-26 | Parker-Hannifin Corp., Cleveland | Cooling by heat dissipation for a heat generating electronic part |
JP3434186B2 (en) * | 1996-11-06 | 2003-08-04 | 富士高分子工業株式会社 | Heat conductive silicone gel molded sheet and method for producing the same |
US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
JP4086946B2 (en) * | 1998-01-05 | 2008-05-14 | 日東電工株式会社 | Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same |
US6162663A (en) * | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
-
1999
- 1999-11-30 JP JP34013899A patent/JP2001168246A/en active Pending
-
2000
- 2000-11-07 EP EP00975600A patent/EP1238425A1/en not_active Withdrawn
- 2000-11-07 WO PCT/US2000/030614 patent/WO2001041213A1/en not_active Application Discontinuation
- 2000-11-07 KR KR1020027006856A patent/KR20020070449A/en not_active Application Discontinuation
- 2000-11-07 AU AU13625/01A patent/AU1362501A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20020070449A (en) | 2002-09-09 |
JP2001168246A (en) | 2001-06-22 |
WO2001041213A1 (en) | 2001-06-07 |
EP1238425A1 (en) | 2002-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |