ATE602T1 - Verfahren und vorrichtung zum anloeten von bauteilen an ein dickschichtsubstrat. - Google Patents
Verfahren und vorrichtung zum anloeten von bauteilen an ein dickschichtsubstrat.Info
- Publication number
- ATE602T1 ATE602T1 AT79200258T AT79200258T ATE602T1 AT E602 T1 ATE602 T1 AT E602T1 AT 79200258 T AT79200258 T AT 79200258T AT 79200258 T AT79200258 T AT 79200258T AT E602 T1 ATE602 T1 AT E602T1
- Authority
- AT
- Austria
- Prior art keywords
- thick film
- film substrate
- soldering components
- soldering
- substrates
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000005476 soldering Methods 0.000 title abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7805800A NL7805800A (nl) | 1978-05-29 | 1978-05-29 | Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze. |
EP79200258A EP0005883B1 (de) | 1978-05-29 | 1979-05-25 | Verfahren und Vorrichtung zum Anlöten von Bauteilen an ein Dickschichtsubstrat |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE602T1 true ATE602T1 (de) | 1982-02-15 |
Family
ID=19830932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT79200258T ATE602T1 (de) | 1978-05-29 | 1979-05-25 | Verfahren und vorrichtung zum anloeten von bauteilen an ein dickschichtsubstrat. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4332342A (nl) |
EP (1) | EP0005883B1 (nl) |
JP (1) | JPS54156173A (nl) |
AT (1) | ATE602T1 (nl) |
DE (1) | DE2961866D1 (nl) |
ES (1) | ES480922A1 (nl) |
NL (1) | NL7805800A (nl) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6051939B2 (ja) * | 1981-06-02 | 1985-11-16 | 権士 近藤 | 噴流式はんだ槽 |
EP0109988B1 (en) * | 1982-11-24 | 1987-01-28 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US4697730A (en) * | 1984-05-25 | 1987-10-06 | The Htc Corporation | Continuous solder system |
US4653682A (en) * | 1985-02-14 | 1987-03-31 | At&T Technologies, Inc. | Method and apparatus for bonding connector terminals to circuit boards |
US4693408A (en) * | 1985-02-14 | 1987-09-15 | American Telephone And Telegraph, Company At&T Technologies, Inc. | Apparatus for bonding connector terminals to circuit boards |
US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
US4747533A (en) * | 1986-04-28 | 1988-05-31 | International Business Machines Corporation | Bonding method and apparatus |
US4805831A (en) * | 1986-04-28 | 1989-02-21 | International Business Machines Corporation | Bonding method |
US4805828A (en) * | 1987-01-23 | 1989-02-21 | Rockwell International Corporation | Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair |
DE4103098C1 (nl) * | 1991-02-01 | 1992-06-25 | Helmut Walter 8901 Koenigsbrunn De Leicht | |
JP3103410B2 (ja) * | 1991-12-20 | 2000-10-30 | 大阪酸素工業株式会社 | 特殊雰囲気ガスを用いたはんだ付け方法 |
US5230462A (en) * | 1992-07-08 | 1993-07-27 | Materials Research Corporation | Method of soldering a sputtering target to a backing member |
DE4302976A1 (de) * | 1992-07-22 | 1994-01-27 | Bosch Gmbh Robert | Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen |
JP2000244108A (ja) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
WO2005107991A1 (de) * | 2004-04-08 | 2005-11-17 | Kirsten Soldering Ag | Wellenlötanlage und verfahren zum wellenlöten |
US7730772B2 (en) * | 2007-12-28 | 2010-06-08 | Honeywell International Inc. | Surface acoustic wave sensor and package |
US7726184B2 (en) * | 2007-12-28 | 2010-06-01 | Honeywell International Inc. | Surface acoustic wave sensor and package |
US8384524B2 (en) * | 2008-11-26 | 2013-02-26 | Honeywell International Inc. | Passive surface acoustic wave sensing system |
US8317392B2 (en) * | 2008-12-23 | 2012-11-27 | Honeywell International Inc. | Surface acoustic wave based micro-sensor apparatus and method for simultaneously monitoring multiple conditions |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2495150A (en) * | 1945-04-02 | 1950-01-17 | Packard Motor Car Co | Method of conditioning metal members for a welding operation |
US2869497A (en) * | 1954-01-11 | 1959-01-20 | Sylvania Electric Prod | Soldering machine |
US3217959A (en) * | 1963-04-17 | 1965-11-16 | Philco Corp | Soldering apparatus |
US3500536A (en) * | 1966-11-17 | 1970-03-17 | Burroughs Corp | Process for finishing solder joints on a circuit board |
US3765591A (en) * | 1972-01-19 | 1973-10-16 | Dynamics Corp America | Wave soldering electrical connections |
US3778883A (en) * | 1972-06-02 | 1973-12-18 | Honeywell Inf Systems | Process of mass soldering electrical components to circuit boards having runs formed from insulated magnet wire |
US3825994A (en) * | 1972-11-15 | 1974-07-30 | Rca Corp | Method of soldering circuit components to a substrate |
-
1978
- 1978-05-29 NL NL7805800A patent/NL7805800A/nl not_active Application Discontinuation
-
1979
- 1979-05-25 EP EP79200258A patent/EP0005883B1/de not_active Expired
- 1979-05-25 AT AT79200258T patent/ATE602T1/de not_active IP Right Cessation
- 1979-05-25 DE DE7979200258T patent/DE2961866D1/de not_active Expired
- 1979-05-25 ES ES480922A patent/ES480922A1/es not_active Expired
- 1979-05-26 JP JP6461379A patent/JPS54156173A/ja active Granted
-
1981
- 1981-03-23 US US06/246,525 patent/US4332342A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0005883A1 (de) | 1979-12-12 |
JPS6157720B2 (nl) | 1986-12-08 |
ES480922A1 (es) | 1979-12-01 |
US4332342A (en) | 1982-06-01 |
EP0005883B1 (de) | 1982-01-20 |
DE2961866D1 (en) | 1982-03-04 |
JPS54156173A (en) | 1979-12-08 |
NL7805800A (nl) | 1979-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE602T1 (de) | Verfahren und vorrichtung zum anloeten von bauteilen an ein dickschichtsubstrat. | |
DE69903045D1 (de) | Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung | |
ATE7545T1 (de) | Verfahren zur maskierung ausgewaehlter bereiche elektrischer leiterplatten; maskierte leiterplatte und elektrische leiterplatten, die komponenten tragen. | |
DE3269653D1 (en) | Soldering device and method | |
ATE7290T1 (de) | Vorheizung von glasgemengen. | |
ES456950A1 (es) | Un metodo mejorado para formar un revestimiento de poli(sul-furo de fenileno) sobre la superficie de un sustrato metali-co. | |
GB1533350A (en) | Method and apparatus for distillation | |
EP0285900A3 (de) | Verfahren zur Herstellung gedruckter Schaltungen | |
AT369036B (de) | Verfahren und vorrichtung zum entgasen von geschmolzenem metall | |
ATE43806T1 (de) | Verfahren zum co-laminat-platieren von li enthaltenden al-legierungen. | |
KR970019793A (ko) | 땜납 및 납땜법 | |
ATE337882T1 (de) | Verfahren und vorrichtung zum verlöten von elektrischen bauteilen auf einer kunststofffolie | |
JPS57132334A (en) | Soldering method | |
DD132999A1 (de) | Verfahren und vorrichtung zum waermetausch von schuettguetern | |
JPS5428590A (en) | Laser processing method | |
JPS595494Y2 (ja) | プリント基板予備加熱装置 | |
SE7807818L (sv) | Sett vid tillverkning av vermevexlare for kylnings- och vermningsendamal, samt apparat for genomforande av settet | |
ATE7711T1 (de) | Verfahren und apparat zur rueckgewinnung von energie aus fluessiger schlacke. | |
JPS53106646A (en) | Method and apparatus for vacuum evaporation plating | |
ATE212893T1 (de) | Verfahren zum wellenlöten von leiterplatten | |
ES444106A1 (es) | Un metodo para la fabricacion de circuitos de pelicula grue-sa. | |
ATE117161T1 (de) | Verfahren und vorrichtung zum kontaktieren von bauelementen mittels laserstrahlen. | |
JPS62203669A (ja) | チップ部品を搭載するプリント基板用リフロー装置 | |
JPS5494680A (en) | Production method of enameled wire by fused resin painting | |
SU683867A1 (ru) | Способ лужени контактных площадок печатных плат |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |