ATE551734T1 - Selbstjustierter nanoröhren-feld-effekt- transistor und verfahren zu seiner herstellung - Google Patents

Selbstjustierter nanoröhren-feld-effekt- transistor und verfahren zu seiner herstellung

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Publication number
ATE551734T1
ATE551734T1 AT03721349T AT03721349T ATE551734T1 AT E551734 T1 ATE551734 T1 AT E551734T1 AT 03721349 T AT03721349 T AT 03721349T AT 03721349 T AT03721349 T AT 03721349T AT E551734 T1 ATE551734 T1 AT E551734T1
Authority
AT
Austria
Prior art keywords
nanotube
carbon
field effect
effect transistor
self
Prior art date
Application number
AT03721349T
Other languages
English (en)
Inventor
Joerg Appenzeller
Phaedon Avouris
Kevin Chan
Philip Collins
Richard Martel
Hon-Sum Philip Wong
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE551734T1 publication Critical patent/ATE551734T1/de

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/468Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0673Nanowires or nanotubes oriented parallel to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0676Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221Carbon nanotubes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/466Lateral bottom-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/615Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/842Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/936Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
    • Y10S977/938Field effect transistors, FETS, with nanowire- or nanotube-channel region
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/94Specified use of nanostructure for electronic or optoelectronic application in a logic circuit
AT03721349T 2002-03-20 2003-02-19 Selbstjustierter nanoröhren-feld-effekt- transistor und verfahren zu seiner herstellung ATE551734T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/102,365 US6891227B2 (en) 2002-03-20 2002-03-20 Self-aligned nanotube field effect transistor and method of fabricating same
PCT/US2003/007269 WO2003081687A2 (en) 2002-03-20 2003-02-19 Self-aligned nanotube field effect transistor and method of fabricating same

Publications (1)

Publication Number Publication Date
ATE551734T1 true ATE551734T1 (de) 2012-04-15

Family

ID=28040198

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06120727T ATE516600T1 (de) 2002-03-20 2003-02-19 Kohlenstoff-nanoröhren-transistor und verfahren zur herstellung eines selbstausgerichteten transistors mit kohlenstoff-nanoröhre
AT03721349T ATE551734T1 (de) 2002-03-20 2003-02-19 Selbstjustierter nanoröhren-feld-effekt- transistor und verfahren zu seiner herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT06120727T ATE516600T1 (de) 2002-03-20 2003-02-19 Kohlenstoff-nanoröhren-transistor und verfahren zur herstellung eines selbstausgerichteten transistors mit kohlenstoff-nanoröhre

Country Status (14)

Country Link
US (6) US6891227B2 (de)
EP (2) EP1748503B1 (de)
JP (1) JP4493344B2 (de)
KR (1) KR100714932B1 (de)
CN (2) CN101807668B (de)
AT (2) ATE516600T1 (de)
AU (1) AU2003224668A1 (de)
BR (1) BR0308569A (de)
CA (3) CA2659479C (de)
IL (2) IL164066A0 (de)
MX (1) MXPA04008984A (de)
PL (1) PL373571A1 (de)
TW (1) TW586165B (de)
WO (1) WO2003081687A2 (de)

Families Citing this family (268)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7563711B1 (en) * 2001-07-25 2009-07-21 Nantero, Inc. Method of forming a carbon nanotube-based contact to semiconductor
US20070178477A1 (en) * 2002-01-16 2007-08-02 Nanomix, Inc. Nanotube sensor devices for DNA detection
US20060228723A1 (en) * 2002-01-16 2006-10-12 Keith Bradley System and method for electronic sensing of biomolecules
US20040253741A1 (en) * 2003-02-06 2004-12-16 Alexander Star Analyte detection in liquids with carbon nanotube field effect transistor devices
US6891227B2 (en) * 2002-03-20 2005-05-10 International Business Machines Corporation Self-aligned nanotube field effect transistor and method of fabricating same
JP3804594B2 (ja) * 2002-08-02 2006-08-02 日本電気株式会社 触媒担持基板およびそれを用いたカーボンナノチューブの成長方法ならびにカーボンナノチューブを用いたトランジスタ
AU2003283973B2 (en) 2002-09-30 2008-10-30 Oned Material Llc Large-area nanoenabled macroelectronic substrates and uses therefor
US7135728B2 (en) * 2002-09-30 2006-11-14 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
US7507987B2 (en) * 2002-10-11 2009-03-24 Massachusetts Institute Of Technology Method of making packets of nanostructures
US7466069B2 (en) * 2002-10-29 2008-12-16 President And Fellows Of Harvard College Carbon nanotube device fabrication
US7253434B2 (en) * 2002-10-29 2007-08-07 President And Fellows Of Harvard College Suspended carbon nanotube field effect transistor
JP4501339B2 (ja) * 2002-11-29 2010-07-14 ソニー株式会社 pn接合素子の製造方法
US6933222B2 (en) * 2003-01-02 2005-08-23 Intel Corporation Microcircuit fabrication and interconnection
CA2419704A1 (en) 2003-02-24 2004-08-24 Ignis Innovation Inc. Method of manufacturing a pixel with organic light-emitting diode
US6696327B1 (en) * 2003-03-18 2004-02-24 Intel Corporation Method for making a semiconductor device having a high-k gate dielectric
US20100244262A1 (en) 2003-06-30 2010-09-30 Fujitsu Limited Deposition method and a deposition apparatus of fine particles, a forming method and a forming apparatus of carbon nanotubes, and a semiconductor device and a manufacturing method of the same
TWI239071B (en) * 2003-08-20 2005-09-01 Ind Tech Res Inst Manufacturing method of carbon nano-tube transistor
US7547648B2 (en) 2003-08-20 2009-06-16 Qucor Pty Ltd Fabricating nanoscale and atomic scale devices
DE10340926A1 (de) * 2003-09-03 2005-03-31 Technische Universität Ilmenau Abteilung Forschungsförderung und Technologietransfer Verfahren zur Herstellung von elektronischen Bauelementen
US7105851B2 (en) * 2003-09-24 2006-09-12 Intel Corporation Nanotubes for integrated circuits
JP5250615B2 (ja) * 2003-10-28 2013-07-31 株式会社半導体エネルギー研究所 半導体装置
WO2005050305A1 (ja) * 2003-11-18 2005-06-02 Nikon Corporation 表示デバイス製造方法及び表示デバイス
US7374793B2 (en) * 2003-12-11 2008-05-20 International Business Machines Corporation Methods and structures for promoting stable synthesis of carbon nanotubes
US7038299B2 (en) * 2003-12-11 2006-05-02 International Business Machines Corporation Selective synthesis of semiconducting carbon nanotubes
DE102004001340A1 (de) * 2004-01-08 2005-08-04 Infineon Technologies Ag Verfahren zum Herstellen eines Nanoelement-Feldeffektransistors, Nanoelement-Feldeffekttransistor und Nanoelement-Anordnung
DE102004003374A1 (de) * 2004-01-22 2005-08-25 Infineon Technologies Ag Halbleiter-Leistungsschalter sowie dafür geeignetes Herstellungsverfahren
US7211844B2 (en) * 2004-01-29 2007-05-01 International Business Machines Corporation Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage
US20050167655A1 (en) * 2004-01-29 2005-08-04 International Business Machines Corporation Vertical nanotube semiconductor device structures and methods of forming the same
US7829883B2 (en) * 2004-02-12 2010-11-09 International Business Machines Corporation Vertical carbon nanotube field effect transistors and arrays
KR101050468B1 (ko) * 2004-02-14 2011-07-19 삼성에스디아이 주식회사 바이오 칩 및 이를 이용한 바이오 분자 검출 시스템
US7253431B2 (en) * 2004-03-02 2007-08-07 International Business Machines Corporation Method and apparatus for solution processed doping of carbon nanotube
US7862624B2 (en) * 2004-04-06 2011-01-04 Bao Tran Nano-particles on fabric or textile
US20050218397A1 (en) * 2004-04-06 2005-10-06 Availableip.Com NANO-electronics for programmable array IC
US7019391B2 (en) * 2004-04-06 2006-03-28 Bao Tran NANO IC packaging
US7330369B2 (en) * 2004-04-06 2008-02-12 Bao Tran NANO-electronic memory array
US20050218398A1 (en) * 2004-04-06 2005-10-06 Availableip.Com NANO-electronics
US7498641B2 (en) * 2004-05-28 2009-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Partial replacement silicide gate
US7109546B2 (en) * 2004-06-29 2006-09-19 International Business Machines Corporation Horizontal memory gain cells
US7129097B2 (en) * 2004-07-29 2006-10-31 International Business Machines Corporation Integrated circuit chip utilizing oriented carbon nanotube conductive layers
US20060063318A1 (en) * 2004-09-10 2006-03-23 Suman Datta Reducing ambipolar conduction in carbon nanotube transistors
KR101025846B1 (ko) * 2004-09-13 2011-03-30 삼성전자주식회사 탄소나노튜브 채널을 포함하는 반도체 장치의 트랜지스터
US7776307B2 (en) * 2004-09-16 2010-08-17 Etamota Corporation Concentric gate nanotube transistor devices
US7943418B2 (en) * 2004-09-16 2011-05-17 Etamota Corporation Removing undesirable nanotubes during nanotube device fabrication
US7345296B2 (en) * 2004-09-16 2008-03-18 Atomate Corporation Nanotube transistor and rectifying devices
US7462890B1 (en) 2004-09-16 2008-12-09 Atomate Corporation Nanotube transistor integrated circuit layout
US7233071B2 (en) * 2004-10-04 2007-06-19 International Business Machines Corporation Low-k dielectric layer based upon carbon nanostructures
US20070246784A1 (en) * 2004-10-13 2007-10-25 Samsung Electronics Co., Ltd. Unipolar nanotube transistor using a carrier-trapping material
US7226818B2 (en) 2004-10-15 2007-06-05 General Electric Company High performance field effect transistors comprising carbon nanotubes fabricated using solution based processing
CN100420033C (zh) * 2004-10-28 2008-09-17 鸿富锦精密工业(深圳)有限公司 场效应晶体管及其制造方法
US7405129B2 (en) * 2004-11-18 2008-07-29 International Business Machines Corporation Device comprising doped nano-component and method of forming the device
US7582534B2 (en) * 2004-11-18 2009-09-01 International Business Machines Corporation Chemical doping of nano-components
US7585420B2 (en) * 2004-12-16 2009-09-08 William Marsh Rice University Carbon nanotube substrates and catalyzed hot stamp for polishing and patterning the substrates
US7202173B2 (en) * 2004-12-20 2007-04-10 Palo Alto Research Corporation Incorporated Systems and methods for electrical contacts to arrays of vertically aligned nanorods
US7598516B2 (en) * 2005-01-07 2009-10-06 International Business Machines Corporation Self-aligned process for nanotube/nanowire FETs
US8362525B2 (en) * 2005-01-14 2013-01-29 Nantero Inc. Field effect device having a channel of nanofabric and methods of making same
US7598544B2 (en) * 2005-01-14 2009-10-06 Nanotero, Inc. Hybrid carbon nanotude FET(CNFET)-FET static RAM (SRAM) and method of making same
CA2495726A1 (en) 2005-01-28 2006-07-28 Ignis Innovation Inc. Locally referenced voltage programmed pixel for amoled displays
US7535016B2 (en) * 2005-01-31 2009-05-19 International Business Machines Corporation Vertical carbon nanotube transistor integration
US7772125B2 (en) * 2005-02-10 2010-08-10 Panasonic Corporation Structure in which cylindrical microstructure is maintained in anisotropic groove, method for fabricating the same, and semiconductor device, TFT driving circuit, panel, display and sensor using the structure in which cylindrical microstructure is maintained in anisotropic groove
US20100065820A1 (en) * 2005-02-14 2010-03-18 Atomate Corporation Nanotube Device Having Nanotubes with Multiple Characteristics
US20060180859A1 (en) * 2005-02-16 2006-08-17 Marko Radosavljevic Metal gate carbon nanotube transistor
US7671398B2 (en) * 2005-02-23 2010-03-02 Tran Bao Q Nano memory, light, energy, antenna and strand-based systems and methods
US7126207B2 (en) * 2005-03-24 2006-10-24 Intel Corporation Capacitor with carbon nanotubes
US7271079B2 (en) * 2005-04-06 2007-09-18 International Business Machines Corporation Method of doping a gate electrode of a field effect transistor
EP2348300A3 (de) * 2005-04-06 2011-10-12 The President and Fellows of Harvard College Molekulare charakterisierung mit kohlenstoff-nanoröhrchen-steuerung
KR101145146B1 (ko) * 2005-04-07 2012-05-14 엘지디스플레이 주식회사 박막트랜지스터와 그 제조방법
KR101109623B1 (ko) 2005-04-07 2012-01-31 엘지디스플레이 주식회사 박막트랜지스터와 그 제조방법.
US7781862B2 (en) * 2005-05-09 2010-08-24 Nantero, Inc. Two-terminal nanotube devices and systems and methods of making same
US7479654B2 (en) 2005-05-09 2009-01-20 Nantero, Inc. Memory arrays using nanotube articles with reprogrammable resistance
US7141727B1 (en) * 2005-05-16 2006-11-28 International Business Machines Corporation Method and apparatus for fabricating a carbon nanotube transistor having unipolar characteristics
US7230286B2 (en) * 2005-05-23 2007-06-12 International Business Machines Corporation Vertical FET with nanowire channels and a silicided bottom contact
US7838943B2 (en) * 2005-07-25 2010-11-23 International Business Machines Corporation Shared gate for conventional planar device and horizontal CNT
US20070031318A1 (en) * 2005-08-03 2007-02-08 Jie Liu Methods of chemically treating an electrically conductive layer having nanotubes therein with diazonium reagent
US7485908B2 (en) * 2005-08-18 2009-02-03 United States Of America As Represented By The Secretary Of The Air Force Insulated gate silicon nanowire transistor and method of manufacture
US7371677B2 (en) * 2005-09-30 2008-05-13 Freescale Semiconductor, Inc. Laterally grown nanotubes and method of formation
US7492015B2 (en) * 2005-11-10 2009-02-17 International Business Machines Corporation Complementary carbon nanotube triple gate technology
KR100792402B1 (ko) 2005-12-28 2008-01-09 주식회사 하이닉스반도체 듀얼폴리게이트를 갖는 반도체소자의 제조 방법
US8394664B2 (en) * 2006-02-02 2013-03-12 William Marsh Rice University Electrical device fabrication from nanotube formations
US20070183189A1 (en) * 2006-02-08 2007-08-09 Thomas Nirschl Memory having nanotube transistor access device
US8759811B2 (en) * 2006-02-14 2014-06-24 Raytheon Company Particle encapsulated nanoswitch
KR100668355B1 (ko) * 2006-02-16 2007-01-12 삼성전자주식회사 캐리어 트래핑 물질을 구비한 유니폴라 탄소나노튜브 및유니폴라 전계효과 트랜지스터
WO2008054839A2 (en) * 2006-03-03 2008-05-08 William Marsh Rice University Carbon nanotube diameter selection by pretreatment of metal catalysts on surfaces
KR100777265B1 (ko) * 2006-03-30 2007-11-20 고려대학교 산학협력단 나노 입자를 이용한 전면 게이트 박막 트랜지스터 및 그제조 방법
US8785058B2 (en) 2006-04-07 2014-07-22 New Jersey Institute Of Technology Integrated biofuel cell with aligned nanotube electrodes and method of use thereof
US7626190B2 (en) 2006-06-02 2009-12-01 Infineon Technologies Ag Memory device, in particular phase change random access memory device with transistor, and method for fabricating a memory device
DE102006026949A1 (de) * 2006-06-09 2007-12-13 Infineon Technologies Ag Speicherbauelement, insbesondere Phasenwechselspeicherbauelement mit wahlfreiem Zugriff mit Transistor, und Verfahren zum Herstellen eines Speicherbauelements
US7714386B2 (en) 2006-06-09 2010-05-11 Northrop Grumman Systems Corporation Carbon nanotube field effect transistor
US7393699B2 (en) 2006-06-12 2008-07-01 Tran Bao Q NANO-electronics
US20070290394A1 (en) * 2006-06-20 2007-12-20 International Business Machines Corporation Method and structure for forming self-planarizing wiring layers in multilevel electronic devices
US20080135892A1 (en) * 2006-07-25 2008-06-12 Paul Finnie Carbon nanotube field effect transistor and method of making thereof
FR2897978A1 (fr) * 2006-08-03 2007-08-31 Commissariat Energie Atomique Cellule de memoire comportant un transistor moleculaire, dispositif comportant une pluralite de telles cellules et procede d'utilisation
JP5168888B2 (ja) * 2006-11-20 2013-03-27 日本電気株式会社 半導体装置及びその製造方法
KR100912111B1 (ko) * 2006-12-04 2009-08-13 한국전자통신연구원 쇼트키 장벽 나노선 전계 효과 트랜지스터 및 그 제조방법
US8168495B1 (en) 2006-12-29 2012-05-01 Etamota Corporation Carbon nanotube high frequency transistor technology
US9806273B2 (en) * 2007-01-03 2017-10-31 The United States Of America As Represented By The Secretary Of The Army Field effect transistor array using single wall carbon nano-tubes
DE102007001130B4 (de) * 2007-01-04 2014-07-03 Qimonda Ag Verfahren zum Herstellen einer Durchkontaktierung in einer Schicht und Anordnung mit einer Schicht mit Durchkontaktierung
US7511344B2 (en) * 2007-01-17 2009-03-31 International Business Machines Corporation Field effect transistor
US8039870B2 (en) * 2008-01-28 2011-10-18 Rf Nano Corporation Multifinger carbon nanotube field-effect transistor
US8569834B2 (en) * 2007-04-12 2013-10-29 The Penn State Research Foundation Accumulation field effect microelectronic device and process for the formation thereof
US9209246B2 (en) 2007-04-12 2015-12-08 The Penn State University Accumulation field effect microelectronic device and process for the formation thereof
WO2009023304A2 (en) * 2007-05-02 2009-02-19 Atomate Corporation High density nanotube devices
US7736979B2 (en) 2007-06-20 2010-06-15 New Jersey Institute Of Technology Method of forming nanotube vertical field effect transistor
US8546027B2 (en) 2007-06-20 2013-10-01 New Jersey Institute Of Technology System and method for directed self-assembly technique for the creation of carbon nanotube sensors and bio-fuel cells on single plane
US7964143B2 (en) 2007-06-20 2011-06-21 New Jersey Institute Of Technology Nanotube device and method of fabrication
US7858454B2 (en) * 2007-07-31 2010-12-28 Rf Nano Corporation Self-aligned T-gate carbon nanotube field effect transistor devices and method for forming the same
CN101442105B (zh) * 2007-11-21 2010-06-09 中国科学院化学研究所 一种有机场效应晶体管及其专用源漏电极与制备方法
KR20100110853A (ko) * 2007-12-31 2010-10-13 아토메이트 코포레이션 에지-접촉된 수직형 탄소 나노튜브 트랜지스터
KR100930997B1 (ko) * 2008-01-22 2009-12-10 한국화학연구원 탄소나노튜브 트랜지스터 제조 방법 및 그에 의한탄소나노튜브 트랜지스터
US8847249B2 (en) 2008-06-16 2014-09-30 Soraa, Inc. Solid-state optical device having enhanced indium content in active regions
US7858506B2 (en) 2008-06-18 2010-12-28 Micron Technology, Inc. Diodes, and methods of forming diodes
US8143148B1 (en) * 2008-07-14 2012-03-27 Soraa, Inc. Self-aligned multi-dielectric-layer lift off process for laser diode stripes
US8767787B1 (en) 2008-07-14 2014-07-01 Soraa Laser Diode, Inc. Integrated laser diodes with quality facets on GaN substrates
US8805134B1 (en) 2012-02-17 2014-08-12 Soraa Laser Diode, Inc. Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices
CN102144294A (zh) 2008-08-04 2011-08-03 Soraa有限公司 使用非极性或半极性的含镓材料和磷光体的白光器件
US8284810B1 (en) 2008-08-04 2012-10-09 Soraa, Inc. Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods
US8063454B2 (en) 2008-08-13 2011-11-22 Micron Technology, Inc. Semiconductor structures including a movable switching element and systems including same
US9494615B2 (en) * 2008-11-24 2016-11-15 Massachusetts Institute Of Technology Method of making and assembling capsulated nanostructures
US7893492B2 (en) * 2009-02-17 2011-02-22 International Business Machines Corporation Nanowire mesh device and method of fabricating same
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
US8837545B2 (en) 2009-04-13 2014-09-16 Soraa Laser Diode, Inc. Optical device structure using GaN substrates and growth structures for laser applications
US8634442B1 (en) 2009-04-13 2014-01-21 Soraa Laser Diode, Inc. Optical device structure using GaN substrates for laser applications
US9531164B2 (en) * 2009-04-13 2016-12-27 Soraa Laser Diode, Inc. Optical device structure using GaN substrates for laser applications
US10108079B2 (en) 2009-05-29 2018-10-23 Soraa Laser Diode, Inc. Laser light source for a vehicle
US9829780B2 (en) 2009-05-29 2017-11-28 Soraa Laser Diode, Inc. Laser light source for a vehicle
US8247887B1 (en) 2009-05-29 2012-08-21 Soraa, Inc. Method and surface morphology of non-polar gallium nitride containing substrates
US8427590B2 (en) 2009-05-29 2013-04-23 Soraa, Inc. Laser based display method and system
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
US8509275B1 (en) 2009-05-29 2013-08-13 Soraa, Inc. Gallium nitride based laser dazzling device and method
US9800017B1 (en) 2009-05-29 2017-10-24 Soraa Laser Diode, Inc. Laser device and method for a vehicle
US8895352B2 (en) 2009-06-02 2014-11-25 International Business Machines Corporation Method to improve nucleation of materials on graphene and carbon nanotubes
US8128993B2 (en) * 2009-07-31 2012-03-06 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
US8574673B2 (en) * 2009-07-31 2013-11-05 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
CN101997035B (zh) * 2009-08-14 2012-08-29 清华大学 薄膜晶体管
US8355418B2 (en) 2009-09-17 2013-01-15 Soraa, Inc. Growth structures and method for forming laser diodes on {20-21} or off cut gallium and nitrogen containing substrates
US8750342B1 (en) 2011-09-09 2014-06-10 Soraa Laser Diode, Inc. Laser diodes with scribe structures
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US8841652B2 (en) * 2009-11-30 2014-09-23 International Business Machines Corporation Self aligned carbide source/drain FET
US20110127492A1 (en) * 2009-11-30 2011-06-02 International Business Machines Corporation Field Effect Transistor Having Nanostructure Channel
US8097515B2 (en) * 2009-12-04 2012-01-17 International Business Machines Corporation Self-aligned contacts for nanowire field effect transistors
US8143113B2 (en) * 2009-12-04 2012-03-27 International Business Machines Corporation Omega shaped nanowire tunnel field effect transistors fabrication
US8129247B2 (en) * 2009-12-04 2012-03-06 International Business Machines Corporation Omega shaped nanowire field effect transistors
WO2011068028A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and method for manufacturing the same
US8173993B2 (en) * 2009-12-04 2012-05-08 International Business Machines Corporation Gate-all-around nanowire tunnel field effect transistors
US8455334B2 (en) * 2009-12-04 2013-06-04 International Business Machines Corporation Planar and nanowire field effect transistors
US8384065B2 (en) * 2009-12-04 2013-02-26 International Business Machines Corporation Gate-all-around nanowire field effect transistors
US20120248417A1 (en) * 2009-12-21 2012-10-04 Imec Double gate nanostructure fet
WO2011077966A1 (en) * 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8101474B2 (en) * 2010-01-06 2012-01-24 International Business Machines Corporation Structure and method of forming buried-channel graphene field effect device
US8722492B2 (en) * 2010-01-08 2014-05-13 International Business Machines Corporation Nanowire pin tunnel field effect devices
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8436403B2 (en) * 2010-02-05 2013-05-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including transistor provided with sidewall and electronic appliance
JP5601848B2 (ja) 2010-02-09 2014-10-08 三菱電機株式会社 SiC半導体装置の製造方法
WO2011103558A1 (en) * 2010-02-22 2011-08-25 Nantero, Inc. Logic elements comprising carbon nanotube field effect transistor (cntfet) devices and methods of making same
WO2011105198A1 (en) * 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20110233513A1 (en) * 2010-03-29 2011-09-29 International Business Machines Corporation Enhanced bonding interfaces on carbon-based materials for nanoelectronic devices
US8324940B2 (en) 2010-04-13 2012-12-04 International Business Machines Corporation Nanowire circuits in matched devices
US8361907B2 (en) 2010-05-10 2013-01-29 International Business Machines Corporation Directionally etched nanowire field effect transistors
US8324030B2 (en) 2010-05-12 2012-12-04 International Business Machines Corporation Nanowire tunnel field effect transistors
US8451876B1 (en) 2010-05-17 2013-05-28 Soraa, Inc. Method and system for providing bidirectional light sources with broad spectrum
US8513099B2 (en) 2010-06-17 2013-08-20 International Business Machines Corporation Epitaxial source/drain contacts self-aligned to gates for deposited FET channels
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US8404539B2 (en) 2010-07-08 2013-03-26 International Business Machines Corporation Self-aligned contacts in carbon devices
WO2012014786A1 (en) 2010-07-30 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semicondcutor device and manufacturing method thereof
US8835231B2 (en) 2010-08-16 2014-09-16 International Business Machines Corporation Methods of forming contacts for nanowire field effect transistors
US8536563B2 (en) 2010-09-17 2013-09-17 International Business Machines Corporation Nanowire field effect transistors
US8816319B1 (en) 2010-11-05 2014-08-26 Soraa Laser Diode, Inc. Method of strain engineering and related optical device using a gallium and nitrogen containing active region
US9048170B2 (en) 2010-11-09 2015-06-02 Soraa Laser Diode, Inc. Method of fabricating optical devices using laser treatment
US8597967B1 (en) 2010-11-17 2013-12-03 Soraa, Inc. Method and system for dicing substrates containing gallium and nitrogen material
US9595813B2 (en) 2011-01-24 2017-03-14 Soraa Laser Diode, Inc. Laser package having multiple emitters configured on a substrate member
US9025635B2 (en) 2011-01-24 2015-05-05 Soraa Laser Diode, Inc. Laser package having multiple emitters configured on a support member
US9093820B1 (en) 2011-01-25 2015-07-28 Soraa Laser Diode, Inc. Method and structure for laser devices using optical blocking regions
US9287684B2 (en) 2011-04-04 2016-03-15 Soraa Laser Diode, Inc. Laser package having multiple emitters with color wheel
US8471249B2 (en) * 2011-05-10 2013-06-25 International Business Machines Corporation Carbon field effect transistors having charged monolayers to reduce parasitic resistance
US9606607B2 (en) 2011-05-17 2017-03-28 Ignis Innovation Inc. Systems and methods for display systems with dynamic power control
US8455365B2 (en) * 2011-05-19 2013-06-04 Dechao Guo Self-aligned carbon electronics with embedded gate electrode
US8492748B2 (en) 2011-06-27 2013-07-23 International Business Machines Corporation Collapsable gate for deposited nanostructures
US8486778B2 (en) 2011-07-15 2013-07-16 International Business Machines Corporation Low resistance source and drain extensions for ETSOI
US8729529B2 (en) * 2011-08-03 2014-05-20 Ignis Innovation Inc. Thin film transistor including a nanoconductor layer
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US9090936B2 (en) 2011-09-19 2015-07-28 California Institute Of Technology Using a field effect device for identifying translocating charge-tagged molecules in a nanopore sequencing device
US8803129B2 (en) * 2011-10-11 2014-08-12 International Business Machines Corporation Patterning contacts in carbon nanotube devices
US8971370B1 (en) 2011-10-13 2015-03-03 Soraa Laser Diode, Inc. Laser devices using a semipolar plane
US8629010B2 (en) 2011-10-21 2014-01-14 International Business Machines Corporation Carbon nanotube transistor employing embedded electrodes
US8569121B2 (en) * 2011-11-01 2013-10-29 International Business Machines Corporation Graphene and nanotube/nanowire transistor with a self-aligned gate structure on transparent substrates and method of making same
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
US8772782B2 (en) 2011-11-23 2014-07-08 International Business Machines Corporation Transistor employing vertically stacked self-aligned carbon nanotubes
JP5887881B2 (ja) * 2011-11-28 2016-03-16 株式会社リコー 配線の形成方法
US8895417B2 (en) 2011-11-29 2014-11-25 International Business Machines Corporation Reducing contact resistance for field-effect transistor devices
US9385169B2 (en) 2011-11-29 2016-07-05 Ignis Innovation Inc. Multi-functional active matrix organic light-emitting diode display
US8772910B2 (en) 2011-11-29 2014-07-08 International Business Machines Corporation Doping carbon nanotubes and graphene for improving electronic mobility
US8642432B2 (en) 2011-12-01 2014-02-04 International Business Machines Corporation N-dopant for carbon nanotubes and graphene
US9663369B2 (en) 2011-12-16 2017-05-30 International Business Machines Corporation Cerium (IV) salts as effective dopant for carbon nanotubes and graphene
US9240552B2 (en) 2011-12-27 2016-01-19 Intel Corporation Carbon nanotube semiconductor devices and deterministic nanofabrication methods
US10224413B1 (en) * 2012-01-30 2019-03-05 Northrop Grumman Systems Corporation Radio-frequency carbon-nanotube field effect transistor devices with local backgates and methods for making same
JP2013179274A (ja) * 2012-02-09 2013-09-09 Nippon Telegr & Teleph Corp <Ntt> 電界効果トランジスタおよびその製造方法
US9020003B1 (en) 2012-03-14 2015-04-28 Soraa Laser Diode, Inc. Group III-nitride laser diode grown on a semi-polar orientation of gallium and nitrogen containing substrates
US9343871B1 (en) 2012-04-05 2016-05-17 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
EP2674996A1 (de) * 2012-06-15 2013-12-18 Imec VZW Verfahren zur Züchtung von Nanostrukturen in eingelassenen Strukturen
US8741756B2 (en) 2012-08-13 2014-06-03 International Business Machines Corporation Contacts-first self-aligned carbon nanotube transistor with gate-all-around
US8786018B2 (en) 2012-09-11 2014-07-22 International Business Machines Corporation Self-aligned carbon nanostructure field effect transistors using selective dielectric deposition
US8823059B2 (en) 2012-09-27 2014-09-02 Intel Corporation Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack
US8735869B2 (en) 2012-09-27 2014-05-27 Intel Corporation Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
US8796096B2 (en) 2012-12-04 2014-08-05 International Business Machines Corporation Self-aligned double-gate graphene transistor
US8609481B1 (en) 2012-12-05 2013-12-17 International Business Machines Corporation Gate-all-around carbon nanotube transistor with selectively doped spacers
US8900975B2 (en) 2013-01-03 2014-12-02 International Business Machines Corporation Nanopore sensor device
JP5637231B2 (ja) * 2013-03-04 2014-12-10 富士通株式会社 電界効果型トランジスタの製造方法
US9721505B2 (en) 2013-03-08 2017-08-01 Ignis Innovation Inc. Pixel circuits for AMOLED displays
JP6376788B2 (ja) 2013-03-26 2018-08-22 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US9048216B2 (en) 2013-04-17 2015-06-02 International Business Machines Corporation Self aligned embedded gate carbon transistors
US9193585B2 (en) 2013-06-07 2015-11-24 International Business Machines Corporation Surface modification using functional carbon nanotubes
US8841189B1 (en) * 2013-06-14 2014-09-23 International Business Machines Corporation Transistor having all-around source/drain metal contact channel stressor and method to fabricate same
JP2015032662A (ja) * 2013-08-01 2015-02-16 株式会社東芝 半導体装置及びその製造方法
US9406888B2 (en) 2013-08-07 2016-08-02 GlobalFoundries, Inc. Carbon nanotube device
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
CN104576324A (zh) * 2013-12-21 2015-04-29 上海大学 碳基电子的制作及互连方法
CA2872563A1 (en) 2014-11-28 2016-05-28 Ignis Innovation Inc. High pixel density array architecture
US10020300B2 (en) 2014-12-18 2018-07-10 Agilome, Inc. Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids
US9618474B2 (en) 2014-12-18 2017-04-11 Edico Genome, Inc. Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids
WO2016100049A1 (en) 2014-12-18 2016-06-23 Edico Genome Corporation Chemically-sensitive field effect transistor
US9857328B2 (en) 2014-12-18 2018-01-02 Agilome, Inc. Chemically-sensitive field effect transistors, systems and methods for manufacturing and using the same
US9859394B2 (en) 2014-12-18 2018-01-02 Agilome, Inc. Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids
US10006910B2 (en) 2014-12-18 2018-06-26 Agilome, Inc. Chemically-sensitive field effect transistors, systems, and methods for manufacturing and using the same
US9502673B2 (en) * 2015-03-31 2016-11-22 International Business Machines Corporation Transistor devices with tapered suspended vertical arrays of carbon nanotubes
US10217819B2 (en) * 2015-05-20 2019-02-26 Samsung Electronics Co., Ltd. Semiconductor device including metal-2 dimensional material-semiconductor contact
US10657895B2 (en) 2015-07-24 2020-05-19 Ignis Innovation Inc. Pixels and reference circuits and timing techniques
US10373554B2 (en) 2015-07-24 2019-08-06 Ignis Innovation Inc. Pixels and reference circuits and timing techniques
CA2898282A1 (en) 2015-07-24 2017-01-24 Ignis Innovation Inc. Hybrid calibration of current sources for current biased voltage progra mmed (cbvp) displays
US9787963B2 (en) 2015-10-08 2017-10-10 Soraa Laser Diode, Inc. Laser lighting having selective resolution
JP6851166B2 (ja) 2015-10-12 2021-03-31 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10276698B2 (en) 2015-10-21 2019-04-30 International Business Machines Corporation Scalable process for the formation of self aligned, planar electrodes for devices employing one or two dimensional lattice structures
CA2909813A1 (en) 2015-10-26 2017-04-26 Ignis Innovation Inc High ppi pattern orientation
US9577204B1 (en) * 2015-10-30 2017-02-21 International Business Machines Corporation Carbon nanotube field-effect transistor with sidewall-protected metal contacts
US9837394B2 (en) 2015-12-02 2017-12-05 International Business Machines Corporation Self-aligned three dimensional chip stack and method for making the same
US10396300B2 (en) 2015-12-03 2019-08-27 International Business Machines Corporation Carbon nanotube device with N-type end-bonded metal contacts
EP3459115A4 (de) 2016-05-16 2020-04-08 Agilome, Inc. Graphen-fet-vorrichtungen, systeme und verfahren zur verwendung davon zur sequenzierung von nukleinsäuren
US10665798B2 (en) * 2016-07-14 2020-05-26 International Business Machines Corporation Carbon nanotube transistor and logic with end-bonded metal contacts
US10665799B2 (en) * 2016-07-14 2020-05-26 International Business Machines Corporation N-type end-bonded metal contacts for carbon nanotube transistors
US10825681B2 (en) * 2016-08-13 2020-11-03 Applied Materials, Inc. 3D CTF integration using hybrid charge trap layer of sin and self aligned SiGe nanodot
GB2554362B (en) * 2016-09-21 2020-11-11 Pragmatic Printing Ltd Transistor and its method of manufacture
CN106229348A (zh) * 2016-09-22 2016-12-14 京东方科技集团股份有限公司 薄膜晶体管及其制造方法、阵列基板、显示装置
DE102017222059A1 (de) 2016-12-06 2018-06-07 Ignis Innovation Inc. Pixelschaltungen zur Minderung von Hysterese
US10304804B2 (en) * 2017-03-31 2019-05-28 Intel Corporation System on package architecture including structures on die back side
US10714018B2 (en) 2017-05-17 2020-07-14 Ignis Innovation Inc. System and method for loading image correction data for displays
US10141528B1 (en) * 2017-05-23 2018-11-27 International Business Machines Corporation Enhancing drive current and increasing device yield in n-type carbon nanotube field effect transistors
US10193090B2 (en) * 2017-06-20 2019-01-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a semiconductor device and a semiconductor device
WO2019025917A1 (ja) 2017-08-04 2019-02-07 株式会社半導体エネルギー研究所 半導体装置、及び表示装置
US11025899B2 (en) 2017-08-11 2021-06-01 Ignis Innovation Inc. Optical correction systems and methods for correcting non-uniformity of emissive display devices
US10771155B2 (en) 2017-09-28 2020-09-08 Soraa Laser Diode, Inc. Intelligent visible light with a gallium and nitrogen containing laser source
CN107706307B (zh) * 2017-10-13 2020-05-19 深圳市华星光电半导体显示技术有限公司 碳纳米管薄膜晶体管及其制作方法
CN107819037B (zh) * 2017-12-07 2023-10-27 苏州大学 应用碳纳米管作为导电沟槽的鳍式场效应管及其制备方法
US10333088B1 (en) 2017-12-12 2019-06-25 International Business Machines Corporation Carbon nanotube transistor with carrier blocking using thin dielectric under contact
US10222474B1 (en) 2017-12-13 2019-03-05 Soraa Laser Diode, Inc. Lidar systems including a gallium and nitrogen containing laser light source
US10971078B2 (en) 2018-02-12 2021-04-06 Ignis Innovation Inc. Pixel measurement through data line
US10551728B1 (en) 2018-04-10 2020-02-04 Soraa Laser Diode, Inc. Structured phosphors for dynamic lighting
CN109560125B (zh) * 2018-11-27 2022-03-11 湖南工业大学 金属堆叠源漏电极场效应管及其制作方法
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
KR20200130778A (ko) * 2019-05-10 2020-11-20 삼성디스플레이 주식회사 박막 트랜지스터의 제조 방법, 표시 장치의 제조 방법 및 박막 트랜지스터 기판
CN110364438B (zh) * 2019-05-29 2023-05-05 北京华碳元芯电子科技有限责任公司 晶体管及其制造方法
CN110571333B (zh) * 2019-08-13 2023-06-30 北京元芯碳基集成电路研究院 一种无掺杂晶体管器件制作方法
US11417729B2 (en) 2019-08-29 2022-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Transistors with channels formed of low-dimensional materials and method forming same
DE102020109756A1 (de) * 2019-08-29 2021-03-04 Taiwan Semiconductor Manufacturing Co., Ltd. Transistoren mit kanälen gebildet aus niedrigdimensionalenmaterialien und verfahren zum bilden derselben
CN113644112B (zh) * 2020-05-11 2022-07-15 北京华碳元芯电子科技有限责任公司 晶体管及制作方法
JPWO2022039148A1 (de) * 2020-08-17 2022-02-24
WO2023097120A1 (en) * 2021-11-29 2023-06-01 Duke University Metallic single-walled carbon nanotube hybrid assemblies and superstructures

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137806B (en) * 1983-04-05 1986-10-08 Standard Telephones Cables Ltd Ion implantation in semiconductor bodies
CA1308496C (en) * 1988-02-18 1992-10-06 Rajiv V. Joshi Deposition of tungsten on silicon in a non-self-limiting cvd process
JPH02206130A (ja) * 1989-02-06 1990-08-15 Nec Corp Mos型電界効果トランジスタの製造方法
JP2717234B2 (ja) * 1991-05-11 1998-02-18 株式会社 半導体エネルギー研究所 絶縁ゲイト型電界効果半導体装置およびその作製方法
JP3403231B2 (ja) * 1993-05-12 2003-05-06 三菱電機株式会社 半導体装置およびその製造方法
JP3460863B2 (ja) * 1993-09-17 2003-10-27 三菱電機株式会社 半導体装置の製造方法
JP3393237B2 (ja) * 1994-10-04 2003-04-07 ソニー株式会社 半導体装置の製造方法
US6025635A (en) 1997-07-09 2000-02-15 Advanced Micro Devices, Inc. Short channel transistor having resistive gate extensions
CA2347365A1 (en) * 1998-10-23 2000-05-04 Merck Frosst Canada & Co. Combination product comprising an e-type prostaglandin ligand and a cox-2 selective inhibitor and methods of use
US6022771A (en) * 1999-01-25 2000-02-08 International Business Machines Corporation Fabrication of semiconductor device having shallow junctions and sidewall spacers creating taper-shaped isolation where the source and drain regions meet the gate regions
EP1159761B1 (de) * 1999-02-22 2010-04-21 Joseph E. Clawson, Jr. Elektronisches bauteil auf basis von nanostrukturen
JP2000275678A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Ind Co Ltd 薄膜半導体装置およびその製造方法
SE517833C2 (sv) 1999-11-26 2002-07-23 Ericsson Telefon Ab L M Metod vid tillverkning av en bipolär kiseltransistor för att bilda basområden och öppna ett emitterfönster samt bipolär kiseltransistor tillverkad enligt metoden
US7335603B2 (en) 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US6407435B1 (en) 2000-02-11 2002-06-18 Sharp Laboratories Of America, Inc. Multilayer dielectric stack and method
KR100360476B1 (ko) 2000-06-27 2002-11-08 삼성전자 주식회사 탄소나노튜브를 이용한 나노 크기 수직 트랜지스터 및 그제조방법
KR100327496B1 (ko) * 2000-06-27 2002-03-15 윤종용 탄소나노튜브를 이용한 나노 크기 수직 트랜지스터 및 그제조방법
WO2002003482A1 (de) * 2000-07-04 2002-01-10 Infineon Technologies Ag Feldeffekttransistor
GB2364933B (en) * 2000-07-18 2002-12-31 Lg Electronics Inc Method of horizontally growing carbon nanotubes
KR100350794B1 (ko) * 2000-11-20 2002-09-05 엘지전자 주식회사 탄소나노튜브를 이용한 스핀 밸브 단전자 트랜지스터
DE10036897C1 (de) * 2000-07-28 2002-01-03 Infineon Technologies Ag Feldeffekttransistor, Schaltungsanordnung und Verfahren zum Herstellen eines Feldeffekttransistors
US6664143B2 (en) * 2000-11-22 2003-12-16 North Carolina State University Methods of fabricating vertical field effect transistors by conformal channel layer deposition on sidewalls
US6423583B1 (en) * 2001-01-03 2002-07-23 International Business Machines Corporation Methodology for electrically induced selective breakdown of nanotubes
US6524920B1 (en) * 2001-02-09 2003-02-25 Advanced Micro Devices, Inc. Low temperature process for a transistor with elevated source and drain
JP3731486B2 (ja) * 2001-03-16 2006-01-05 富士ゼロックス株式会社 トランジスタ
US7084507B2 (en) * 2001-05-02 2006-08-01 Fujitsu Limited Integrated circuit device and method of producing the same
JP4225716B2 (ja) * 2001-09-11 2009-02-18 富士通株式会社 円筒状多層構造体による半導体装置
JP2004537174A (ja) 2001-07-26 2004-12-09 テクニシェ ユニヴェルシテイト デルフト カーボンナノチューブを利用した電子デバイス
US6515325B1 (en) * 2002-03-06 2003-02-04 Micron Technology, Inc. Nanotube semiconductor devices and methods for making the same
US6891227B2 (en) * 2002-03-20 2005-05-10 International Business Machines Corporation Self-aligned nanotube field effect transistor and method of fabricating same
TWI220269B (en) * 2002-07-31 2004-08-11 Ind Tech Res Inst Method for fabricating n-type carbon nanotube device
US20040144972A1 (en) * 2002-10-04 2004-07-29 Hongjie Dai Carbon nanotube circuits with high-kappa dielectrics
MY134672A (en) 2004-05-20 2007-12-31 Japan Tobacco Inc Stable crystal of 4-oxoquinoline compound

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ATE516600T1 (de) 2011-07-15
CA2695715A1 (en) 2003-10-02
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