ATE79982T1 - Verfahren zum herstellen eines bandes, bestimmt fuer schaltungen fuer elektronische module und gemaess diesem verfahren hergestelltes band. - Google Patents

Verfahren zum herstellen eines bandes, bestimmt fuer schaltungen fuer elektronische module und gemaess diesem verfahren hergestelltes band.

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Publication number
ATE79982T1
ATE79982T1 AT88109743T AT88109743T ATE79982T1 AT E79982 T1 ATE79982 T1 AT E79982T1 AT 88109743 T AT88109743 T AT 88109743T AT 88109743 T AT88109743 T AT 88109743T AT E79982 T1 ATE79982 T1 AT E79982T1
Authority
AT
Austria
Prior art keywords
ribbon
conductors
pct
circuits
sheets
Prior art date
Application number
AT88109743T
Other languages
English (en)
Inventor
Jean-Marcel Stampfli
Original Assignee
Ebauchesfabrik Eta Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebauchesfabrik Eta Ag filed Critical Ebauchesfabrik Eta Ag
Application granted granted Critical
Publication of ATE79982T1 publication Critical patent/ATE79982T1/de

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
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    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
AT88109743T 1987-06-22 1988-06-18 Verfahren zum herstellen eines bandes, bestimmt fuer schaltungen fuer elektronische module und gemaess diesem verfahren hergestelltes band. ATE79982T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8708790A FR2616995A1 (fr) 1987-06-22 1987-06-22 Procede de fabrication de modules electroniques
EP88109743A EP0296511B1 (de) 1987-06-22 1988-06-18 Verfahren zum Herstellen eines Bandes, bestimmt für Schaltungen für elektronische Module und gemäss diesem Verfahren hergestelltes Band

Publications (1)

Publication Number Publication Date
ATE79982T1 true ATE79982T1 (de) 1992-09-15

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Application Number Title Priority Date Filing Date
AT88109743T ATE79982T1 (de) 1987-06-22 1988-06-18 Verfahren zum herstellen eines bandes, bestimmt fuer schaltungen fuer elektronische module und gemaess diesem verfahren hergestelltes band.

Country Status (9)

Country Link
US (1) US5023751A (de)
EP (1) EP0296511B1 (de)
JP (1) JP2632992B2 (de)
KR (1) KR970010149B1 (de)
AT (1) ATE79982T1 (de)
AU (1) AU599491B2 (de)
CA (1) CA1281436C (de)
FR (1) FR2616995A1 (de)
WO (1) WO1988010509A1 (de)

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DE102010047912A1 (de) * 2010-10-11 2012-04-12 Polylc Gmbh & Co. Kg Überspannungsschutz für elektrisch leitfähige Strukturen

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FR2673041A1 (fr) * 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
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DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
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DE10318688A1 (de) * 2003-04-24 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür
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CN103473593B (zh) * 2012-06-05 2018-10-19 德昌电机(深圳)有限公司 智能卡、智能卡接触垫载板及其制造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010047912A1 (de) * 2010-10-11 2012-04-12 Polylc Gmbh & Co. Kg Überspannungsschutz für elektrisch leitfähige Strukturen

Also Published As

Publication number Publication date
JP2632992B2 (ja) 1997-07-23
AU599491B2 (en) 1990-07-19
CA1281436C (fr) 1991-03-12
EP0296511A1 (de) 1988-12-28
WO1988010509A1 (fr) 1988-12-29
EP0296511B1 (de) 1992-08-26
FR2616995A1 (fr) 1988-12-23
AU1797488A (en) 1989-01-19
KR970010149B1 (ko) 1997-06-21
JPH02500231A (ja) 1990-01-25
US5023751A (en) 1991-06-11
KR890702247A (ko) 1989-12-23

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