ATE518968T1 - Kupferlegierungsplatte für elektrische und elektronische bauteile - Google Patents

Kupferlegierungsplatte für elektrische und elektronische bauteile

Info

Publication number
ATE518968T1
ATE518968T1 AT07807885T AT07807885T ATE518968T1 AT E518968 T1 ATE518968 T1 AT E518968T1 AT 07807885 T AT07807885 T AT 07807885T AT 07807885 T AT07807885 T AT 07807885T AT E518968 T1 ATE518968 T1 AT E518968T1
Authority
AT
Austria
Prior art keywords
copper alloy
electrical
electronic components
alloy plate
mass
Prior art date
Application number
AT07807885T
Other languages
English (en)
Inventor
Yasuhiro Aruga
Ryoichi Ozaki
Yosuke Miwa
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006270918A external-priority patent/JP4157898B2/ja
Priority claimed from JP2006274309A external-priority patent/JP4197717B2/ja
Priority claimed from JP2006311899A external-priority patent/JP4157899B2/ja
Priority claimed from JP2006311900A external-priority patent/JP4197718B2/ja
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Application granted granted Critical
Publication of ATE518968T1 publication Critical patent/ATE518968T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
AT07807885T 2006-10-02 2007-09-26 Kupferlegierungsplatte für elektrische und elektronische bauteile ATE518968T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006270918A JP4157898B2 (ja) 2006-10-02 2006-10-02 プレス打ち抜き性に優れた電気電子部品用銅合金板
JP2006274309A JP4197717B2 (ja) 2006-10-05 2006-10-05 メッキ性に優れた電気電子部品用銅合金板
JP2006311899A JP4157899B2 (ja) 2006-11-17 2006-11-17 曲げ加工性に優れた高強度銅合金板
JP2006311900A JP4197718B2 (ja) 2006-11-17 2006-11-17 酸化膜密着性に優れた高強度銅合金板
PCT/JP2007/068670 WO2008041584A1 (fr) 2006-10-02 2007-09-26 Plaque en alliage de cuivre pour composants électriques et électroniques

Publications (1)

Publication Number Publication Date
ATE518968T1 true ATE518968T1 (de) 2011-08-15

Family

ID=39268446

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07807885T ATE518968T1 (de) 2006-10-02 2007-09-26 Kupferlegierungsplatte für elektrische und elektronische bauteile

Country Status (5)

Country Link
US (4) US8063471B2 (de)
EP (4) EP2388349B1 (de)
KR (2) KR101158113B1 (de)
AT (1) ATE518968T1 (de)
WO (1) WO2008041584A1 (de)

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EP1803829B1 (de) 2004-08-17 2013-05-22 Kabushiki Kaisha Kobe Seiko Sho Kupferlegierungsplatte für elektro- und elektronikteile mit biegsamkeit
CN101899587B (zh) 2006-07-21 2012-07-04 株式会社神户制钢所 电气电子零件用铜合金板
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JP2009179864A (ja) * 2008-01-31 2009-08-13 Kobe Steel Ltd 耐応力緩和特性に優れた銅合金板
CN101932741B (zh) 2008-02-26 2012-10-24 三菱伸铜株式会社 高强度高导电铜棒线材
US7928541B2 (en) * 2008-03-07 2011-04-19 Kobe Steel, Ltd. Copper alloy sheet and QFN package
KR101174596B1 (ko) 2009-01-09 2012-08-16 미쓰비시 신도 가부시키가이샤 고강도 고도전 구리합금 압연판 및 그 제조방법
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EP2907884B1 (de) * 2012-10-11 2018-05-09 UACJ Corporation Plattenförmiger leiter für sammelschiene und sammelschiene damit
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JP6396067B2 (ja) 2014-04-10 2018-09-26 株式会社Uacj バスバー用アルミニウム合金板及びその製造方法
JP6354275B2 (ja) 2014-04-14 2018-07-11 株式会社オートネットワーク技術研究所 銅合金素線、銅合金撚線および自動車用電線
RU2587112C9 (ru) * 2014-09-22 2016-08-10 Дмитрий Андреевич Михайлов МЕДНЫЙ СПЛАВ, ЛЕГИРОВАННЫЙ ТЕЛЛУРОМ ТелТ, ДЛЯ КОЛЛЕКТОРОВ ЭЛЕКТРИЧЕСКИХ МАШИН
CN113025842B (zh) * 2015-03-18 2023-02-17 美题隆公司 磁性铜合金
EP3518254B1 (de) * 2016-09-20 2023-02-15 Furukawa Electric Co. Ltd. Flachkabel, flachkabelherstellungsverfahren und mit dem flachkabel ausgestattete drehverbindervorrichtung
JP6172368B1 (ja) * 2016-11-07 2017-08-02 住友電気工業株式会社 被覆電線、端子付き電線、銅合金線、及び銅合金撚線
JP6382479B1 (ja) * 2017-02-17 2018-08-29 古河電気工業株式会社 抵抗材用銅合金材料及びその製造方法並びに抵抗器
CN109055808A (zh) * 2018-10-26 2018-12-21 浙江星康铜业有限公司 一种铜锌合金
KR20200070691A (ko) * 2018-12-10 2020-06-18 현대자동차주식회사 자동차용 알루미늄 외장 부품의 표면 처리 방법
CN109825739A (zh) * 2019-03-29 2019-05-31 安徽众源新材料股份有限公司 一种保险丝帽用铜合金以及生产工艺
DE102021106875B4 (de) 2021-03-19 2023-09-28 Mundorf Eb Gmbh Kupfer-Silber-Gold-Legierung

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CN101899587B (zh) * 2006-07-21 2012-07-04 株式会社神户制钢所 电气电子零件用铜合金板
JP4950584B2 (ja) * 2006-07-28 2012-06-13 株式会社神戸製鋼所 高強度および耐熱性を備えた銅合金
KR101158113B1 (ko) * 2006-10-02 2012-06-19 가부시키가이샤 고베 세이코쇼 전기 전자 부품용 동 합금판
US7928541B2 (en) * 2008-03-07 2011-04-19 Kobe Steel, Ltd. Copper alloy sheet and QFN package

Also Published As

Publication number Publication date
KR101158113B1 (ko) 2012-06-19
US20120039742A1 (en) 2012-02-16
EP2388348A1 (de) 2011-11-23
EP2388348B1 (de) 2013-07-31
US8063471B2 (en) 2011-11-22
US20120039743A1 (en) 2012-02-16
EP2088214A4 (de) 2009-09-30
KR20120041808A (ko) 2012-05-02
US20120039741A1 (en) 2012-02-16
WO2008041584A1 (fr) 2008-04-10
EP2388347A1 (de) 2011-11-23
US20100072584A1 (en) 2010-03-25
EP2388349B1 (de) 2013-07-31
EP2388349A1 (de) 2011-11-23
EP2388347B1 (de) 2014-04-16
EP2088214B1 (de) 2011-08-03
EP2088214A1 (de) 2009-08-12
KR20090050096A (ko) 2009-05-19

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