ATE532400T1 - Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper - Google Patents
Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörperInfo
- Publication number
- ATE532400T1 ATE532400T1 AT09732751T AT09732751T ATE532400T1 AT E532400 T1 ATE532400 T1 AT E532400T1 AT 09732751 T AT09732751 T AT 09732751T AT 09732751 T AT09732751 T AT 09732751T AT E532400 T1 ATE532400 T1 AT E532400T1
- Authority
- AT
- Austria
- Prior art keywords
- thermally conductive
- heat
- mounting element
- pcb
- circuit board
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08154716 | 2008-04-17 | ||
PCT/IB2009/051521 WO2009128005A1 (en) | 2008-04-17 | 2009-04-10 | Thermally conductive mounting element for attachment of printed circuit board to heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE532400T1 true ATE532400T1 (de) | 2011-11-15 |
Family
ID=40886168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09732751T ATE532400T1 (de) | 2008-04-17 | 2009-04-10 | Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper |
Country Status (10)
Country | Link |
---|---|
US (1) | US8410672B2 (de) |
EP (1) | EP2269429B1 (de) |
JP (1) | JP5283750B2 (de) |
KR (1) | KR20100133491A (de) |
CN (1) | CN102007830B (de) |
AT (1) | ATE532400T1 (de) |
ES (1) | ES2376710T3 (de) |
RU (1) | RU2495507C2 (de) |
TW (1) | TW201008474A (de) |
WO (1) | WO2009128005A1 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009047489B4 (de) * | 2009-12-04 | 2013-07-11 | Osram Gmbh | Leuchtmodul |
WO2012039658A1 (en) * | 2010-09-22 | 2012-03-29 | Enercomp Ab | Led lamp |
US9279543B2 (en) * | 2010-10-08 | 2016-03-08 | Cree, Inc. | LED package mount |
WO2012080916A1 (en) * | 2010-12-15 | 2012-06-21 | Koninklijke Philips Electronics N.V. | An illumination apparatus and a method of assembling the illumination apparatus |
KR20140031204A (ko) | 2011-03-03 | 2014-03-12 | 코닌클리케 필립스 엔.브이. | 스프링-장착 led-홀더를 구비한 발광 장치 |
DE102011051047B4 (de) * | 2011-06-14 | 2015-06-18 | Hella Kgaa Hueck & Co. | Beleuchtungseinrichtung |
US9714762B2 (en) * | 2011-10-02 | 2017-07-25 | Nanker(Guang Zhou)Semiconductor Manufacturing Corp. | LED photo-electric source assembly and LED road lamp |
CN103890487A (zh) * | 2011-10-13 | 2014-06-25 | 欧司朗股份有限公司 | 用于光源的安装装置 |
KR101921127B1 (ko) * | 2012-02-29 | 2018-11-22 | 엘지이노텍 주식회사 | 조명 장치 |
TWM436127U (en) * | 2012-03-14 | 2012-08-21 | Jia-Shing Wong | Fastener structure of light-emitting diode lamp |
DE102012206098A1 (de) * | 2012-04-13 | 2013-10-17 | Trilux Gmbh & Co. Kg | Leuchte mit einem Trägerelement für ein LED-Modul |
CN203243595U (zh) * | 2013-03-07 | 2013-10-16 | 杭州华三通信技术有限公司 | 一种pcb结构 |
US9435527B1 (en) * | 2013-10-04 | 2016-09-06 | Universal Lighting Technologies, Inc. | Thermal venting apparatus and method for LED modules |
US20150201486A1 (en) * | 2014-01-16 | 2015-07-16 | Whelen Engineering Company, Inc. | Stacked Heatsink Assembly |
EP2918906B1 (de) * | 2014-03-12 | 2019-02-13 | TE Connectivity Nederland B.V. | Buchsenanordnung und -klemme für eine Klemmenanordnung |
CN103836595A (zh) * | 2014-03-25 | 2014-06-04 | 重庆大学 | 热沉胀接结构总成 |
USD744155S1 (en) * | 2014-05-28 | 2015-11-24 | Osram Sylvania Inc. | Lens |
RU2570652C1 (ru) * | 2014-07-15 | 2015-12-10 | Владимир Вячеславович Павлов | Интегрированный блок для светодиодного светильника и способ его изготовления |
WO2016048298A1 (en) * | 2014-09-24 | 2016-03-31 | Hewlett Packard Enterprise Development Lp | Heat sink with a load spreading bar |
CN104363737B (zh) * | 2014-10-11 | 2017-09-12 | 东莞市柏尔电子科技有限公司 | 一种新型散热可控硅动补调节器 |
US9605821B2 (en) | 2014-11-19 | 2017-03-28 | GE Lighting Solutions, LLC | Outdoor LED luminaire with plastic housing |
DE202014106099U1 (de) * | 2014-12-17 | 2016-03-18 | Zumtobel Lighting Gmbh | Leuchtmittelträger für eine Lichtbandleuchte |
US10605052B2 (en) | 2015-11-19 | 2020-03-31 | Halliburton Energy Services, Inc. | Thermal management system for downhole tools |
CN109923346B (zh) * | 2016-08-19 | 2020-08-04 | F·詹斯·范伦斯堡 | 散热器 |
CN107507813A (zh) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | 散热片、芯片及电路板 |
US10638647B1 (en) * | 2017-12-30 | 2020-04-28 | Xeleum Lighting | Attaching printed circuit board to heat exchanger |
US10383252B2 (en) * | 2018-01-11 | 2019-08-13 | Comptake Technology Inc. | Solid state disk module and heat sink device thereof |
US10561045B2 (en) | 2018-03-19 | 2020-02-11 | Dolby Laboratories Licensing Corporation | Surface mount heatsink attachment |
CN112787118A (zh) * | 2019-11-08 | 2021-05-11 | 泰科电子(上海)有限公司 | 背板组件和电子装置 |
CN113314481B (zh) * | 2020-02-27 | 2023-01-24 | 光宝电子(广州)有限公司 | 晶体管散热模块及其组装方法 |
RU198573U1 (ru) * | 2020-03-05 | 2020-07-16 | Общество с ограниченной ответственностью "ДОНЭЛЕКТРОИНТЕЛ" | Печатная плата с радиатором охлаждения |
WO2021177863A2 (ru) * | 2020-03-05 | 2021-09-10 | Общество с ограниченной ответственностью "ДОНЭЛЕКТРОИНТЕЛ" | Печатная плата с радиатором охлаждения |
RU205641U1 (ru) * | 2021-03-16 | 2021-07-26 | Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации | Устройство охлаждения |
WO2024061677A1 (en) * | 2022-09-22 | 2024-03-28 | Signify Holding B.V. | Pcb clip |
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US5032898A (en) | 1979-12-10 | 1991-07-16 | Amp Incorporated | Electro-optic device assembly having integral heat sink/retention means |
US4878108A (en) | 1987-06-15 | 1989-10-31 | International Business Machines Corporation | Heat dissipation package for integrated circuits |
DE3733905C1 (en) * | 1987-10-07 | 1989-02-09 | Harrier Inc | Treatment luminaire emitting linearly polarised light |
SU1621192A1 (ru) * | 1988-05-04 | 1991-01-15 | Предприятие П/Я В-8751 | Термокомпенсированна теплопроводна многослойна плата и способ ее изготовлени |
JP2689550B2 (ja) * | 1988-12-21 | 1997-12-10 | 日本電気株式会社 | 通信機ケースの放熱構造 |
US5079567A (en) | 1991-03-04 | 1992-01-07 | Eastman Kodak Company | Leaf-spring assembly for LED printhead |
FR2686765B1 (fr) | 1992-01-28 | 1994-03-18 | Alcatel Converters | Dispositif de fixation, notamment pour la fixation d'un composant electronique sur une paroi d'un dissipateur thermique . |
US5323295A (en) * | 1992-07-21 | 1994-06-21 | P & P Marketing, Inc. | Assembly for integrating heat generating electronic device with nonheat generating devices |
EP0619605B1 (de) | 1993-04-05 | 1996-08-28 | STMicroelectronics S.r.l. | Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke |
JPH07326692A (ja) * | 1994-05-31 | 1995-12-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | ベヤーチップic用ソケット |
US5870285A (en) * | 1996-10-25 | 1999-02-09 | International Business Machines Corporation | Assembly mounting techniques for heat sinks in electronic packaging |
RU2177678C2 (ru) * | 1997-12-18 | 2001-12-27 | Грузных Сергей Иванович | Бесконтактный пускатель |
US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
JP2003110076A (ja) * | 2001-10-01 | 2003-04-11 | Fujitsu Ltd | 熱拡散器および放熱器 |
JP2004172459A (ja) * | 2002-11-21 | 2004-06-17 | Advics:Kk | 電子制御装置における電子部品の放熱構造 |
JP2005331945A (ja) * | 2004-05-18 | 2005-12-02 | Samsung Sdi Co Ltd | プラズマ表示装置 |
US7170751B2 (en) | 2005-01-05 | 2007-01-30 | Gelcore Llc | Printed circuit board retaining device |
US7502229B2 (en) * | 2004-10-15 | 2009-03-10 | Alcatel Lucent | Heat dissipation system for multiple integrated circuits mounted on a printed circuit board |
US7677763B2 (en) | 2004-10-20 | 2010-03-16 | Timothy Chan | Method and system for attachment of light emitting diodes to circuitry for use in lighting |
TWI255377B (en) | 2004-11-05 | 2006-05-21 | Au Optronics Corp | Backlight module |
JP2006140291A (ja) * | 2004-11-11 | 2006-06-01 | Fujitsu Ltd | プリント板ユニット、通信装置及びプリント板 |
DE102005002812B4 (de) | 2005-01-20 | 2013-07-18 | Infineon Technologies Ag | Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren |
EP1897146A2 (de) * | 2005-06-27 | 2008-03-12 | Lamina Lighting, Inc. | Lichtemissionsdiodenpackung und herstellungsverfahren dafür |
WO2007058438A1 (en) | 2005-11-18 | 2007-05-24 | Amosense Co., Ltd. | Electronic parts packages |
US20070235739A1 (en) | 2006-03-31 | 2007-10-11 | Edison Opto Corporation | Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same |
WO2007129231A1 (en) | 2006-05-08 | 2007-11-15 | Koninklijke Philips Electronics, N.V. | Thermal surface mounting of multiple leds onto a heatsink |
-
2009
- 2009-04-10 ES ES09732751T patent/ES2376710T3/es active Active
- 2009-04-10 CN CN200980113334.7A patent/CN102007830B/zh not_active Expired - Fee Related
- 2009-04-10 WO PCT/IB2009/051521 patent/WO2009128005A1/en active Application Filing
- 2009-04-10 US US12/936,547 patent/US8410672B2/en not_active Expired - Fee Related
- 2009-04-10 AT AT09732751T patent/ATE532400T1/de active
- 2009-04-10 EP EP09732751A patent/EP2269429B1/de not_active Not-in-force
- 2009-04-10 JP JP2011504585A patent/JP5283750B2/ja not_active Expired - Fee Related
- 2009-04-10 KR KR1020107025730A patent/KR20100133491A/ko not_active Application Discontinuation
- 2009-04-10 RU RU2010146650/07A patent/RU2495507C2/ru not_active IP Right Cessation
- 2009-04-15 TW TW098112511A patent/TW201008474A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20110031864A1 (en) | 2011-02-10 |
JP2011518436A (ja) | 2011-06-23 |
EP2269429B1 (de) | 2011-11-02 |
ES2376710T3 (es) | 2012-03-16 |
CN102007830B (zh) | 2014-07-09 |
RU2010146650A (ru) | 2012-05-27 |
RU2495507C2 (ru) | 2013-10-10 |
TW201008474A (en) | 2010-02-16 |
WO2009128005A1 (en) | 2009-10-22 |
JP5283750B2 (ja) | 2013-09-04 |
CN102007830A (zh) | 2011-04-06 |
US8410672B2 (en) | 2013-04-02 |
EP2269429A1 (de) | 2011-01-05 |
KR20100133491A (ko) | 2010-12-21 |
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