ATE554486T1 - CERAMIC CHIP ARRANGEMENT - Google Patents
CERAMIC CHIP ARRANGEMENTInfo
- Publication number
- ATE554486T1 ATE554486T1 AT09012025T AT09012025T ATE554486T1 AT E554486 T1 ATE554486 T1 AT E554486T1 AT 09012025 T AT09012025 T AT 09012025T AT 09012025 T AT09012025 T AT 09012025T AT E554486 T1 ATE554486 T1 AT E554486T1
- Authority
- AT
- Austria
- Prior art keywords
- ceramic base
- pair
- ceramic
- ceramic chip
- external electrodes
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 7
- 239000000463 material Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011247 coating layer Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Thermistors And Varistors (AREA)
Abstract
A ceramic chip assembly is provided. The ceramic chip assembly includes a ceramic base, a plurality of external electrodes, a pair of cylindrical metal lead wires, and an insulating protection material. The ceramic base has electrical characteristics of a semiconductor. The pair of external electrodes is oppositely formed on both side surfaces of the ceramic base, respectively. The cylindrical metal lead wire has one end thereof electrically and mechanically connected to the external electrodes by an electrical conductive adhesive, respectively, and has an external diameter identical to or greater than the thickness of the ceramic base. The insulating protection material includes a pair of insulating films and an insulating coating layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080099110 | 2008-10-09 | ||
KR20090060215A KR101038755B1 (en) | 2008-10-09 | 2009-07-02 | Ceramic Chip Assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE554486T1 true ATE554486T1 (en) | 2012-05-15 |
Family
ID=42216414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09012025T ATE554486T1 (en) | 2008-10-09 | 2009-09-22 | CERAMIC CHIP ARRANGEMENT |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2010093258A (en) |
KR (1) | KR101038755B1 (en) |
CN (1) | CN101719418B (en) |
AT (1) | ATE554486T1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140006759A (en) * | 2010-07-02 | 2014-01-16 | 타이코 일렉트로닉스 저팬 지.케이. | Ptc device and secondary battery having same |
KR101036951B1 (en) * | 2010-07-28 | 2011-05-25 | 김선기 | Ceramic chip assembly |
KR101008310B1 (en) | 2010-07-30 | 2011-01-13 | 김선기 | Ceramic chip assembly |
KR101110482B1 (en) | 2011-11-29 | 2012-02-20 | 디에스씨전자 주식회사 | Highly insulated characteristics negative temperature coefficient thermistor |
EP2851664B1 (en) * | 2012-05-14 | 2019-06-05 | Shenzhen Minjie Electronic Technology Co., Ltd. | Surface temperature measuring sensor |
JP2013219404A (en) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | Method for manufacturing antenna component |
US9653205B2 (en) * | 2014-04-30 | 2017-05-16 | Cyntec Co., Ltd. | Electrode structure and the corresponding electrical component using the same and the fabrication method thereof |
KR101494634B1 (en) * | 2014-08-26 | 2015-02-23 | 한국세라믹기술원 | Lifetime testing method of thermistor device |
WO2017013224A1 (en) * | 2015-07-21 | 2017-01-26 | Koninklijke Philips N.V. | Transducer laminate |
JP6716701B2 (en) * | 2016-08-04 | 2020-07-01 | 岡本株式会社 | Electronic functional member, knitted product using the same, and method of manufacturing electronic functional member |
JP7082539B2 (en) * | 2018-07-13 | 2022-06-08 | ニチコン株式会社 | PTC thermistor |
CN112530650B (en) * | 2020-12-22 | 2022-07-19 | 湖州浩通电子科技有限公司 | Ceramic thermosensitive element |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5797907U (en) * | 1980-12-03 | 1982-06-16 | ||
JPS6312125A (en) * | 1987-05-22 | 1988-01-19 | 太陽誘電株式会社 | Manufacture of electronic parts arrangement |
JP3150180B2 (en) * | 1991-12-19 | 2001-03-26 | ティーディーケイ株式会社 | Method for manufacturing a thermistor element |
JPH05347201A (en) * | 1992-06-15 | 1993-12-27 | Tdk Corp | Thin film resistor |
CN2144852Y (en) * | 1992-10-29 | 1993-10-27 | 蔡雅凤 | Overcurrent protection quick response forward temp. coefficient thermal resistor |
JP3494709B2 (en) * | 1994-06-07 | 2004-02-09 | 石塚電子株式会社 | Temperature sensor and its lead frame |
JPH08128901A (en) * | 1994-10-31 | 1996-05-21 | Sanyo Electric Co Ltd | Temperature sensor and pack battery |
KR0174589B1 (en) * | 1995-09-07 | 1999-04-01 | 우덕창 | Leaded NTC Thermistors |
JPH09297069A (en) * | 1996-05-07 | 1997-11-18 | Tdk Corp | Temperature detecting sensor |
JPH1154301A (en) * | 1997-08-07 | 1999-02-26 | Murata Mfg Co Ltd | Chip thermister |
JP2001141575A (en) * | 1999-11-17 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Temperature sensor element and temperature sensor using it |
JP3516204B2 (en) * | 1999-11-26 | 2004-04-05 | Tdk株式会社 | How to assemble a sensor for detecting temperature and the sensor |
JP4547475B2 (en) * | 2004-08-20 | 2010-09-22 | 石塚電子株式会社 | Flat plate temperature sensor |
KR100734788B1 (en) * | 2005-11-25 | 2007-07-04 | 주식회사 제임스텍 | Ntc thermistor temperature sensor and manufacturing method thereof |
-
2009
- 2009-07-02 KR KR20090060215A patent/KR101038755B1/en active IP Right Grant
- 2009-09-22 AT AT09012025T patent/ATE554486T1/en active
- 2009-10-06 JP JP2009232446A patent/JP2010093258A/en active Pending
- 2009-10-09 CN CN2009102049045A patent/CN101719418B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101719418B (en) | 2011-08-31 |
CN101719418A (en) | 2010-06-02 |
KR20100040241A (en) | 2010-04-19 |
JP2010093258A (en) | 2010-04-22 |
KR101038755B1 (en) | 2011-06-03 |
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